Crystalline silicon (c-Si) photovoltaics are robust, manufacturable, and Earth-abundant. However, barriers exist for c-Si modules to reach US$0.50–0.75/Wp fabrication costs necessary for subsidy-free utility-scale adoption. We evaluate the potential of c-Si photovoltaics to reach this goal by developing a bottom-up cost model for c-Si wafer, cell, and module manufacturing; performing a sensitivity analysis to determine research domains that provide the greatest impact on cost; and evaluating the cost-reduction potential of line-of-sight manufacturing innovation and scale, as well as advanced technology innovation. We identify research domains with large cost reduction potential, including improving efficiencies, improving silicon utilization, and streamlining manufacturing processes and equipment, and briefly review ongoing research and development activities that impact these research domains. We conclude that multiple technology pathways exist to enable US$0.50/Wp module manufacturing in the United States with silicon absorbers. More broadly, this work presents a user-targeted research and development framework that prioritizes research needs based on market impact.

Crystalline silicon photovoltaics: a cost analysis framework for determining technology pathways to reach baseload electricity costs

Innovations in Abrasive Products for Precision Grinding

Wire sawing technology has been widely adopted for slicing of brittle-and-hard materials including crystalline silicon, SiC and sapphire. This paper presents a literature review on the research efforts on wire sawing related topics. First, the system and process level investigations of wire sawing technology, including both multi-wire slurry sawing and diamond wire sawing, are summarized. Ingot materials used in wire sawing technology, as well as their properties and behavior during sawing operation are discussed. As modeling and analysis of single grit indentation and scribing of brittle materials provide fundamental insight on material removal and these can be leveraged for wire sawing analysis at system level, a review of those models and modified models proposed particularly for wire sawing process are also presented. After the survey of current state-of-the-art, this contribution proposes important research aspects to be further worked on to gain more complete scientific understanding of wire sawing technology.

T. Enomoto

Papers

Development of a High-Speed Manufacturing Method for Electroplated Diamond Wire Tools