The remarkable growth of wireless data traffic in recent times has driven the need to explore suitable regions in the radio spectrum to meet the projected requirements. In pursuance of this, millimeter wave communications have received considerable attention in the research fraternity. Due to the high path and penetration losses at millimeter wavelengths, antenna beamforming assumes a pivotal role in establishing and maintaining a robust communication link. Beamforming for millimeter wave communications poses a multitude of diverse challenges due to the large channel bandwidth, unique channel characteristics, and hardware constraints. In this paper, we track the evolution and advancements in antenna beamforming for millimeter wave communications in the context of the distinct requirements for indoor and outdoor communication scenarios. We expand the scope of discussion by including the developments in radio frequency system design and implementation for millimeter wave beamforming. We explore the suitability of millimeter wave beamforming methods, both, existing and proposed till midyear 2015, and identify the exciting new prospects unfolding in this domain.

Beamforming for Millimeter Wave Communications: An Inclusive Survey

This article discusses the challenges, benefits and approaches associated with realizing largescale antenna arrays at mmWave frequency bands for future 5G cellular devices. Key design considerations are investigated to deduce a novel and practical phased array antenna solution operating at 28 GHz with near spherical coverage. The approach is further evolved into a first-of- a-kind cellular phone prototype equipped with mmWave 5G antenna arrays consisting of a total of 32 low-profile antenna elements. Indoor measurements are carried out using the presented prototype to characterize the proposed mmWave antenna system using 16-QAM modulated signals with 27.925 GHz carrier frequency. The biological implications due to the absorbed electromagnetic waves when using mmWave cellular devices are studied and compared in detail with those of 3/4G cellular devices.

Study and prototyping of practically large-scale mmWave antenna systems for 5G cellular devices

This paper presents the first reported 28-GHz phased-array IC for 5G communications. Implemented in 130-nm SiGe BiCMOS, the IC includes 32 TRX elements and features concurrent independent beams in two polarizations in either TX or RX operation. Circuit techniques to enable precise beam steering, orthogonal phase and amplitude control at each front end, and independent tapering and beam steering at the array level are presented. A TX/RX switch design is introduced which minimizes TX path loss resulting in 13.5 dBm/16 dBm Op1dB/Psat per front end with >20% peak power added efficiency of the power amplifier (including switch and off-mode LNA) while maintaining a 6 dB noise figure in the low noise amplifier (including switch and off-mode PA). Comprehensive on-wafer measurement results for the IC across multiple samples and temperature variation are presented. A package with four ICs and 64 dual-polarized antennas provides eight 16-element or two 64-element concurrent beams with 1.4°/step beam steering (<0.6° rms error) across a ±50° steering range without requiring calibration. A maximum saturated effective isotropic radiated power of 54 dBm is measured in the broadside direction for each polarization. Tapering control without requiring calibration achieves up to 20-dB sidelobe rejection without affecting the main lobe direction.

A 28-GHz 32-Element TRX Phased-Array IC With Concurrent Dual-Polarized Operation and Orthogonal Phase and Gain Control for 5G Communications

Aspects of the subject disclosure may include, for example, receiving, by a feed point of a dielectric antenna, electromagnetic waves from a dielectric core coupled to the feed point without an electrical return path, where at least a portion of the dielectric antenna comprises a conductive surface, directing, by the feed point, the electromagnetic waves to a proximal portion of the dielectric antenna, and radiating, via an aperture of the dielectric antenna, a wireless signal responsive to the electromagnetic waves being received at the aperture. Other embodiments are disclosed.

Method and apparatus for coupling an antenna to a device

A distributed antenna system is provided that frequency shifts the output of one or more microcells to a 60 GHz or higher frequency range for transmission to a set of distributed antennas. The cellular band outputs of these microcell base station devices are used to modulate a 60 GHz (or higher) carrier wave, yielding a group of subcarriers on the 60 GHz carrier wave. This group will then be transmitted in the air via analog microwave RF unit, after which it can be repeated or radiated to the surrounding area. The repeaters amplify the signal and resend it on the air again toward the next repeater. In places where a microcell is required, the 60 GHz signal is shifted in frequency back to its original frequency (e.g., the 1.9 GHz cellular band) and radiated locally to nearby mobile devices.

