Using nonvolatile memories in memory hierarchy has been investigated to reduce its energy consumption because nonvolatile memories consume zero leakage power in memory cells One of the difficulties is, however, that the endurance of most nonvolatile memory technologies is much shorter than the conventional SRAM and DRAM technology This has limited its usage to only the low levels of a memory hierarchy, eg, disks, that is far from the CPUIn this paper, we study the use of a new type of nonvolatile memories -- the Phase Change Memory (PCM) as the main memory for a 3D stacked chip The main challenges we face are the limited PCM endurance, longer access latencies, and higher dynamic power compared to the conventional DRAM technology We propose techniques to extend the endurance of the PCM to an average of 13 (for MLC PCM cell) to 22 (for SLC PCM) years We also study the design choices of implementing PCM to achieve the best tradeoff between energy and performance Our design reduced the total energy of an already low-power DRAM main memory of the same capacity by 65%, and energy-delay2 product by 60% These results indicate that it is feasible to use PCM technology in place of DRAM in the main memory for better energy efficiency

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A durable and energy efficient main memory using phase change memory technology

Emerging scale-out workloads require extensive amounts of computational resources. However, data centers using modern server hardware face physical constraints in space and power, limiting further expansion and calling for improvements in the computational density per server and in the per-operation energy. Continuing to improve the computational resources of the cloud while staying within physical constraints mandates optimizing server efficiency to ensure that server hardware closely matches the needs of scale-out workloads.In this work, we introduce CloudSuite, a benchmark suite of emerging scale-out workloads. We use performance counters on modern servers to study scale-out workloads, finding that today's predominant processor micro-architecture is inefficient for running these workloads. We find that inefficiency comes from the mismatch between the workload needs and modern processors, particularly in the organization of instruction and data memory systems and the processor core micro-architecture. Moreover, while today's predominant micro-architecture is inefficient when executing scale-out workloads, we find that continuing the current trends will further exacerbate the inefficiency in the future. In this work, we identify the key micro-architectural needs of scale-out workloads, calling for a change in the trajectory of server processors that would lead to improved computational density and power efficiency in data centers.

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Clearing the clouds: a study of emerging scale-out workloads on modern hardware

The explosion of digital data and the ever-growing need for fast data analysis have made in-memory big-data processing in computer systems increasingly important. In particular, large-scale graph processing is gaining attention due to its broad applicability from social science to machine learning. However, scalable hardware design that can efficiently process large graphs in main memory is still an open problem. Ideally, cost-effective and scalable graph processing systems can be realized by building a system whose performance increases proportionally with the sizes of graphs that can be stored in the system, which is extremely challenging in conventional systems due to severe memory bandwidth limitations. In this work, we argue that the conventional concept of processing-in-memory (PIM) can be a viable solution to achieve such an objective. The key modern enabler for PIM is the recent advancement of the 3D integration technology that facilitates stacking logic and memory dies in a single package, which was not available when the PIM concept was originally examined. In order to take advantage of such a new technology to enable memory-capacity-proportional performance, we design a programmable PIM accelerator for large-scale graph processing called Tesseract. Tesseract is composed of (1) a new hardware architecture that fully utilizes the available memory bandwidth, (2) an efficient method of communication between different memory partitions, and (3) a programming interface that reflects and exploits the unique hardware design. It also includes two hardware prefetchers specialized for memory access patterns of graph processing, which operate based on the hints provided by our programming model. Our comprehensive evaluations using five state-of-the-art graph processing workloads with large real-world graphs show that the proposed architecture improves average system performance by a factor of ten and achieves 87% average energy reduction over conventional systems.

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A scalable processing-in-memory accelerator for parallel graph processing

Three-dimensional integration enables stacking memory directly on top of a microprocessor, thereby significantly reducing wire delay between the two. Previous studies have examined the performance benefits of such an approach, but all of these works only consider commodity 2D DRAM organizations. In this work, we explore more aggressive 3D DRAM organizations that make better use of the additional die-to-die bandwidth provided by 3D stacking, as well as the additional transistor count. Our simulation results show that with a few simple changes to the 3D-DRAM organization, we can achieve a 1.75x speedup over previously proposed 3D-DRAM approaches on our memory-intensive multi-programmed workloads on a quad-core processor. The significant increase in memory system performance makes the L2 miss handling architecture (MHA) a new bottleneck, which we address by combining a novel data structure called the Vector Bloom Filter with dynamic MSHR capacity tuning. Our scalable L2 MHA yields an additional 17.8% performance improvement over our 3D-stacked memory architecture.

