S
Scott C. Holden
Researcher at Varian Associates
Publications - 5
Citations - 193
Scott C. Holden is an academic researcher from Varian Associates. The author has contributed to research in topics: Wafer & Thermal conduction. The author has an hindex of 5, co-authored 5 publications receiving 193 citations.
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Patent
Method for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer
TL;DR: In this paper, a semiconductor wafer is loaded at its periphery onto a shaped platen, and sufficient contact pressure from the loading is produced between the wafer and the platen so that significant gas pressure may be accommodated against the back side of the Wafer.
Patent
Optimum surface contour for conductive heat transfer with a thin flexible workpiece
Scott C. Holden,Peter R. Hanley +1 more
TL;DR: In this article, the authors optimized conductive heat transfer between a thin deformable workpiece and heat sink by imposing a load over the workpiece resulting in a uniform contact pressure distribution in said workpiece which is also the maximum stress consistent with the elastic properties of the work piece.
Patent
Methods and apparatus for gas-assisted thermal transfer with a semiconductor wafer
TL;DR: In this paper, a thermal transfer gas is used to transfer thermal energy between a semiconductor wafer and a platen during processing in a vacuum chamber, and the intermediate region is vacuum pumped to a pressure lower than the pressure in the thermal transfer region whereby leakage of the gas into the vacuum chamber is reduced.
Patent
Air lock vacuum pumping methods and apparatus
TL;DR: In this paper, a vacuum pumped expansion tank having a volume larger than the volume of the air lock is coupled through a valve to the air-lock, and the valve is opened for a brief duration and the gas in the airlock rapidly expands into the expansion tank.
Patent
Method for optimum conductive heat transfer with a thin flexible workpiece
TL;DR: In this article, the authors optimized conductive heat transfer between a thin deformable workpiece and heat sink by imposing a load over the workpiece resulting in a uniform contact pressure distribution in said workpiece which is also the maximum stress consistent with the elastic properties of the work piece.