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Shengde Zhang

Researcher at Ritsumeikan University

Publications -  21
Citations -  208

Shengde Zhang is an academic researcher from Ritsumeikan University. The author has contributed to research in topics: Creep & Ultimate tensile strength. The author has an hindex of 6, co-authored 21 publications receiving 172 citations.

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Mechanical Properties of Copper Thin Films Used in Electronic Devices

TL;DR: In this paper, the authors present tensile and low cycle fatigue properties of copper thin films used in electronic devices, including rolled copper, electrolytic copper, direct current plated copper and pulse plated coppers, and find the strongest resistance to crack initiation in the rolled copper but there was no large difference in the cracking resistance among the other copper films.
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Notch effect on multiaxial low cycle fatigue

TL;DR: In this paper, a simple method for estimating the local strain at the notch root was proposed in tension and torsion loading in multiaxial low cycle fatigue was discussed in two materials.
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Multiaxial creep–fatigue life prediction for cruciform specimen

TL;DR: In this article, the authors describe the high temperature multiaxial creep-fatigue life prediction for type 304 stainless steel and present a finite element analysis for determining the stress-strain state in the gage part of a cruciform specimen subjected to creep fatigue loading under four strain waves at three principal strain ratios.
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Creep rupture life and damage evaluation under multiaxial stress state for type 304 stainless steel

TL;DR: The biaxial tension creep damage of type 304 stainless steel is studied at 973 K in this paper, where the principal stress ratio is defined as the ratio of y -directional principal stress to x-directional stress in the gage part of the specimen.
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Notch effect on creep–fatigue life for Sn–3.5Ag solder

TL;DR: In this article, the authors studied the creep-fatigue crack initiation and failure lives of Sn-3.5Ag notched specimens focused on the multiaxial strain at the notch root.