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3D-Stacked Memory Architectures for Multi-core Processors

3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die stacking is a significant reduction of interconnect both within a die and across dies in a system. For instance, blocks within a microprocessor can be placed vertically on multiple die to reduce block to block wire distance, latency, and power. Disparate Si technologies can also be combined in a 3D die stack, such as DRAM stacked on a CPU, resulting in lower power higher BW and lower latency interfaces, without concern for technology integration into a single process flow. 3D has the potential to change processor design constraints by providing substantial power and performance benefits. Despite the promising advantages of 3D, there is significant concern for thermal impact. In this research, we study the performance advantages and thermal challenges of two forms of die stacking: Stacking a large DRAM or SRAM cache on a microprocessor and dividing a traditional microarchitecture between two die in a stack Results: It is shown that a 32MB 3D stacked DRAM cache can reduce the cycles per memory access of a twothreaded RMS benchmark on average by 13% and as much as 55% while increasing the peak temperature by a negligible 0.08?C. Off-die BW and power are also reduced by 66% on average. It is also shown that a 3D floorplan of a high performance microprocessor can simultaneously reduce power 15% and increase performance 15% with a small 14?C increase in peak temperature. Voltage scaling can reach neutral thermals with a simultaneous 34% power reduction and 8% performance improvement.

Die Stacking (3D) Microarchitecture

In this paper, we show how 3D stacking technology can be used to implement a simple, low-power, high-performance chip multiprocessor suitable for throughput processing. Our proposed architecture, PicoServer, employs 3D technology to bond one die containing several simple slow processing cores to multiple DRAM dies sufficient for a primary memory. The 3D technology also enables wide low-latency buses between processors and memory. These remove the need for an L2 cache allowing its area to be re-allocated to additional simple cores. The additional cores allow the clock frequency to be lowered without impairing throughput. Lower clock frequency in turn reduces power and means that thermal constraints, a concern with 3D stacking, are easily satisfied.The PicoServer architecture specifically targets Tier 1 server applications, which exhibit a high degree of thread level parallelism. An architecture targeted to efficient throughput is ideal for this application domain. We find for a similar logic die area, a 12 CPU system with 3D stacking and no L2 cache outperforms an 8 CPU system with a large on-chip L2 cache by about 14% while consuming 55% less power. In addition, we show that a PicoServer performs comparably to a Pentium 4-like class machine while consuming only about 1/10 of the power, even when conservative assumptions are made about the power consumption of the PicoServer.

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PicoServer: using 3D stacking technology to enable a compact energy efficient chip multiprocessor

This disclosure relates generally to natural language processing, and more particularly to a system and method for extracting subject-verb-object (SVO) chunked text from an unstructured text. In one embodiment, a method is provided for extracting SVO chunked text from an unstructured text. The method comprises identifying a plurality of part of speech (PoS) tokens in the unstructured text, and determining a plurality of SVO chunked text directly from the plurality of PoS tokens using a machine learning chunker model. The machine learning chunker model is trained on a subject-verb-object (SVO) annotated training data.

System and method for extracting information from unstructured text

The web contains vast repositories of unstructured text. We investigate the opportunity for building a knowledge graph from these text sources. We generate a set of triples which can be used in knowledge gathering and integration. We define the architecture of a language compiler for processing subject-predicate-object triples using the OpenNLP parser. We implement a depth-first search traversal on the POS tagged syntactic tree appending predicate and object information. A parser enables higher precision and higher recall extractions of syntactic relationships across conjunction boundaries. We are able to extract 2-2.5 times the correct extractions of ReVerb. The extractions are used in a variety of semantic web applications and question answering. We verify extraction of 50,000 triples on the ClueWeb dataset.

Parser Extraction of Triples in Unstructured Text

Parser Extraction of Triples in Unstructured Text.

We propose a unified architecture for next generation cognitive, low cost, mobile internet. The end user platform is able to scale as per the application and network requirements. It takes computing out of the data center and into end user platform. Internet enables open standards, accessible computing and applications programmability on a commodity platform. The architecture is a super-set to present day infrastructure web computing. The Java virtual machine (JVM) derives from the stack architecture. Applications can be developed and deployed on a multitude of host platforms. O(1) -> O(N). Computing and the internet today are more accessible and available to the larger community. Machine learning has made extensive advances with the availability of modern computing. It is used widely in NLP, Computer Vision, Deep learning and AI. A prototype device for mobile could contain N compute and N MB of memory.

Shaun C. D'Souza

Papers

PicoServer: using 3D stacking technology to enable a compact energy efficient chip multiprocessor

System and method for extracting information from unstructured text

Parser Extraction of Triples in Unstructured Text

Parser Extraction of Triples in Unstructured Text.

Cognitive Architecture for a Connected World