The wet etching of GaN, AlN, and SiC is reviewed including conventional etching in aqueous solutions, electrochemical etching in electrolytes and defect-selective chemical etching in molten salts. The mechanism of each etching process is discussed. Etching parameters leading to highly anisotropic etching, dopant-type/bandgap selective etching, defect-selective etching, as well as isotropic etching are discussed. The etch pit shapes and their origins are discussed. The applications of wet etching techniques to characterize crystal polarity and defect density/distribution are reviewed. Additional applications of wet etching for device fabrication, such as producing crystallographic etch profiles, are also reviewed.

Wet etching of GaN, AlN, and SiC : a review

Silicon carbide (SiC) has a range of useful physical, mechanical and electronic properties that make it a promising material for next-generation electronic devices. Careful consideration of the thermal conditions in which SiC [0001] is grown has resulted in improvements in crystal diameter and quality: the quantity of macroscopic defects such as hollow core dislocations (micropipes), inclusions, small-angle boundaries and long-range lattice warp has been reduced. But some macroscopic defects (about 1-10 cm(-2)) and a large density of elementary dislocations (approximately 10(4) cm(-2)), such as edge, basal plane and screw dislocations, remain within the crystal, and have so far prevented the realization of high-efficiency, reliable electronic devices in SiC (refs 12-16). Here we report a method, inspired by the dislocation structure of SiC grown perpendicular to the c-axis (a-face growth), to reduce the number of dislocations in SiC single crystals by two to three orders of magnitude, rendering them virtually dislocation-free. These substrates will promote the development of high-power SiC devices and reduce energy losses of the resulting electrical systems.

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Ultrahigh-quality silicon carbide single crystals

Only a few years ago, an account of degradation of silicon carbide high-voltage p-i-n diodes was presented at the European Conference on Silicon Carbide and Related Compounds (Kloster Banz, Germany, 2000). This report was followed by the intense effort of multiple groups utilizing varied approaches and subsequent progress in both fundamental understanding of this phenomenon and its elimination. The degradation of SiC p-i-n junctions is now well documented to be due to the expansion of Shockley-type stacking faults in the part of the devices reached by the electron-hole plasma. The faults can gradually cover most of the junction area, impeding current flow and, as a result, increasing the on-state resistance. While in most semiconductors stacking faults are electrically inactive, in hexagonal silicon carbide polytypes (4H- and 6H-SiC) they form quantum-well-like electron states observed in luminescence and confirmed by first-principles calculations. The stacking-fault expansion occurs via motion of 30° sil...

Degradation of hexagonal silicon-carbide-based bipolar devices

Artificially layered heteropolytypic structures based on SiC polytypes: molecular beam epitaxy, characterization and properties

Recent attempts to make SiC diodes have revealed a problem with stacking fault expansion in the material, leading to unstable devices. In this paper, we present detailed results from a density-functional supercell calculation on the electronic structure of stacking faults which result from glide of Shockley partials in $3C\ensuremath{-}, 4H\ensuremath{-}$ and $6H\ensuremath{-}\mathrm{SiC}.$ It was found [Phys. Rev. B 65, 033203 (2002)] that both types of stacking faults in $4H\ensuremath{-}\mathrm{SiC}$ and two types of stacking faults in $6H\ensuremath{-}\mathrm{SiC}$ give rise to band states, which are strongly localized (confined within around 10 \AA{}) in the direction orthogonal to the stacking fault plane. Based on estimates of the band offsets between different polytypes and a simple quantum-well theory, we show that it is possible to interpret this one-dimensional localization as a quantum-well confinement effect. We also find that the third type of stacking fault in $6H\ensuremath{-}\mathrm{SiC}$ and the only stacking fault in $3C\ensuremath{-}\mathrm{SiC}$ do not give rise to states clearly separated from the band edges, but instead give rise to rather strongly localized band states with energies very close to the band edges. We argue that these localized near band edge states are created by stacking fault induced changes in the dipole moment associated with the hexagonal symmetry. In addition, we have also calculated the stacking fault energies, using both the supercell method and the simpler ANNNI (axial next nearest-neighbor Ising) model. Both theories agree well with the low stacking fault energies found experimentally.

Seiji Shinoyama

Papers

Sublimation growth of 6H- and 4H-SiC single crystals in the [11¯0 0] and [1 12¯0] directions