An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

The present invention provides a gas turbine combustor that has a fuel injection nozzle using a fluid other than liquid fuel to atomize the liquid fuel and that can suppress a reduction in power generation efficiency resulting from a heat loss while promoting the atomization of the liquid fuel. The gas turbine combustor is adapted to mix liquid fuel with combustion air led from a compressor, burn the mixture, and supply combustion gas generated to a gas turbine. The gas turbine combustor includes a fuel injection nozzle that atomizes the liquid fuel into fine liquid droplets. The fuel injection nozzle includes a first system adapted to supply the liquid fuel and a second system adapted to supply a fluid for atomizing the liquid fuel. Low-boiling liquid fuel is supplied to the second system as the fluid. The second system is adapted to heat and supply the low-boiling liquid fuel.

Gas turbine combustor

In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

Light emitting diode component

A navigation system provides multimedia annotations based upon the present location of the vehicle. These presentations may comprise advertising or text or other information entered by the user and associated with a specific location or locations. The navigation system also provides a removable media reader which obtains additional information based upon which the navigation system operates. This additional information may include multimedia annotations which are location-based. The navigation system further includes a wireless communication system which interacts with and provides further location-based multimedia annotations.

Vehicle navigation system with location-based multi-media annotation

A user interface that includes a catalog area, a collage mock-up area, and a mode select interface control operable to select an operational state of the user interface is displayed. Thumbnails of respective images are shown in the catalog area. A layout of a subset of the images is presented in the collage mock-up area. In response to the receipt of a user input gesture and a determination that the user interface is in a first operational state, a first action type is performed based on the type of the received user input gesture and the object type of the target object. In response to the receipt of the user input gesture and a determination that the user interface is in a second operational state, a second action type is performed based on the type of the received user input gesture and the object type of the target object.

Image collage authoring

PROBLEM TO BE SOLVED: To provide an electronic component package and its manufacturing method for realizing a shield effect sufficient for miniaturizing an electronic apparatus, reducing its height, reducing its weight and increasing frequency, according to the improvement in the sealing properties of the electronic component package. SOLUTION: The electronic component package is composed of a circuit board 1 having a ground pattern 3, a packaging component 5 composed of an electronic component packaged on an upper surface of the circuit board 1, a seal 6 composed of epoxy resin containing an inorganic filler for sealing the packaging component 5, and a shielding layer, composed of an electroless copper plating layer as a first layer 7 to be formed on the surface of the seal 6, an electrolytic copper plating layer as a second layer 8 and a coating layer for preventing copper oxidation as a third layer 9, and is configured by grounding the shield layer on the ground pattern 3. COPYRIGHT: (C)2005,JPO&NCIPI

Electronic component package and its manufacturing method

PROBLEM TO BE SOLVED: To lay an image out beautifully and easily in a page when the image inputted by an image input means, etc., is laid out in the page. SOLUTION: An initial layout part 113 of an automatic layout part 105 lays images inputted from the image input part 106 out in one page and a layout evaluation part 114 evaluates the layout result. Further, an arbitrary effect is specified among more than one effect previously registered from an operation instruction part 111 and based on the specified effect, the automatic layout part 105 automatically sets layout conditions of the image, which is laid out under the set layout conditions. COPYRIGHT: (C)1998,JPO

Device and method for image editing

When used, a hot extrusion forging die for use in titanium alloy according to the present invention extrusion works a heated titanium alloy-made billet in such a manner as to diameter-reduce the billet. The hot extrusion forging die for use in titanium alloy according to the present invention is equipped with a die member for extrusion working. The die member is made of ceramic. The forging die according to the present invention makes it possible to suppress the sticking of the die member onto an extruded work to thereby make it easy to take out the extruded work. Also, the forging die according to the present invention makes it possible to suppress the seizure of the titanium alloy-made billet, with the result that there can be used a lubricant for which the removing operation is not needed to be done.

Hot extrusion forging die for use in titanium alloy

PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board by which the fineness of a conductor pattern formed on a substrate can be improved and, at the same time, a circuit board can be manufactured inexpensively. SOLUTION: This method of manufacturing the printed wiring board comprises a step of forming a resin layer 12 on a substrate 11, a step of setting the resin layer 12 by pressing a letterpress 13 against the surface of the layer 12, and a step of removing the letterpress 13 from the resin layer 12 set on the substrate 11 and forming groove sections 14 on the surface of the resin layer 12. This method also comprises a step of forming conductor wiring by packing conductor paste 16 in the groove sections 14 of the resin layer 12, a step of forming lead-out conductor sections 17 which cover the conductor wiring and prescribed portions of the surface of the resin layer 12, and a step of forming a protective coat 18 which covers the whole body of the conductor wiring and prescribed portions of the conductor sections 17. By this method, the fineness of printed wiring can be improved easily without using any photo-etching process. COPYRIGHT: (C)2004,JPO&NCIPI

Method of manufacturing printed wiring board

PROBLEM TO BE SOLVED: To provide a coat the matrix component of which is a resin, the carbon nanomaterial of which is oriented parallel to the surface of a member at the site of mechanical part production, and which is excellent in thermal conductivity in the direction parallel to the surface of the member. SOLUTION: The carbon nanomaterial selected from carbon nanotubes and carbon nanofibers is mixed with a resin being the matrix component, and the thermally conductive coat is molded from the resulting mixture. The mixed powder is thermally sprayed in the direction vertical to the surface of a member to form an anisotropically thermally conductive coat in which the longitudinal parts of the carbon nanomaterial are oriented in the direction parallel to the surface of the member. COPYRIGHT: (C)2004,JPO&NCIPI

Shigeki Yamada

Papers

Electronic component package and its manufacturing method

Device and method for image editing

Hot extrusion forging die for use in titanium alloy

Method of manufacturing printed wiring board

Thermally conductive coat and method for forming the same