R
Roy Dale Hollaway
Researcher at Amkor Technology
Publications - 53
Citations - 2324
Roy Dale Hollaway is an academic researcher from Amkor Technology. The author has contributed to research in topics: Substrate (printing) & Image sensor. The author has an hindex of 28, co-authored 53 publications receiving 2324 citations.
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Patent
Near chip size integrated circuit package
TL;DR: In this paper, a plurality of integrated circuit chip (IC chip) packages are fabricated simultaneously from a single insulating substrate having sections, and an IC chip is attached to the IC chip in each section.
Patent
Method of making near chip size integrated circuit package
TL;DR: In this paper, a plurality of integrated circuit chip (IC chip) packages are fabricated simultaneously from a single insulating substrate having sections, and an IC chip is attached to the IC chip in each section.
Patent
Mounting for a package containing a chip
TL;DR: In this paper, a mounting for a package containing a semiconductor chip is described, along with methods of making such a mounting, and the package is mounted on the substrate so that the cap is in the aperture, and a peripheral portion of the first side of the base is over the mounting surface so as to support the package in an aperture and allow the input/output terminals of the package to be juxtaposed with to the circuit patterns of the substrate.
Patent
Flip chip image sensor package fabrication method
TL;DR: In this paper, a flip-chip image sensor package is fabricated by forming an aperture in a substrate and mounting an image sensor to the substrate, such that an active area of the image sensor is aligned with the aperture.
Patent
Optical module with lens integral holder
TL;DR: In this article, a locking feature was used to minimize the overall width of the optical module and maximize the strength of the bond between the lens housing and the substrate, which is formed with a locking surface.