T
Takashi Tokuda
Researcher at Tokyo Institute of Technology
Publications - 282
Citations - 3711
Takashi Tokuda is an academic researcher from Tokyo Institute of Technology. The author has contributed to research in topics: Image sensor & CMOS. The author has an hindex of 29, co-authored 280 publications receiving 3336 citations. Previous affiliations of Takashi Tokuda include National Presto Industries & Kyoto University.
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Proceedings ArticleDOI
Implantable micro CMOS imaging devices for biomedical applications
TL;DR: This paper reviews recent advancement of micro CMOS imaging devices to measure brain neural activities in an un-tethered mouse to realize to observe neural activity in deep brain regions of the brain.
Proceedings ArticleDOI
A multimodal sensing device for fluorescence imaging and electrical potential measurement of neural activities in a mouse deep brain
Jun Ohta,Ayato Tagawa,Hiroki Minami,Toshihiko Noda,Kiyotaka Sasagawa,Takashi Tokuda,Yumiko Hatanaka,Yasuyuki Ishikawa,Hideki Tamura,Sadao Shiosaka +9 more
TL;DR: A multimodal CMOS sensing device to detect fluorescence image and electrical potential for neural activities in a mouse deep brain and successfully operates in hippocampus area of an anesthetized mouse is developed.
Proceedings ArticleDOI
An optical and potential dual-image CMOS sensor for bioscientific applications
TL;DR: In this paper, a CMOS image sensor which can simultaneously capture optical and on-chip potential images was fabricated using a 0.35μm 2-poly, 4-metals standard CMOS process.
Proceedings ArticleDOI
An Optical/Potential/Voltammetric Multifunctional CMOS Image Sensor for On-chip Biomolecular/Neural Sensing Applications
TL;DR: In this article, an on-chip image sensor with target applications of onchip biomolecular and neural imaging was developed, which can sense not only intensity of incident light, but also onchip electric potential.
Proceedings ArticleDOI
Flexible and extendible neural stimulation/recording device based on cooperative multi-chip CMOS LSI architecture
TL;DR: A thin, flexible packaging technique was developed for the multi-chip neural stimulation/recording device and LSI-compatible Pt/Au stacked biocompatible bump electrode that made the device more suitable for in vivo applications than conventional single-chip devices.