Showing papers by "Semyon Vaynman published in 2000"
TL;DR: In this paper, a novel approach for flux development to improve wetting of copper surfaces by tin-zinc eutectic solder was developed: tin containing organic compounds, which decomposes at soldering temperatures and produces metallic tin on surfaces to be soldered was added to several specially formulated fluxes.
Abstract: New lead-free solders containing zinc are promising candidates to replace near-eutectic tin-lead solders because the solders melt at lower temperatures than Sn-Ag-base solders. They also possess good mechanical and fatigue properties and are less expensive. However, the contact angle on copper for Sn-Zn solders is high when fluxes used for Sn-Pb solders are utilized. A novel approach for flux development to improve wetting of copper surfaces by tin-zinc eutectic solder was developed: tin containing organic compounds, which decomposes at soldering temperatures and produces metallic tin on surfaces to be soldered was added to several specially formulated fluxes. This process improves wetting of copper surfaces by molten tin-zinc eutectic solder. Fluxes were developed that give a contact angle as low as 20°.
33 citations