The invention provides a microfabrication process which may be used to manufacture a MEMS device. The process comprises depositing one or a stack of layers on a base layer, said one layer or an uppermost layer in said stack of layers being a sacrificial layer; patterning said one or a stack of layers to provide at least one aperture therethrough through which said base layer is exposed; depositing a photosensitive layer over said one or a stack of layers; and passing light through said at least one aperture to expose said photosensitive layer.

A method for fabricating a structure for a microelectromechanical systems (mems) device

In one embodiment, the invention provides a method for fabricating a microelectromechanical systems device The method comprises fabricating a first layer comprising a film having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer by at least reducing charge build up thereon during activation of the microelectromechanical systems device

Controlling electromechanical behavior of structures within a microelectromechanical systems device

This invention provides a precursor film stack for use in the production of MEMS devices. The precursor film stack comprises a carrier substrate, a first layer formed on the carrier substrate, a second layer of an insulator material formed on the first layer, and a third layer of a sacrificial material formed on the second layer.

Thin film precursor stack for mems manufacturing

A method for fabricating an interference display unit is provided. A first plate and a sacrificial layer are formed in order on a substrate and at least two openings are formed in the first plate and the sacrificial layer. A photoresist layer is spin-coated on the sacrificial layer and fills the openings. A photolithographic process patterns the photoresist layer to define a support with an arm. A second plate is formed on the sacrificial layer and posts. The arm's stress is released through a thermal process. The position of the arm is shifted and the distance between the first plate and the second plate is therefore defined. Finally, The sacrificial layer is removed.

Method for fabricating an interference display unit

A structure of a micro electro mechanical system and a manufacturing method are provided, the structure and manufacturing method is adapted for an optical interference display cell. The structure of the optical interference display cell includes a first electrode, a second electrode and posts. The second electrode comprises a conductive layer covered by a material layer and is arranged about parallel with the first electrode. The support is located between the first plate and the second plate and a cavity is formed. In the release etch process of manufacturing the structure, the material layer protects the conductive layer from the damage by an etching reagent. The material layer also protects the conductive layer from the damage from the oxygen and moisture in the air.

Structure of a micro electro mechanical system and the manufacturing method thereof

The present invention uses a glass to act as a substrate. A stencil layer is patterned on the top surface of the substrate. Successively, a copper layer is deposited over the substrate. Next step is to remove the stencil layer. A negative photoresist layer is formed on the copper layer. A negative photoresist layer is processed using a backside exposure of the resist through the transparent substrate. The backside exposure technique uses the self-aligning, conductive copper layer as a mask. A plurality of trenches are then created in the photoresist layer and a second copper layer is electroplated in the trenches to form the planar coils.

Star Rey-Shing Huang

Papers

Method of manufacturing a planar coil using a transparency substrate