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S. H. Chen

Researcher at Shandong University

Publications -  12
Citations -  589

S. H. Chen is an academic researcher from Shandong University. The author has contributed to research in topics: Erosion corrosion of copper water tubes & Copper. The author has an hindex of 11, co-authored 12 publications receiving 550 citations.

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Inhibition of copper corrosion by several Schiff bases in aerated halide solutions

TL;DR: In this paper, three kinds of Schiff bases, N,N′-o-phenylen-bis(3-methoxysalicylidenimine) (V−o-PhýV), N, N′-p-phenylonen-, N−n−n −n−p−n, N−p-phýN−n and N−methylen-methylene]-histidine (V-His), were used for copper corrosion in aerated 0.5 mol dm−3 NaCl and Na
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Protection of copper corrosion by carbazole and N-vinylcarbazole self-assembled films in NaCl solution

TL;DR: In this paper, self-assembled films of carbazole (CZ) and N-vinyl carbazoles (NVC) were prepared on copper surfaces and the corrosion protection abilities of the films were evaluated in an air-saturated 0.5 mol dm(-3) NaCl solution using electrochemical impedance spectroscopy (EIS), polarization and cyclic voltammetry.
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Self-Assembled Monolayers of Schiff Bases on Copper Surfaces

TL;DR: Self-assembled monolayers (SAM) of Schiff base N,N′-o-phenylen-bis(3-methoxysalicylaldenimine), designated as Vo-Ph-V, and N-2-hydroxyphenyl-(3mETHoxys alicylidenimine) designated asV-b... as mentioned in this paper.
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Simple method for preparation of cubic Ag nanoparticles and their self-assembled films

TL;DR: In this paper, thiol-derivatised cubic Ag nanoparticles were prepared by adding an AgNO3 solution containing a trace amount of alkanethiol into a solution of NaBH4 and sodium oleate.
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Protection of self-assembled monolayers formed from triethyl phosphate and mixed self-assembled monolayers from triethyl phosphate and cetyltrimethyl ammonium bromide for copper against corrosion

TL;DR: In this paper, self-assembled monolayers (SAMs) of triethyl phosphate (TEP) and the mixed SAMs of TEP with cetyltrimethyl ammonium bromide (CTAB) were prepared on copper surfaces.