Provided are an image sensor and a method of manufacturing the same. The method may include forming a photo-electric conversion region and a charge storage region in a semiconductor layer; forming a transistor on a front surface of the semiconductor layer; forming a recess by etching a portion of the semiconductor layer between the charge storage region and a rear surface of the semiconductor layer; and forming on a bottom surface of the recess a shield film that blocks light incident on the charge storage region.

Image sensor and method of manufacturing the same

Provided is a solid-state imaging device including: a first-conductivity-type substrate; a second-conductivity-type well formed in a surface side of the first-conductivity-type substrate; a photoelectric conversion area configured with a first-conductivity-type-impurity area formed in the second-conductivity-type well to convert incident light to charges; a first-conductivity-type-charge retaining area configured with the first-conductivity-type-impurity area formed in the second-conductivity-type well to retain the charges converted by the photoelectric conversion area until the charges are read out; a charge voltage conversion area configured with the first-conductivity-type-impurity area formed in the second-conductivity-type well to convert the charges retained in the charge retaining area to a voltage; and a first-conductivity-type-layer area configured by forming a first-conductivity-type-in a convex shape from a boundary between the first-conductivity-type substrate and the second-conductivity-type well to a predetermined depth of the surface side under at least one portion of the charge retaining area and the charge voltage conversion area.

Solid-state imaging device, method of manufacturing solid-state imaging device and electronic apparatus

A solid-state imaging device includes an effective pixel portion in which a plurality of pixels including photoelectric conversion elements are arrayed; and a nonconductive interpixel light-shielding film that is placed in the effective pixel portion and that shields areas between the pixels.

Solid-state imaging device, method for manufacturing the same, and electronic apparatus

A solid-state imaging device includes a photoelectric conversion section configured to generate photocharges and a transfer gate that transfers the photocharges to a semiconductor region. A method for driving a unit pixel includes a step of accumulating photocharges in a photoelectric conversion section and a step of accumulating the photocharges in a semiconductor region. A method of forming a solid-state imaging device includes implanting ions into a well layer through an opening in a mask, implanting additional ions into the well layer through an opening in another mask, and implanting other ions into the well layer through an opening in yet another mask. An electronic device includes the solid-state imaging device.

Solid-state imaging device, method for driving the same, method for manufacturing the same, and electronic device

We present a Montecarlo simulator developed in Matlab® for the analysis of a Single Photon Avalanche Diode (SPAD)-based Complementary Metal-Oxide Semiconductor (CMOS) flash Light Detection and Ranging (LIDAR) system. The simulation environment has been developed to accurately model the components of a flash LIDAR system, such as illumination source, optics, and the architecture of the designated SPAD-based CMOS image sensor. Together with the modeling of the background noise and target topology, all of the fundamental factors that are involved in a typical LIDAR acquisition system have been included in order to predict the achievable system performance and verified with an existing sensor.

https://www.mdpi.com/1424-8220/20/18/5203/pdf

Numerical Model of SPAD-Based Direct Time-of-Flight Flash LIDAR CMOS Image Sensors.

A video graphics array (VGA) (640 $\times $ 480) indirect time-of-flight (ToF) CMOS image sensor has been designed with 4-tap 7- $\mu \text{m}$ global-shutter pixel in 65-nm back-side illumination (BSI) process. With a 4-tap pixel structure, we achieved motion artifact-free depth map. Peak current during exposure time has been reduced by current spreading with constant delay chain in the photo-gate driver. Column fixed-pattern phase noise (FPPN) from the constant delay chain is self-compensated by the proposed time-interleaving technique with the two inversely directional clock chains in the photo-gate driver. Quantum efficiency (QE) and demodulation contrast (DC) have been optimized by using appropriate optical engineering techniques with an optimal silicon thickness. As a result, QE of 34% at 940-nm near-infrared and high DC of 86% at 100-MHz modulation frequency have been achieved. In addition, motion artifact and column FPPN are successfully removed in the depth map. The proposed ToF sensor shows depth noise less than 0.57% with 940-nm illuminator over the working distance up to 4 m, and consumes only 160 mW for VGA output at 60 frames/s.

