A method of manufacturing a thin film magnetic head includes forming a recording gap layer of a non-alumina base nonmagnetic material on a lower magnetic pole layer, the lower magnetic pole layer being composed of materials that are milled at the same rate. An upper magnetic pole layer is formed on the recording gap layer, and a single piece of equipment is used to trim the lower magnetic pole layer and pattern the recording magnetic gap layer such that the lower magnetic pole layer has a width that is substantially the same as that of the upper magnetic pole layer. The recording gap layer and the upper and lower half-gap layers are then removed over a region of the underlying substrate. Prescribed areas of tan air-bearing surface (ABS) are then etched to form a slider shape having a protruding part and a depressed part, the ABS and the side surface having a common edge such that the depressed part along the common edge extends into, but not beyond, the region.

Method of manufacturing a magnetic head device

One embodiment of the invention provides a fully distributed, scaleable and modular rack architecture and management system. One feature of the invention provides device management throughout the rack system with a vertical interface column integrated into the rack cabinet. Within each rack unit (U) of the vertical interface column, the vertical interface column may deliver connectivity to a device housed within the rack cabinet thereby eliminating runs of cable typically necessary for management of such devices. The vertical interface column can be expanded as necessary to provide connectivity to more devices using hot-swappable interface modules. A rack management system allows both local and remote management access to all devices mounted in the rack cabinet and coupled to the vertical interface column. The rack management system may also access to devices mounted in other rack cabinets.

Rack architecture and management system

A lapping method and device for lapping magnetic heads to provide an air bearing surface with improved surface quality including increased smoothness, reduced rolloff, and reduced recession. The lapping machine includes a lapping plate having a grinding surface, a linear motion mechanism for moving the ABS over the grinding surface in a first, linear direction, and a micro-advance mechanism for controllably advancing the workpiece over the grinding surface in a second direction that is preferably perpendicular. The lapping method comprises affixing the unfinished magnetic head proximate to the lapping plate and depositing an abrasive slurry on the grinding surface. An initial rough lapping stage is performed, including moving the grinding surface so that the workpiece is lapped to a first predetermined target specification. After washing, a conductive lubricant material is applied to the grinding surface, other lapping steps may be performed, and then a micro-advanced lapping stage is performed, including micro-advancing the magnetic head in the second direction while simultaneously linear lapping it in the first direction to provide a highly polished ABS.

Lapping process using micro-advancement for optimizing flatness of a magnetic head air bearing surface

A row of disk drive slider blanks with magneto-resistive read sensors are lapped after being mounted on the flat surface of a row carrier used to mount the row assembly on a row bending tool. Residual stresses present in the row due to wafer processing are relieved by removing the kerf areas between the slider blanks prior to lapping to prevent the stresses from causing inaccuracies in the lapping process. The stability of sliders below 30% can be enhanced by using wafers thicker than is required and then slicing the extra material from the row of slider blanks after it has been bonded to the row carrier either before or after the lapping process.

Row carrier for precision lapping of disk drive heads and for handling of heads during the slider fab operation

A method of fabrication of a slider includes forming a first ferromagnetic layer, a second ferromagnetic layer, and an antiferromagnetic layer and applying a layer of protective material to proximal ends of those layers that are proximal to the disk surface The method further includes recessing a proximal end of a non-magnetic metal layer formed on the first ferromagnetic layer from the disk surface to form at least one recessed area The method also includes filling the recessed area with protective material to a depth such that when the layer of protective material is worn from the ends of the first ferromagnetic layer, the second ferromagnetic layer, and the antiferromagnetic layer by burnishing of the ends by the disk surface, protective material still remains in the recessed area of the non-magnetic metal layer

Process of making a non-corrosive GMR slider for proximity recording

A method of lapping the air bearing surface of a magnetoresistive head which minimizes the likelihood of interelement shorts at the air bearing surface is described. In a final, linear lapping phase, the air bearing surface is lapped back and forth parallel to the longitudinal axis of the head elements in an oscillatory path across a stationary lapping surface. Any scratches or smears of the elements will be along the length of the elements rather than transverse to the elements. Any transverse scratches or smears occurring in earlier lapping phases will be removed during the linear lapping phase.

Lapping process for minimizing shorts and element recession at magnetic head air bearing surface

A method and system is disclosed for lapping row edges of a substrate work piece with a flat lapping element. The substrate work piece comprises a section of wafer having parallel aligned multiple row edges to be individually lapped. The wafer has different bow characteristics imparted to different substrate work piece. The bow characteristic of the substrate work piece to be lapped is determined, load points are selected on the work piece which will counteract the bow characteristic, and a pusher with push pads located at the selected load points pushes the work piece at those load points so that the pushing flexes the substrate work piece to counteract the bow characteristic to lap the row edge. Upon completion of the lapping step, the row having the lapped row edge is sliced from the work piece to form a new row edge parallel to the lapped row edge, and, repeating the lapping process, the work piece is pushed by the push pads at the same selected load points, whereby, as the substrate is shortened, making said bow characteristic more pronounced, the pushing at the selected load points provides greater flex of the work piece to counteract the more pronounced bow.

Robert Owen Barr

Papers

Lapping process for minimizing shorts and element recession at magnetic head air bearing surface

Lapping method and system for compensating for substrate bow