The purpose of this review is to discuss the development and the state of the art in dynamic testing techniques and dynamic mechanical behaviour of rock materials. The review begins by briefly introducing the history of rock dynamics and explaining the significance of studying these issues. Loading techniques commonly used for both intermediate and high strain rate tests and measurement techniques for dynamic stress and deformation are critically assessed in Sects. 2 and 3. In Sect. 4, methods of dynamic testing and estimation to obtain stress–strain curves at high strain rate are summarized, followed by an in-depth description of various dynamic mechanical properties (e.g. uniaxial and triaxial compressive strength, tensile strength, shear strength and fracture toughness) and corresponding fracture behaviour. Some influencing rock structural features (i.e. microstructure, size and shape) and testing conditions (i.e. confining pressure, temperature and water saturation) are considered, ending with some popular semi-empirical rate-dependent equations for the enhancement of dynamic mechanical properties. Section 5 discusses physical mechanisms of strain rate effects. Section 6 describes phenomenological and mechanically based rate-dependent constitutive models established from the knowledge of the stress–strain behaviour and physical mechanisms. Section 7 presents dynamic fracture criteria for quasi-brittle materials. Finally, a brief summary and some aspects of prospective research are presented.

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A Review of Dynamic Experimental Techniques and Mechanical Behaviour of Rock Materials

Structures, mechanical properties and applications of silk fibroin materials

Ordinary differential equations of the first order linear differential equations complex numbers and linear algebra simultaneous linear differential equations numerical methods the descriptive theory of nonlinear differential equations mechanical systems and electric circuits Fourier series Fourier integrals and Fourier transforms the Laplace transformation partial differential equations Bessel functions and Legendre polynomials applications and further properties of matrices vector analysis the calculus of variations analytic functions of a complex variable infinite series in the complex plane the theory of residues conformal mapping.

Advanced Engineering Mathematics. By C. R. Wylie. Pp. xiv, 813. 1966. (McGraw-Hill.)

Energy Scavenging for Wireless Sensor Nodes with a Focus on Vibration to Electricity Conversion by Shadrach Joseph Roundy Doctor of Philosophy in Mechanical Engineering University of California, Berkeley Professor Paul K. Wright, Chair The vast reduction in size and power consumption of CMOS circuitry has led to a large research effort based around the vision of ubiquitous networks of wireless communication nodes. As the networks, which are usually designed to run on batteries, increase in number and the devices decrease in size, the replacement of depleted batteries is not practical. Methods of scavenging ambient power for use by low power wireless electronic devices have been explored in an effort to make the wireless nodes and resulting wireless sensor networks indefinitely self-contained. After a broad survey of potential energy scavenging methods, the conversion of ambient vibrations to electricity was chosen as a method for further research. Converters based on both piezoelectric and electrostatic (capacitive) coupling were pursued. Both types of converters were carefully modeled. Designs were optimized based on the models developed within in total size constraint of 1 cm. Test results from the piezoelectric converters demonstrate power densities of about 200 μW/cm from input vibrations of 2.25 m/s at 120 Hz. Furthermore, test results matched simulated outputs very closely thus verifying the validity of the model as a basis for design. One of

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Energy Scavenging for Wireless Sensor Nodes with a Focus on Vibration-to-Electricity Conversion

http://fac.ksu.edu.sa/sites/default/files/arabian_journal_of_chemistry_5_2012_1-23.pdf

Carbon nanotubes, science and technology part (I) structure, synthesis and characterisation

