The paper examines the status of power electronics technology by looking at eight constituent technologies (power switch technology, passive components, power switching network technology, packaging technology, environmental impact technology, cooling technology, manufacturing technology, and converter control technology). The present trends are then discussed from the point of view of some of these that can be considered internal drivers, as well as from the viewpoint of those that are external drivers. Packaging as a central driver is evaluated and the necessity for a paradigm shift in power electronics technology identified. Future possibilities in terms of electromagnetic integration of passives and of integrated power electronic modules (IPEMs) are discussed.

Power electronics technology at the dawn of the new millenium-status and future

A new technique for the packaging of IGBT modules has been developed. The components are sandwiched between two direct bond copper (DBC) substrates with aluminum nitride. Wire bonds are replaced with flip chip solder bumps, which allows cooling of components on both sides. Microchannel heat sinks are directly integrated in the package to decrease the thermal resistance of the module. Thus, a very compact module with high thermal performance is obtained. A prototype with two insulated gate bipolar transistors (IGBTs) and four diodes associated in parallel was realized and tested. In this paper, the innovative packaging technique is described, and results of thermal tests are presented.

Double-sided cooling for high power IGBT modules using flip chip technology

With increased need for high power density, high efficiency and high temperature capabilities in aerospace and automotive applications, integrated motor drives (IMD) offers a potential solution. However, close physical integration of the converter and the machine may also lead to an increase in components temperature. This requires careful mechanical, structural and thermal analysis; and design of the IMD system. This study reviews existing IMD technologies and their thermal effects on the IMD system. The effects of the power electronics position on the IMD system and its respective thermal management concepts are also investigated. The challenges faced in designing and manufacturing of an IMD along with the mechanical and structural impacts of close physical integration is also discussed and potential solutions are provided. Potential converter topologies for an IMD like the matrix converter, two-level bridge, three-level neutral point clamped and multiphase full bridge converters are also reviewed. Wide band gap devices like silicon carbide and gallium nitride and their packaging in power modules for IMDs are also discussed. Power modules components and packaging technologies are also presented.

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Integrated motor drives: state of the art and future trends

Power electronics building blocks (PEBBs) are envisioned as integrated power modules consisting of power semiconductor devices, power integrated circuits, sensors, and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment. At the Center for Power Electronics Systems, we developed a topology for a basic building block-a two-switch two-diode half-bridge converter in totem-pole configuration with built-in gate-driver and protection circuitry, fiber-optic receiver/transmitter interface, and soft-switching capability. Based on the topology, a series of prototype modules, with 600 V, 3.3 kW rating, were fabricated using an innovative packaging technique developed for the program-metal posts interconnected parallel plate structure (MPIPPS). This new packaging technique uses direct attachment of bulk copper, not wire-bonding of fine aluminum wires, for interconnecting power devices. Electrical performance data of the packaged devices show that an air-cooled 15 kW inverter, operating from 400 V dc bus with 20 kHz switching frequency can be constructed by integrating three prototype modules, which is almost double what could be achieved with commercially packaged devices of the same rating.

An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures

Demands for increasing power density and levels of functional integration in switch-mode power converters require power electronics manufacturers to develop innovative packaging solutions for power semiconductor devices and modules. Three-dimensional (3-D) packaging techniques offer the potential of lower resistance, higher current handling capability, smaller volume, better thermal management capability, and high reliability. In this paper, we present the constructions and some electrical and thermomechanical analyses of four 3-D packaging approaches that have been developed within the Center for Power Electronics Systems-an NSF Engineering Research Center.

Three-dimensional packaging for power semiconductor devices and modules

Power Electronics Building Blocks (PEBBs) are envisioned as integrated power modules consisting of power semiconductor devices, power integrated circuits, sensors, and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment. At Virginia Power Electronics Center (VPEC), we developed a topology for a basic building block-a two-switch two-diode half-bridge converter in totem-pole configuration with built-in gate-driver and protection circuitry, fiber-optic receiver/transmitter interface, and soft-switching capability. Based on the topology, a series of prototype modules, with 600 V, 3.3 kW rating, were fabricated using an innovative packaging technique developed for the program-metal posts interconnected parallel plate structure (MPIPPS). This new packaging technique uses direct attachment of bulk copper, not wire-bonding of fine aluminum wires, for interconnecting power devices. Electrical performance data of the packaged devices show that an air-cooled 15 kW inverter, operating from 400 V dc bus with 20 kHz switching frequency can be constructed by integrating three prototype modules, which is almost double of what could not be achieved with commercially packaged devices of the same rating.

We have developed a low-cost approach, termed metal posts interconnected parallel plate structure (MPIPPS), for packaging high-performance power electronics building block (PEBB) modules. PEBBs are integrated power modules consisting of power semiconductor devices, power integrated circuits, sensors and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment. This new packaging concept is based on the use of direct-bonding of copper posts, rather than wire-bonding of fine aluminium wires, to interconnect power devices. The approach requires less expensive equipment and has the potential to produce modules with superior electrical, thermal, and mechanical performance. We have demonstrated the feasibility of this approach by constructing PEBB modules consisting of two IGBTs, two power diodes, gate resistors, varistors, and a capacitor. The MPIPPS-packaged modules have been successfully tested at power levels over 6 kW.

Packaging for thermal management of power electronics building blocks using metal posts interconnected parallel plate structure

The Virginia Power Electronics Center at Virginia Tech has developed a low cost approach for packaging of power electronics building blocks (PEBB) consisting of power semiconductor devices, drivers, controls, sensors and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment. The new concept of PEBB packaging, termed metal posts interconnected parallel plate structure (MPIPPS), is based on direct bonding of copper posts to interconnect power devices, thus eliminating wire-bonding with aluminum wires. The interior space between the parallel plates and copper posts can be used as a flow channel for heat dissipation by a dielectric fluid, or filled with a solid or liquid for additional heat spreading. This approach requires less expensive processing equipment and has the potential to produce cost-effective high power modules that have superior electrical, thermal, and mechanical performance. This paper presents the materials selection and fabrication techniques developed in the course of the research and initial electrical and thermal characterization of the MPIPPS structure.

Thermal management of high-power electronics modules packaged with interconnected parallel plates

Virginia Power Electronics Center (VPEC) has developed a stacked-plate technique for 3-D packaging of power electronics building block modules. A basic building block-a two-switch two-diode half-bridge converter in totem-pole configuration with built-in gate-driver and protection circuitry, fiber-optic receiver/transmitter interface, and soft-switching capability has been constructed. This innovative packaging technique uses high-performance copper/aluminum nitride/copper sandwiched plates as substrates for power devices. To interconnect the devices, metal posts are soldered directly onto the devices instead of using wire bonding. Test and modeling results of the packaged modules showed the potential for low parasitics, excellent thermal management, and improved reliability.

S. Haque

Papers

An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures

An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures

Packaging for thermal management of power electronics building blocks using metal posts interconnected parallel plate structure

Thermal management of high-power electronics modules packaged with interconnected parallel plates

Development of a stacked-plate technique for 3-D packaging of power electronics modules