T
Takaaki Yasumoto
Researcher at Toshiba
Publications - 35
Citations - 652
Takaaki Yasumoto is an academic researcher from Toshiba. The author has contributed to research in topics: Electrode & Thin film. The author has an hindex of 14, co-authored 35 publications receiving 650 citations.
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Patent
Piezoelectric thin film device and method for manufacturing the same
Kenya Sano,Ryoichi Ohara,Naoko Yanase,Takaaki Yasumoto,Kazuhiko Itaya,Takashi Kawakubo,Hiroshi Toyoda,Masahiko Hasunuma,Toshihiko Nagano,Kazuhide Abe,Michihiko Nishigaki,Hironobu Shibata +11 more
TL;DR: In this article, a piezoelectric thin-film device is described, where one of the crystal axis of the thin film is aligned in a direction perpendicular to a surface of the amorphous metal.
Patent
Film bulk acoustic-wave resonator and method for manufacturing the same
Kenya Sano,Naoko Yanase,Kazuhiko Itaya,Takaaki Yasumoto,Ryoichi Ohara,Takashi Kawakubo,Takako Motai +6 more
TL;DR: In this article, a planar shape of the piezoelectric layer is defined by a contour, which covers an entire surface of the bottom electrode in a plan view.
Patent
Thin film piezoelectric actuator
Takashi Kawakubo,Ryoichi Ohara,Tomio Ono,Toshihiko Nagano,Michihiko Nishigaki,Takaaki Yasumoto,Kazuhide Abe,Kenya Sano +7 more
TL;DR: A thin film piezoelectric actuator comprises a driving part at least one end of which is supported by an anchor portion as mentioned in this paper, which is the driving part of the actuator.
Patent
Wafer-level package and its manufacturing method
TL;DR: In this article, a wafer-level package comprises: a first substrate, an electric element provided on the first substrate; a second substrate, a well, an internal electrode pad; and an external electrode pad.
Patent
Electronic component and electronic component connecting structure
TL;DR: In such electronic components as semiconductor packages and semiconductor chips which are possessed of groups of connecting bumps as input and output terminals, the groups of connected bumps comprise not less than two kinds of connecting bump different in melting point or not less in mechanical strength as mentioned in this paper.