The finite-difference time-domain (FDTD) method is arguably the most popular numerical method for the solution of problems in electromagnetics. Although the FDTD method has existed for nearly 30 years, its popularity continues to grow as computing costs continue to decline. Furthermore, extensions and enhancements to the method are continually being published, which further broaden its appeal. Because of the tremendous amount of FDTD-related research activity, tracking the FDTD literature can be a daunting task. We present a selective survey of FDTD publications. This survey presents some of the significant works that made the FDTD method so popular, and tracks its development up to the present-day state-of-the-art in several areas. An "on-line" BibT/sub E/X database, which contains bibliographic information about many FDTD publications, is also presented. >

A selective survey of the finite-difference time-domain literature

Common-mode currents induced on cables attached to printed circuit boards (PCBs) can be a significant source of unintentional radiated emissions. This paper develops a model for estimating the amount of common-mode cable current that can be induced by the signal voltage on microstrip trace structures or heatsinks on a PCB. The model employs static electric field solvers or closed-form expressions to estimate the effective self-capacitances of the board, trace, and/or heatsink. These capacitances are then used to determine the amplitude of an equivalent common-mode voltage source that drives the attached cables. The model shows that these voltage-driven common-mode cable currents are relatively independent of the cable parameters and the trace or heatsink location when the PCB is small relative to the cable length and to a wavelength.

https://scholarsmine.mst.edu/cgi/viewcontent.cgi?article=2139&context=ele_comeng_facwork

Model for estimating radiated emissions from a printed circuit board with attached cables due to Voltage-driven sources

Microwave curing of portland cement concrete: experimental results and feasibility for practical applications

General methods for reducing printed circuit board (PCB) emissions over a broad band of high frequencies are necessary to meet EMI requirements, as processors become faster and more powerful. One mechanism by which EMI can be coupled off a PCB or multichip module (MCM) structure is from high-frequency fringing electric fields on the DC power and reference planes at the substrate periphery. An approach for EMI mitigation by stitching multiple ground planes together along the periphery of multilayer PCB power-bus stacks with closely spaced vias is reported and quantified in this paper. Power-bus noise induced EMI and coupling from the board edges is the major concern herein. The EMI at 3 m for different via stitch spacing and layer thickness is modeled with the finite-difference time domain (FDTD) method. Design curves and an empirical equation are extracted from a parametric study to summarize the variation of the radiated EMI as a function of layer thickness and stitch spacing.

/pdf/emi-mitigation-with-multilayer-power-bus-stacks-and-via-5eztghdz3i.pdf

EMI mitigation with multilayer power-bus stacks and via stitching of reference planes

Local decoupling, i.e., placing decoupling capacitors sufficiently close to device power/ground pins in order to decrease the impedance of power bus at frequencies higher than the series resonant frequency, has been studied using a modeling approach, a hybrid lumped/distributed circuit model established and an expression to quantify the benefits of power bits noise mitigation due to local decoupling developed. In this work, a test board with a local decoupling capacitor was studied and the noise mitigation effect due to the capacitor placed adjacent to an input test port was measured. Closed-form expressions for self and mutual inductances of vias are developed, so that the noise mitigation effect can then be estimated using the previously developed expression. The difference between the estimates and measurements is approximately 1 dB, which demonstrates the application of these closed-form expressions in the PCB power bus designs. Shared-via decoupling, capacitors sharing vias with device power/ground pins, is also modeled as an extreme case of local decoupling.

/pdf/estimating-the-noise-mitigation-effect-of-local-decoupling-4eu5oh977b.pdf

Estimating the noise mitigation effect of local decoupling in printed circuit boards

The electromagnetic radiation from a VLSI chip package and heatsink structure is analyzed by means of the finite-difference-time-domain (FDTD) technique. The dimensions of a typical configuration call for a multizone gridding scheme in the FDTD algorithm to accommodate fine grid cells in the vicinity of the heatsink and package cavity and sparse gridding in the remainder of the computational domain. The issues pertaining to the effects of the heatsink on the overall radiative capacity of the configuration are addressed. Analyses are facilitated by using simplified heatsink models and by using dipole elements as sources of electromagnetic energy to model the VLSI chip. The potential for enhancement of spurious emissions by the heatsink structure is illustrated. For heatsinks of typical dimensions, resonance is possible within the low gigahertz frequency range. The exploitation of the heatsink as an emissions shield by appropriate implementation schemes is discussed and evaluated. >

Application of FDTD method to analysis of electromagnetic radiation from VLSI heatsink configurations

The electromagnetic radiation from a modules-on-backplane configuration found in computers is analyzed by means of the finite-difference time-domain (FD-TD) technique. The issues pertaining to the effects of the modules in influencing the overall radiating capacity of the configuration are addressed. Analyses are facilitated by using simplified modules-on-backplane models and by using a voltage source as the source of electromagnetic energy at a connector between a module and the backplane. The potential for enhancement of spurious emissions by the module-on-backplane configuration is demonstrated. For modules of typical dimensions, resonance is observed at the hundreds of MHz frequency range. Comparisons between numerical predictions and measurements are conducted to validate the numerical method. >

S.Y. Poh

Papers

Application of FDTD method to analysis of electromagnetic radiation from VLSI heatsink configurations

FD-TD analysis of electromagnetic radiation from modules-on-backplane configurations