Remote distributed antenna system

A 60GHz short-range wireless system offers new opportunities for achieving wireless high-definition video links and multi-Gb/s wireless data transfer. Recent works have realized a 60GHz transceiver by means of a cost-effective CMOS process [1-3], but using a 60GHz system in mobile terminals poses the difficult challenge of achieving low power consumption as well as small form factor. The publication [3] achieves a power consumption of less than 756mW, but uses a simple MAC protocol incompatible with global standards and also suffers from a limited distance of less than 4cm. This paper presents a fully integrated transceiver chipset based on WiGig/IEEE802.11ad standards targeting mobile usage. The chipset is developed for a single-carrier (SC) modulation, which is suitable for reduced power consumption as compared to using OFDM modulation. However, the SC modulation is sensitive to in-band amplitude variation, mainly made worse by the gain variation of analog circuits and multipath delay spread. In order to compensate for those gain variations, the proposed chipset employs built-in TX in-band calibration and an RX frequency domain equalizer (FDE). The proposed techniques can relax the requirement for high speed analog circuits, leading to less power consumption while minimizing the increase of hardware size.

A fully integrated 60GHz CMOS transceiver chipset based on WiGig/IEEE802.11ad with built-in self calibration for mobile applications

An array antenna device includes a plurality of slot array antennas which are arranged and each of which includes a plurality of slot antennas and a radiation surface, which is formed to be conformal, and a plurality of waveguides each of which supplies respective power to each of the slot array antennas. After bodies of the waveguides are formed by a resin molding method, surface treatment is performed with respect to inner surfaces of the waveguides with plating.

Array antenna device and radio communication device

An antenna-integrated module includes: one or more semiconductor chips each including a silicon substrate, a metal layer stacked on a first surface of the silicon substrate, and one or more frequency converters; an insulating layer that surrounds the one or more semiconductor chips; a re-distribution layer that is stacked on a first surface of the insulating layer and on a first surface of the metal layer; one or more first antenna elements that are provided on the first surface of the metal layer with a first conductor pattern and that are connected to the one or more frequency converters; and one or more second antenna elements that are provided with a second conductor pattern on a first surface of the re-distribution layer stacked on the first surface of the insulating layer and that are connected to the one or more frequency converters.

Antenna-integrated module and radar device

This semiconductor device, which has electronic components provided in a cavity of a module having a cavity structure, can be prevented from being increased in size. In the device, the module having the cavity structure is provided with a plurality of components, for instance, an IC (3) and chip components (6a, 6b), on one surface facing a motherboard (9), said one surface being on the cavity side. The motherboard (9) is provided with the chip components (6c, 6d) on parts of one surface facing the module having the cavity structure, said parts not having the components provided on the module surface having the components provided thereon.

Semiconductor device and method for manufacturing same

An array antenna device of this disclosure includes a substrate, a strip conductor with a linear-shape, which is provided on the substrate, and a power feeder that feeds power to the strip conductor, and a plurality of loop elements, a conductor plate, and a plurality of feeding elements. The plurality of loop elements are provided on a first surface of the substrate, and are located along the strip conductor with a specified spacing from each other. Each of the plurality of loop elements has a loop-shape with a notch. The plurality of feeding elements are connected to the strip conductor, and each has a shape extending along a portion of an outer edge of corresponding one of the plurality of loop elements. The conductor plate is provided on a second surface of the substrate.

Ryosuke Shiozaki

Papers

A fully integrated 60GHz CMOS transceiver chipset based on WiGig/IEEE802.11ad with built-in self calibration for mobile applications

Array antenna device and radio communication device

Antenna-integrated module and radar device

Semiconductor device and method for manufacturing same

Array antenna device