https://digitalcommons.unl.edu/cgi/viewcontent.cgi?article=1131&context=usdoepub

A review of polymer electrolyte membrane fuel cells: Technology, applications,and needs on fundamental research

Although current high-energy-density lithium-ion batteries (LIBs) have taken over the commercial rechargeable battery market, increasing concerns about limited lithium resources, high cost, and insecurity of organic electrolyte scale-up limit their further development. Rechargeable aqueous zinc-ion batteries (ZIBs), an alternative battery chemistry, have paved the way not only for realizing environmentally benign and safe energy storage devices but also for reducing the manufacturing costs of next-generation batteries. This Review underscores recent advances in aqueous ZIBs; these include the design of a highly reversible Zn anode, optimization of the electrolyte, and a wide range of cathode materials and their energy storage mechanisms. We also present recent advanced techniques that aim at overcoming the current issues in aqueous ZIB systems. This Review on the future perspectives and research directions will provide a guide for future aqueous ZIB study.

Recent Advances in Aqueous Zinc-Ion Batteries

Power consumption is forecast by the International Technology Roadmap of Semiconductors (ITRS) to pose long-term technical challenges for the semiconductor industry. The purpose of this paper is threefold: (1) to provide an overview of strategies for powering MEMS via non-regenerative and regenerative power supplies; (2) to review the fundamentals of piezoelectric energy harvesting, along with recent advancements, and (3) to discuss future trends and applications for piezoelectric energy harvesting technology. The paper concludes with a discussion of research needs that are critical for the enhancement of piezoelectric energy harvesting devices.

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Powering MEMS portable devices—a review of non-regenerative and regenerative power supply systems with special emphasis on piezoelectric energy harvesting systems

With a worldwide trend towards the efficient use of renewable energies and the rapid expansion of the electric vehicle market, the importance of rechargeable battery technologies, particularly lithium-ion batteries, has steadily increased. In the past few years, a major breakthrough in electrolyte materials was achieved by simply increasing the salt concentration in suitable salt–solvent combinations, offering technical superiority in numerous figures of merit over alternative materials. This long-awaited, extremely simple yet effective strategy can overcome most of the remaining hurdles limiting the present lithium-ion batteries without sacrificing manufacturing efficiency, and hence its impact is now widely felt in the scientific community, with serious potential for industrial development. This Review aims to provide timely and objective information that will be valuable for designing better realistic batteries, including a multi-angle analysis of their advantages and disadvantages together with future perspectives. Emphasis is placed on the pathways to address the remaining technical and scientific issues rather than re-highlighting the many technical advantages. New electrolyte materials can offer breakthroughs in the development of next-generation batteries. Here Atsuo Yamada and colleagues review the progress made and the road ahead for salt-concentrated electrolytes, an emerging and promising electrolyte candidate.

Advances and issues in developing salt-concentrated battery electrolytes

The push towards miniaturized electronics calls for the development of miniaturized energy-storage components that can enable sustained, autonomous operation of electronic devices for applications such as wearable gadgets and wireless sensor networks. Microsupercapacitors have been targeted as a viable route for this purpose, because, though storing less energy than microbatteries, they can be charged and discharged much more rapidly and have an almost unlimited lifetime. In this Review, we discuss the progress and the prospects of integrated miniaturized supercapacitors. In particular, we discuss their power performances and emphasize the need of a three-dimensional design to boost their energy-storage capacity. This is obtainable, for example, through self-supported nanostructured electrodes. We also critically evaluate the performance metrics currently used in the literature to characterize microsupercapacitors and offer general guidelines to benchmark performances towards prospective applications.

Microsupercapacitors as miniaturized energy-storage components for on-chip electronics

The invention relates to a battery comprising an electrically non-conductive substrate (1) on which it is arranged, in addition to at least one cathode (4), one anode (6), and a separator/electrolyte layer (5) in the form of layers or films that are pre-formed from an electrochemically active or activatable material and optionally a polymer matrix and/or other auxiliary substances, in a corresponding sequence on the substrate (1) The layer thickness of each electrode layer is 10 µm The inventive battery also comprises at least one current diverter (7) and at least one battery contact (2, 2a, 2b) that are respectively in electrical contact with an electrode Said battery is characterised in that it comprises at least one first covering layer (8, 16, 17, 21) consisting of a first, electrically insulating material that is stable in relation to the used electrolyte and electrode material and has been deposited from the gas phase or in the form of a liquid or viscous paste Said covering layer forms an encapsulation element with the substrate and optionally at least one other component, by which means the battery is sealed from the surrounding environment, and is provided with at least one recess (11, 18, 19) that is closed by an electroconductive material and is connected to at least one current diverter (7) of the battery The invention also relates to a plurality of such batteries on the same substrate, and to methods for producing the cited batteries using wafer-level techniques

Battery, especially a microbattery, and the production thereof using wafer-level technology

Ultrashort-pulse laser structured titanium surfaces with sputter-coated platinum catalyst as hydrogen evolution electrodes for alkaline water electrolysis

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Simultaneous X‐Ray Diffraction and Tomography Operando Investigation of Aluminum/Graphite Batteries

This paper describes a novel packaging technology for high power multi chip modules (MCMs). The work covers three areas: The fabrication of a multichip module which provides access to the die backside for heat removal, the development of high performance microchannel heat sinks with a CTE matched to the MCM-substrate as well as a low thermal resistivity assembling technology of the two components. The MCM is fabricated by means of the planar embedding technology. By planarizing the module backside a low thermal resistance between heat sink and dice can be accomplished simultaneously for all embedded components. While offering the same high interconnection density and the high speed performance benefit of flip chip and providing high reliability and very small size of the overall package, this alternative technology promises to eliminate crucial problems associated with backside cooling of flip chip devices.

High power multichip modules employing the planar embedding technique and microchannel water heat sinks

With the current trend to ever faster clock rates the propagation delays between the chips constitute a significant portion of the clock cycle. Mounting both active and passive devices as closely together as possible will therefore boost system's performance. Although flip-chipped devices have good performance, design constraints may prevent the placement of pads to comply with flip chip design rules. An additional advantage of the embedding technology is the possibility to employ 3-D stacking, the highest package density. Bare dice and standard passive components were embedded into a ceramic substrate to achieve a common, planar surface. Hence by employing thin-film processing all components can be directly interconnected to the copper routing of the module. Benzocylobutene (BCB) with its low curing temperature is preferred as dielectrical polymer for the embedding technology. Application of bonding or soldering techniques which might limit the reliability is avoided. This offers excellent electrical properties of the wiring system. By planarizing the reverse side of the MCM a low thermal resistance between heat sink and dice can be accomplished simultaneously for all embedded components. An SRAM MCM and a Thermotest MCM demonstrate the facibility of the embedding technology.

Robert Hahn

Papers

Battery, especially a microbattery, and the production thereof using wafer-level technology

Ultrashort-pulse laser structured titanium surfaces with sputter-coated platinum catalyst as hydrogen evolution electrodes for alkaline water electrolysis

Simultaneous X‐Ray Diffraction and Tomography Operando Investigation of Aluminum/Graphite Batteries

High power multichip modules employing the planar embedding technique and microchannel water heat sinks

Embedding technology-a chip-first approach using BCB