High electrical conductivity and ampacity are usually mutually exclusive properties. Here, in a carbon nanotube–copper composite, Subramaniam et al. achieve a similar conductivity to copper, but with a hundred fold increase in current carrying capacity.

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One hundred fold increase in current carrying capacity in a carbon nanotube–copper composite

The growing packing density and power consumption of very large scale integration (VLSI) circuits have made thermal effects one of the most important concerns of VLSI designers The increasing variability of key process parameters in nanometer CMOS technologies has resulted in larger impact of the substrate and metal line temperatures on the reliability and performance of the devices and interconnections Recent data shows that more than 50% of all integrated circuit failures are related to thermal issues This paper presents a brief discussion of key sources of power dissipation and their temperature relation in CMOS VLSI circuits, and techniques for full-chip temperature calculation with special attention to its implications on the design of high-performance, low-power VLSI circuits The paper is concluded with an overview of techniques to improve the full-chip thermal integrity by means of off-chip versus on-chip and static versus adaptive methods

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Thermal Modeling, Analysis, and Management in VLSI Circuits: Principles and Methods

In this paper, we present a new low power test-per-clock BIST test pattern generator that provides test vectors which can reduce the switching activity during test operation. The proposed low power/energy BIST technique is based on a modified clock scheme for the TPG and the clock tree feeding the TPG. Numerous advantages can be found in applying such a technique during BIST.

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A modified clock scheme for a low power BIST test pattern generator

For many years, most computer architects have pursued one primary goal: performance. Architects have translated the ever-increasing abundance of ever-faster transistors provided by Moore's law into remarkable increases in performance. Recently, however, the bounty provided by Moore's law has been accompanied by several challenges that have arisen as devices have become smaller, including a decrease in dependability due to physical faults. In this book, we focus on the dependability challenge and the fault tolerance solutions that architects are developing to overcome it. The two main purposes of this book are to explore the key ideas in fault-tolerant computer architecture and to present the current state-of-the-art - over approximately the past 10 years - in academia and industry. Table of Contents: Introduction / Error Detection / Error Recovery / Diagnosis / Self-Repair / The Future

Fault Tolerant Computer Architecture

The technological development is enabling the production of increasingly complex electronic systems. All such systems must be verified and tested to guarantee their correct behavior. As the complexity grows, testing has become one of the most significant factors that contribute to the total development cost. In recent years, we have also witnessed the inadequacy of the established testing methods, most of which are based on low-level representations of the hardware circuits. Therefore, more work has to be done at abstraction levels higher than the classical gate and register-transfer levels. At the same time, the automatic test equipment based solutions have failed to deliver the required test quality. As a result, alternative testing methods have been studied, which has led to the development of built-in self-test (BIST) techniques. In this thesis, we present a novel hybrid BIST technique that addresses several areas where classical BIST methods have shortcomings. The technique makes use of both pseudorandom and deterministic testing methods, and is devised in particular for testing modern systems-on-chip. One of the main contributions of this thesis is a set of optimization methods to reduce the hybrid test cost while not sacrificing test quality. We have devel oped several optimization algorithms for different hybrid BIST architectures and design constraints. In addition, we have developed hybrid BIST scheduling methods for an abort-on-first-fail strategy, and proposed a method for energy reduction for hybrid BIST. Devising an efficient BIST approach requires different design modifications, such as insertion of scan paths as well as test pattern generators and signature analyzers. These modifications require careful testability analysis of the original design. In the latter part of this thesis, we propose a novel hierarchical test generation algorithm that can be used not only for manufacturing tests but also for testability analysis. We have also investigated the possibilities of generating test vectors at the early stages of the design cycle, starting directly from the behavioral description and with limited knowledge about the final implementation. Experiments, based on benchmark examples and industrial designs, have been carried out to demonstrate the usefulness and efficiency of the proposed methodologies and techniques.

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Hybrid Built-In Self-Test and Test Generation Techniques for Digital Systems

Electromigration results from the movement of metal ions as current flows through power wires in integrated circuits, causing voids and hillocks in the wires. The voids increase resistance or even cause opens in the wires, while hillocks can cause shorts to adjacent wires. This paper describes how electromigration is a ticking time bomb in IC designs, which can trigger a system failure at some undefined future time. The phenomenon is particularly likely to afflict the thin, tightly spaced power-distribution lines of deep-submicron designs.

T.K. Young

Papers

Electromigration: the time bomb in deep-submicron ICs