Patent
Methods and apparatus for gas-assisted thermal transfer with a semiconductor wafer
TLDR
In this paper, a thermal transfer gas is used to transfer thermal energy between a semiconductor wafer and a platen during processing in a vacuum chamber, and the intermediate region is vacuum pumped to a pressure lower than the pressure in the thermal transfer region whereby leakage of the gas into the vacuum chamber is reduced.Abstract:
Methods and apparatus for differential pumping of a thermal transfer gas used to transfer thermal energy between a semiconductor wafer and a platen during processing in a vacuum chamber. Housing structure defines an intermediate region adjacent to and surrounding the platen. The gas, which is introduced into a thermal transfer region behind the wafer, is restricted from flowing into the intermediate region by intimate contact between the wafer and the platen. A clamping ring, which clamps the wafer to the platen, and a bellows coupled between the clamping ring and the housing restrict flow of gas from the intermediate region to the vacuum chamber. The intermediate region is vacuum pumped to a pressure lower than the pressure in the thermal transfer region whereby leakage of the gas into the vacuum chamber is reduced.read more
Citations
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Patent
Wafer support system
Michael W. Halpin,Mark R. Hawkins,Derrick W. Foster,Robert M. Vyne,John F. Wengert,Cornelius A. van der Jeugd,Loren R. Jacobs,Frank B.M. No. Phoenix Van Bilsen,Matthew G. Goodman,Hartmann Glenn,Jason M. Layton +10 more
TL;DR: In this paper, a wafer support system consisting of a segmented susceptor having top and bottom sections and gas flow passages therethrough is described, where the sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer.
Patent
Physical vapor deposition clamping mechanism and heater/cooler
TL;DR: In this article, a clamping ring and temperature regulated platen are used for clamping a wafer to the platen and regulating the temperature of the wafer, where a roof shields all but a few contact regions of the interface between wafer and clamp from receiving depositing particles.
Patent
Method and apparatus for electrochemical planarization of a workpiece
TL;DR: An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen as mentioned in this paper, which is formed of conductive material.
Patent
Method of supporting a substrate in a gas cushion susceptor system
TL;DR: In this paper, an apparatus and method to position a wafer onto a substrate holder and to maintain a uniform wafer temperature is described, where the substrate holder or susceptor comprises a recess or pocket whose surface includes a grid containing a plurality of grid grooves that separate protrusions.
Patent
Semiconductor producing apparatus comprising wafer vacuum chucking device
Yoshimi Kinoshita,Tomoyuki Kanda,Katsuhisa Kitano,Yoshida Kazuo,Hiroshi Ohnishi,Kenichiro Yamanishi,Shigeo Sasaki,Hideki Komori,Taizo Eshima,Kouichirou Tsutahara,Toshihiko Noguchi,Toru Takahama,Yoshihiko Kusakabe,Takeshi Iwamoto,Nobuyuki Kosaka +14 more
TL;DR: In this paper, the main body of a vacuum chuck has a plurality of block grooves on the surface on which the wafer (1) is sucked and fixed, in which vacuum evacuation paths (105) each for vacuum evacuating each block groove (125) are provided.
References
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Patent
Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface
TL;DR: In this paper, an active cooling system for semiconductor wafers during implantation in an ion implantation chamber includes a housing incorporating a convexly curved platen, which has a coating of a pliable thermally conductive material adhered to the surface thereof.
Journal ArticleDOI
Experiments on gas cooling of wafers
M.L. King,Peter H. Rose +1 more
TL;DR: In this paper, the applicability of gas cooling of the wafer backside was examined and data showed that very effective cooling can be provided with a heat transfer coefficient of between 20 −50 mW cm−2 C−1 depending on the gas used.
Patent
Cooling apparatus for vacuum chamber
TL;DR: In this article, an apparatus for cooling a workpiece within a vacuum chamber consisting of a housing within said chamber, a cooling medium within said housing having direct contact with said workpiece, and a diaphragm equalizing pressure between said vacuum chamber and the chamber within a housing is described.
Patent
Glass-clear nylons from 3,3'-dimethyl PACM
Claus Dr Cordes,Richard Ing. Grad. Pflueger,Franz Dr. Dipl.-Chem. Schmidt,Georg Nikolaus Dipl Ing Simon +3 more
TL;DR: A glass-clear nylon based on aromatic dicarboxylic acids and dialicyclic diamines is prepared by polycondensing isophthalic acid with a mixture of 3,3'-dimethyl-4,4'-diamino-dicyclohexylmethane and hexamethylenediamine.