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Numerical Heat Transfer And Fluid Flow

Publisher Summary Thermal control of electronic components has one principal objective, to maintain relatively constant component temperature equal to or below the manufacturer's maximum specified service temperature, typically between 85 and 100°C. It is noted that even a single component operating 10°C beyond this temperature can reduce the reliability of certain systems by as much as 50%. Therefore, it is important for the new thermal control schemes to be capable of eliminating hot spots within the electronic devices, removing heat from these devices and dissipating this heat to the surrounding environment. Several strategies have developed over the years for controlling and removing the heat generated in multichip modules, which include advanced air-cooling schemes, direct cooling, and miniature thermosyphons or free-falling liquid films. The chapter summarizes analytical, numerical, and experimental work in literature, in order to facilitate the improvement of existing schemes and provide a basis for the development of new ones. The chapter focuses on investigations performed over the past decade and includes information on the thermal control of semiconductor devices, modules, and total systems.

Thermal Control of Electronic Equipment and Devices

It is common practice to represent a composite electrical winding as an equivalent lumped anisotropic material as this greatly simplifies a thermal model and reduces computation times. Existing techniques for estimating the bulk thermal properties of such composite materials use either analytical, numerical, or experimental approaches; however, these methods exhibit a number of drawbacks and limitations regarding their applicability. In this paper, a numerical thermal conductivity and analytical specific heat capacity estimation technique is proposed. The method is validated experimentally against three winding samples with differing configuration. A procedure is presented which enables bulk thermal properties to be estimated with a minimal need for experimental measurement, thereby accelerating the thermal modeling process. The proposed procedure is illustrated by the modeling of three coil exemplars with differing windings. Experimental thermal transients obtained by dc test of the coils show close agreement with a lumped-parameter thermal model utilizing estimated material data.

Estimation of Equivalent Thermal Parameters of Impregnated Electrical Windings

Optimization of thermal design of heat sinks: A review

Heat transfer in micro-channels: Comparison of experiments with theory and numerical results

Experimental study of turbulent cross-flow in a staggered tube bundle using particle image velocimetry

Experimental and numerical investigation of turbulent cross-flow in a staggered tube bundle

Numerical analysis is made of forced-convection heat transfer in laminar, two-dimensional, steady crossflow in banks of plain tubes in staggered arrangements. A finite-volume method with a nonorthogonal, boundary-fitted grid and co-located variable storage is used to solve the Navier-Stokes equations and energy conservation equation for a tube bundle with 10 longitudinal rows, including inlet and outlet sections. Local and overall heat transfer and fluid flow results are presented at nominal pitch-to-diameter ratios of 1.25, 1.5, and 2.0 for equilateral triangle and rotated square tube arrangements with Reynolds numbers of 100 and 300 and a Prandtl number of 0.71. Sensitivity of the local Nusselt number and friction coefficient distributions to the computational grid distribution is noted. A comparison of the present study results with well-established experiments and empirical correlations showed good overall agreement.

Analysis of laminar forced convection of air for crossflow in banks of staggered tubes

A three-dimensional numerical analysis of laminar fluid flow and conjugate heat transfer has been conducted for single- and two-layered micro-channel heat sinks. The validity of the numerical model has been confirmed by comparison with available experimental data. Results for the overall thermal resistance, pumping power, the maximum temperature difference on the heat-sink surface where the heat flux is applied, and an overall performance parameter were obtained for single- and two-layered sinks. The effects of Reynolds number, inlet velocity profile, and flow arrangement in the channels (parallel and counter) on these results are presented and discussed. A special emphasis was placed on the comparison between the thermal performances of the parallel and counter flow arrangements and further results were obtained in order to quantify and explain the relative performance under these flow arrangements.

Scott J. Ormiston

Papers

Experimental study of turbulent cross-flow in a staggered tube bundle using particle image velocimetry

Experimental and numerical investigation of turbulent cross-flow in a staggered tube bundle

Analysis of laminar forced convection of air for crossflow in banks of staggered tubes

Three-dimensional analysis of fluid flow and heat transfer in single- and two-layered micro-channel heat sinks

Three-dimensional thermal analysis of heat sinks with circular cooling micro-channels