S
Shuichi Matsuda
Researcher at Mitsubishi
Publications - 41
Citations - 471
Shuichi Matsuda is an academic researcher from Mitsubishi. The author has contributed to research in topics: Photomask & Layer (electronics). The author has an hindex of 10, co-authored 41 publications receiving 471 citations. Previous affiliations of Shuichi Matsuda include NEC.
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Patent
Method for manufacturing bump leaded film carrier type semiconductor device
TL;DR: In this paper, a semiconductor chip having pads is adhered by an adhesive layer to the insulating film, so that the conductive layers are electrically connected to respective ones of the pads.
Patent
Process for adhesively bonding a semiconductor chip to a carrier film
Keiichiro Kata,Shuichi Matsuda +1 more
TL;DR: In this article, an adhesive layer is formed on a surface of a semiconductor wafer having a number of integrated circuits, and an opening is formed at regions of the adhesive layer corresponding to the electrode pads.
Patent
Semiconductor device with increased multi-bumps and adhered multilayered insulating films and method for installing same
Shuichi Matsuda,Kazutaka Shoji +1 more
TL;DR: In this article, a semiconductor device is described as a package composed of a plurality of insulating films and adhered to the semiconductor chip by an adhesive agent, and the wiring patterns are selectively connected to the electrode pads at one end, and to the plurality of electrically conductive protrusions at the other end, via via holes.
Patent
Process for manufacturing a photomask
TL;DR: In this article, a photomask manufacturing process including a step of forming metal silicide film on a transparent silica glass substrate is described, and a patterning mask is provided by light or electron beam, followed by a developing step.
Patent
Method for inspecting semiconductor chip bonding pads using infrared rays
TL;DR: In this article, an infrared ray test for a semiconductor chip is conducted by irradiating infrared ray onto a bottom surface of a chip, receiving the infrared ray reflected from a bonding pad and displaying the image of the bonding pad on a monitor.