Preface. Chapter 1: Overview of MEMS and Microsystems. 1.1 MEMS and Microsystem. 1.2 Typical MEMS and Microsystems Products. 1.3 Evolution of Microfabrication. 1.4 Microsystems and Microelectronics. 1.5 The Multidisciplinary Nature of Microsystems Design and Manufacture. 1.6 Microsystems and Miniaturization. 1.7 Application of Microsystems in Automotive Industry. 1.8 Application of Microsystems in Other Industries. 1.9 Markets for Microsystems. Problems. Chapter 2: Working Principles of Microsystems. 2.1 Introduction. 2.2 Microsensors. 2.3 Microactuation. 2.4 MEMS with Microactuators. 2.5 Microaccelerometers. 2.6 Microfluidics. Problems. Chapter 3: Engineering Science for Microsystems Design and Fabrication. 3.1 Introduction. 3.2 Atomic Structure of Matters. 3.3 Ions and Ionization. 3.4 Molecular Theory of Matter and Inter-molecular Forces. 3.5 Doping of Semiconductors. 3.6 The Diffusion Process. 3.7 Plasma Physics. 3.8 Electrochemistry. Problems. Chapter 4: Engineering Mechanics for Microsystems Design. 4.1 Introduction. 4.2 Static Bending of Thin Plates. 4.3 Mechanical Vibration. 4.4 Thermomechanics. 4.5 Fracture Mechanics. 4.6 Thin Film Mechanics. 4.7 Overview on Finite Element Stress Analysis. Problems. Chapter 5: Thermofluid Engineering and Microsystems Design. 5.1 Introduction. 5.2 Overview on the Basics of Fluid Mechanics in Macro and Mesoscales. 5.3 Basic Equations in Continuum Fluid Dynamics. 5.4 Laminar Fluid Flow in Circular Conduits. 5.5 Computational Fluid Dynamics. 5.6 Incompressible Fluid Flow in Microconduits. 5.7 Overview on Heat Conduction in Solids. 5.8 Heat Conduction in Multi-layered Thin Films. 5.9 Heat Conduction in Solids in Submicrometer Scale. Problems. Chapter 6: Scaling Laws in Miniaturization. 6.1 Introduction to Scaling. 6.2 Scaling in Geometry. 6.3 Scaling in Rigid-Body Dynamics. 6.4 Scaling in Electrostatic Forces. 6.5 Scaling of Electromagnetic Forces. 6.6 Scaling in Electricity. 6.7 Scaling in Fluid Mechanics. 6.8 Scaling in Heat Transfer. Problems. Chapter 7: Materials for MEMS and Microsystems. 7.1 Introduction. 7.2 Substrates and Wafers. 7.3 Active Substrate Materials. 7.4 Silicon as a Substrate Material. 7.5 Silicon Compounds. 7.6 Silicon Piezoresistors. 7.7 Gallium Arsenide. 7.8 Quartz. 7.9 Piezoelectric Crystals. 7.10 Polymers. 7.11 Packaging Materials. Problems. Chapter 8: Microsystems Fabrication Processes. 8.1 Introduction. 8.2 Photolithography. 8.3 Ion Implantation. 8.4 Diffusion. 8.5 Oxidation. 8.6 Chemical Vapor Deposition. 8.7 Physical Vapor Deposition - Sputtering. 8.8 Deposition by Epitaxy. 8.9 Etching. 8.10 Summary of Microfabrication. Problems. Chapter 9: Overview of Micromanufacturing. 9.1 Introduction. 9.2 Bulk Micromanufacturing. 9.3 Surface Micromachining. 9.4 The LIGA Process. 9.5 Summary on Micromanufacturing. Problems. Chapter 10: Microsystem Design. 10.1 Introduction. 10.2 Design Considerations. 10.3 Process Design. 10.4 Mechanical Design. 10.5 Mechanical Design Using Finite Element Method. 10.6 Design of Silicon Die of a Micropressure Sensor. 10.7 Design of Microfluidics Network Systems. 10.8 Computer-Aided Design. Problems. Chapter 11: Assembly, Packaging and Testing of Microsystems. 11.1 Introduction. 11.2 Overview of Microassembly. 11.3 The High Costs of Microassembly. 11.4 Microassembly Processes. 11.5 Major Technical Problems in Microassembly. 11.6 Microassembly Work Cells. 11.7 Challenging Issues in Microassembly. 11.8 Overview of Microsystems Packaging. 11.9 General Considerations in Packaging Design. 11.10 The Three Levels of Microsystems Packaging. 11.11 Interfaces in Microsystems Packaging. 11.12 Essential Packaging Technologies. 11.13 Die preparation. 11.14 Surface Bonding. 11.15 Wire bonding:. 11.16 Sealing and Encapsulation. 11.17 Three-dimensional Packaging. 11.18 Selection of Packaging Materials. 11.19 Signal Mapping and Transduction. 11.20 Design Case on Pressure Sensor Packaging. 11.21 Reliability in MEMS Packaging. 11.22 Testing for Reliability. Problems. Chapter 12: Introduction to Nanoscale Engineering. 12.1 Introduction. 12.2 Micro and Nanoscale Technologies. 12.3 General Principle in Nanofabrication. 12.4 Nanoproducts. 12.5 Applications of Nanoproducts. 12.6 Quantum Physics. 12.7 Molecular Dynamics. 12.8 Fluid Flow in Submicrometer and Nano Scales. 12.9 Heat Conduction in Nanoscale. 12.10 Measurement of Thermal Conductivity. 12.11 Challenges in Nanoscale Engineering. 12.12 Social Impacts of Nanoscale Engineering. Problems. Bibliography. Index.

MEMS and Microsystems: Design, Manufacture, and Nanoscale Engineering

MEMS and microsystems : design and manufacture

Cost effective packaging and robust reliability are two critical factors for successful commercialization of MEMS and microsystems While packaging contributes to the effective production cost of MEMS devices, reliability addresses consumer's confidence in and expectation on sustainable performance of the products There are a number of factors that contribute to the reliability of MEMS; packaging, in particular, in bonding and sealing, material characterization relating to operating and environmental conditions, credible design considerations, the techniques for mitigating intrinsic stresses/strains induced by fabrications and testing for reliability are a few of these factors This paper will offer an overview of these factors with proposed resolutions to issues relating to the reliability of these products

Reliability in MEMS Packaging

This paper presents a finite element algorithm for two-dimensional nonlinear inverse heat conduction analysis. The proposed method is capable of handling both unknown surface heat flux and unknown surface temperature of solids using temperature histories measured at a few discrete points. The proposed algorithms were used in the study of the thermofracture behavior of leaking pipelines with experimental verifications.

T.R. Hsu

Papers

MEMS and Microsystems: Design, Manufacture, and Nanoscale Engineering

MEMS and microsystems : design and manufacture

Reliability in MEMS Packaging

Finite Element Formulation for Two-Dimensional Inverse Heat Conduction Analysis

Fracture toughness of coal under quasi-static and impact loading