S
Sudip Mondal
Researcher at University of Calcutta
Publications - 46
Citations - 972
Sudip Mondal is an academic researcher from University of Calcutta. The author has contributed to research in topics: Thermoelastic damping & Laplace transform. The author has an hindex of 17, co-authored 46 publications receiving 727 citations.
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Photo-thermo-elastic wave propagation in an orthotropic semiconductor with a spherical cavity and memory responses
Sudip Mondal,Abhik Sur +1 more
TL;DR: In this paper, coupled plasma, thermal and elastic waves within an orthotropic infinite semiconducting medium in context of photothermal transport process having a spherica spore was studied.
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Waves in dual-phase-lag thermoelastic materials with voids based on Eringen’s nonlocal elasticity
TL;DR: The main idea of as mentioned in this paper is to extend Eringen's theory of nonlocal elasticity to generalized thermoelasticity with dual-phase-lag and voids.
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Transient response in a thermoelastic half-space solid due to a laser pulse under three theories with memory-dependent derivative
TL;DR: In this paper, a novel mathematical model of generalized thermoelasticity was proposed to investigate the transient phenomena due to the influence of a non-Gaussian pulsed laser type heat source in a stress free isothermal half-space in the context of Lord-Shulman (LS), dual-phase lag (DPL), and three phase lag (TPL) theories simultaneously.
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Transient response in a piezoelastic medium due to the influence of magnetic field with memory-dependent derivative
TL;DR: In this paper, a novel mathematical model of generalized thermoelasticity was proposed to investigate the transient phenomena for a piezoelastic half-space due to the influence of a magnetic field in the context of the dual-phase-lag model.
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Finite element analysis in a fiber-reinforced cylinder due to memory-dependent heat transfer
TL;DR: In this paper, a three-phase-lag model of generalized thermoelasticity was proposed to investigate the transient phenomena for a fiber-reinforced hollow cylinder due to the influence of thermal shock and magnetic field.