A method of growing a nitride semiconductor crystal having very few crystal defects and capable of being used as a substrate, comprising the step of forming a first selective growth mask equipped with a plurality of first windows for selectively exposing the surface of a support on the support having a main plane and including different kinds of substrates made of materials different from those of a nitride semiconductor, and the step of growing the nitride semiconductor, by using a gaseous Group III element source and a gaseous nitrogen source, until portions of the nitride semiconductor crystal growing in adjacent windows from the surface of the support exposed from the window join with one another on the upper surface of the selective growth mask.

Method of growing nitride semiconductors, nitride semiconductor substrate and nitride semiconductor device

Methods for selectively depositing high quality epitaxial material include introducing pulses of a silicon-source containing vapor while maintaining a continuous etchant flow. Epitaxial material is deposited on areas of a substrate, such as source and drain recesses. Between pulses, the etchant flow continues such that lower quality epitaxial material may be removed, as well as any non-epitaxial material that may have been deposited. The pulse of silicon-source containing vapor may be repeated until a desired thickness of epitaxial material is selectively achieved in semiconductor windows, such as recessed source/drain regions.

Cyclical epitaxial deposition and etch

Epitaxial layers (125) are selectively formed in semiconductor windows (114) by a cyclical process of repeated blanket deposition and selective etching. The blanket deposition phases leave non-epitaxial material (120) over insulating regions (112), such as field oxide, and the selective etch phases preferentially remove non-epitaxial material (120) while deposited epitaxial material (125) builds up cycle-by-cycle. Quality of the epitaxial material (125) improves relative to selective processes where no deposition occurs on insulators (112). Use of a germanium catalyst during the etch phases of the process aids etch rates and facilitates economical maintenance of isothermal and/or isobaric conditions throughout the cycles. Throughput and quality are improved by use of trisilane, formation of amorphous material (120) over the insulating regions (112) and minimizing the thickness ratio of amorphous:epitaxial material in each deposition phase.

Selective epitaxial formation of semiconductor films

Methods of selective formation leave high quality epitaxial material using a repeated deposition and selective etch process. During the deposition process, an inert carrier gas is provided with a silicon-containing source without hydrogen carrier gas. After depositing silicon-containing material, an inert carrier gas is provided with an etchant to selectively etch deposited material without hydrogen. The deposition and etch processes can be repeated until a desired thickness of silicon-containing material is achieved. Using the processes described within, it is possible to maintain temperature and pressure conditions, as well as inert carrier gas flow rates, to provide for increased throughput. The inert flow can be constant, or etch rates can be increased by reducing inert flow for the etch phases of the cycles.

High throughput cyclical epitaxial deposition and etch process

Semiconductor light emitting device and methods for its manufacture comprises a plurality of textured district defined on the surface of the substrate. The initial inclined layer deposition serves to guide the extended defects to designated gettering centers in the trench region where the defects combine with each other. As a result, the defect density in the upper section of the structure is much reduced. By incorporating a blocking mask in the structure, the free propagation of extended defects into the active layer is further restricted. The present invention is useful in the fabrication of semiconductor light emitting devices in misfit systems.

Semiconductor light-emitting device and method for manufacturing the same

A monocrystalline silicon layer is formed on a mask layer on a semiconductor substrate. An apertured mask layer is disposed on the substrate, and an epitaxial layer is then grown by a two-step deposition/etching cycle. By repeating the deposition/etching cycle a predetermined number of times, monocrystalline silicon will be grown from the substrate surface, through the mask aperture, and over the mask layer.

Method for growing monocrystalline silicon through mask layer

A method for forming closely spaced conductors suitable for use, for example, in CCD's and MESFET's is described utilizing an edge diffusion technique to convert exposed edge portions of a polycrystalline silicon layer to a non-etchable form. The converted portions are precisely and accurately formed to serve as spacers, thereby defining a narrow gap between adjacent conductive lines.

Method of forming closely spaced lines or contacts in semiconductor devices

A vertical IGFET comprising a substantially planar silicon wafer with a source electrode on one major surface and a drain electrode on the opposite major surface is disclosed. An insulated gate electrode, which includes a conductive finger portion surrounded by an insulating layer, is internally disposed in the silicon wafer such that a predetermined voltage applied to the gate electrode will regulate a current flow between the source and drain electrodes. The device is fabricated utilizing an epitaxial lateral overgrowth technique for depositing monocrystalline silicon over the insulated gate which is disposed on a silicon substrate.

Vertical IGFET with internal gate and method for making same

A vertical IGFET device (10, 40) comprises a substantially planar silicon wafer (12, 42) with a source electrode (18, 48) on one major surface (14, 44), a drain electrode (20, 50) on the opposite major surface (16, 46) and an insulated gate electrode (26, 56), internally disposed in the wafer (12, 42), which includes a conductive finger-like portion (28, 58) surrounded by an insulating layer (30, 60) The IGFET device (10, 40) is fabricated utilizing an epitaxial lateral overgrowth (ELO) technique for depositing a monocrystalline silicon layer over the insulated gate electrode (25, 56) which is disposed on a silicon substrate The ELO technique involves a repetitious, two- phase, depositing/etch cycle

Scott C. Blackstone

Papers

Method for growing monocrystalline silicon through mask layer

Method of forming closely spaced lines or contacts in semiconductor devices

Vertical IGFET with internal gate and method for making same

An IGFET and method for making an IGFET