A VGA Indirect Time-of-Flight CMOS Image Sensor With 4-Tap 7- $\mu$ m Global-Shutter Pixel and Fixed-Pattern Phase Noise Self-Compensation

${A}640 \times 480$ indirect Time-of-Flight (ToF) CMOS image sensor has been designed with 4-tap $7-\mu \mathrm{m}$ global-shutter pixel in 65-nm back-side illumination (BSI) process. With novel 4tap pixel structure, we achieved motion artifact-free depth map. Column fixed-pattern phase noise (FPPN) is reduced by introducing alternative control of the clock delay propagation path in the photo-gate driver. As a result, motion artifact and column FPPN are not noticeable in the depth map. The proposed ToF sensor shows depth noise less than 0.62% with 940-nm illuminator over the working distance up to 400 cm, and consumes 197 mW for VGA, which is 0.64 pW/pixel.

A 640×480 Indirect Time-of-Flight CMOS Image Sensor with 4-tap 7-μm Global-Shutter Pixel and Fixed-Pattern Phase Noise Self-Compensation Scheme

A CMOS image sensor includes a photosensitive device, a floating diffusion region, a transfer transistor, and a pocket photodiode formed in a semiconductor substrate of a first conductivity type. The floating diffusion region is of a second conductivity type. The transfer transistor has a channel region disposed between the photosensitive device and the floating diffusion region. The pocket photodiode is of the second conductivity type and is formed under a first portion of a bottom surface of the channel region such that a second portion of the bottom surface of the channel region abuts the semiconductor substrate.

CMOS image sensor with pocket photodiode for minimizng image lag

\n An indirect time-of-flight (ToF) CMOS image sensor has been designed with 4-tap 7 μm global shutter pixel in back-side illumination process. 15000 e- of high full-well capacity (FWC) per a tap of 3.5 μm pitch and 3.6 e- of read-noise has been realized by employing true correlated\n double sampling (CDS) structure with storage gates (SGs). Noble characteristics such as 86 % of demodulation contrast (DC) at 100MHz operation, 37 % of higher quantum efficiency (QE) and lower parasitic light sensitivity (PLS) at 940 nm have been achieved. As a result, the proposed ToF sensor\n shows depth noise less than 0.3 % with 940 nm illuminator in even long distance.\n

A 4-tap global shutter pixel with enhanced IR sensitivity for VGA time-of-flight CMOS image sensors

An image sensor includes a substrate, an anti-reflection board and a light shielding film. The substrate includes first pixels to receive a light, and second pixels to provide a black level compensation. The first pixels are formed in an active region and the second pixels are formed in a first region spaced apart from the active region in a row direction. The anti-reflection board is formed in a second region above the substrate, and the second region is between the active region and the first region. The light shielding film is formed above the anti-reflection board, and the light shielding film covers an optical black region including the first and second regions. Therefore, the image sensor may be used in a CCD type image sensor and a CMOS type image sensor to provide a stabilized black level, thereby improving a quality of a displayed image.

Sae-Young Kim

Papers

A VGA Indirect Time-of-Flight CMOS Image Sensor With 4-Tap 7- $\mu$ m Global-Shutter Pixel and Fixed-Pattern Phase Noise Self-Compensation

A 640×480 Indirect Time-of-Flight CMOS Image Sensor with 4-tap 7-μm Global-Shutter Pixel and Fixed-Pattern Phase Noise Self-Compensation Scheme

CMOS image sensor with pocket photodiode for minimizng image lag

A 4-tap global shutter pixel with enhanced IR sensitivity for VGA time-of-flight CMOS image sensors

Image sensor and method of stabilizing a black level in an image sensor