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Robert W. Kay

Researcher at University of Leeds

Publications -  73
Citations -  1436

Robert W. Kay is an academic researcher from University of Leeds. The author has contributed to research in topics: Stencil printing & Stencil. The author has an hindex of 15, co-authored 73 publications receiving 1029 citations. Previous affiliations of Robert W. Kay include University of Greenwich & Heriot-Watt University.

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Nanosecond laser textured superhydrophobic metallic surfaces and their chemical sensing applications

TL;DR: In this article, the authors demonstrate superhydrophobic behavior on nanosecond laser patterned copper and brass surfaces and demonstrate that the superhydrobobic surfaces have the self-cleaning ability and have potential for chemical sensing applications.
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A review of aerosol jet printing—a non-traditional hybrid process for micro-manufacturing

TL;DR: An overview of the underlying principles of AJP are summarized, applications of the technology are reviewed, and where gains may be realised are hypothesised through this assistive manufacturing process.
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Laser textured superhydrophobic surfaces and their applications for homogeneous spot deposition

TL;DR: In this paper, the laser surface modification of 304S15 stainless steel to develop superhydrophobic properties and the subsequent application for homogeneous spot deposition was reported, with steady contact angle of ∼154° and contact angle hysteresis of ∼4°.
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Laser textured surface gradients

TL;DR: In this article, surface roughness gradients on brass sheets are obtained directly by nanosecond laser texturing and their wettability decreases with time (up to 20 days) achieving both spatial and temporal Wettability gradients.
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Multifunctional metal matrix composites with embedded printed electrical materials fabricated by Ultrasonic Additive Manufacturing

TL;DR: In this paper, a surface flattening process was developed to eliminate the risk of short circuiting between the metal matrices and printed conductors, and simultaneously reduce the total thickness of the printed circuitry.