A housing for an electronic device or other object formed from a fiber-in-matrix material. A layered fiber-in-matrix type material, such as CFRP, may be used. A spine made from CFRP may support, and be attached to, a CFRP skin. The CFRP spine may be a unitary frame that imparts strength and rigidity to the overall housing and also form at least some of the corners of the frame. In some embodiments, the spine may be rectangular. The skin may be formed from multiple layers of CFRP type material stacked atop each other. Each layer may be cut at one or more corners to expose at least a portion of the layer beneath. The skin may thus have an overall cross shape, such that each arm of the cross may be wrapped around a different side of the aforementioned rectangular spine.

Reinforced device housing

We report the design, fabrication and characterization of a leadsilicate glass highly nonlinear W-type fiber with a flattened and near-zero dispersion profile in the 1.55 µm region. The fiber was composed of three types of commercial lead silicate glasses. Effectively single-mode guidance was observed in the fiber at 1550nm. The nonlinear coefficient and the propagation loss at this wavelength were measured to be 820 W^-1km^-1 and 2.1dB/m, respectively. Investigations of the Brillouin threshold revealed no evidence of stimulated Brillouin scattering for continuous wave signal powers up to 29dBm in a 2m sample of the fiber. A broadband dispersion measurement confirmed the near-zero dispersion values and the flat dispersion profile around 1550nm, in good agreement with our simulations. Efficient four-wave-mixing, tunable across the whole C-band, was demonstrated in a 2.2m length of the fiber.

Near-zero dispersion, highly nonlinear lead-silicate W-type fiber for applications at 1.55 microm.

The invention discloses a chemically mechanical polishing method, which comprises the following steps: (A) measuring the film thickness previous values of a plurality of points on a wafer by utilizing a terminal measuring device; (B) carrying out chemically mechanical polishing on the wafer according to the film thickness previous values of the points; and (C) measuring the film thickness final values of the points by utilizing the terminal measuring device, and judging whether the surface polishing thickness of the wafer is even or not according to the film thickness final values of the points; if the surface polishing thickness of the wafer is not even, carrying out the chemically mechanical polishing on the wafer according to the difference of the film thickness previous values and the film thickness final values of the points until the surface polishing thickness of the wafer is even. When the chemically mechanical polishing method disclosed by the embodiment of the invention is utilized to carry out the chemically mechanical polishing on the wafer, an online measuring device does not need to be used any longer, thereby, not only can the structure of chemically mechanical polishing equipment for carrying out the chemically mechanical polishing be greatly simplified, and the cost of the chemically mechanical polishing equipment be reduced, but also the chemically mechanical polishing cost of the wafer is greatly reduced.

Chemically mechanical polishing method

An electronic grade synthetic quartz glass substrate having a recess, channel or step is manufactured by machining at least one surface of a synthetic quartz glass substrate having a maximum birefringence of up to 3 nm/cm in its entirety to form a recess, channel or step, and removing the residual stress due to machining.

Method for manufacturing electronic grade synthetic quartz glass substrate

Certain embodiments disclosed herein relate to apparatuses and methods for intricate cuts. In particular, in one embodiment, a cutting apparatus is provided. The cutting apparatus includes a base member and an elongate member extending from the base member. The elongate member includes a tapered region having an abrasive surface. The tapered region defines at least one vertex defining an angle of a desired cutout shape. Additionally, the tapered region is toothless.

Apparatus and method for intricate cuts

An object of the present invention is to provide a polishing method for producing, in a relatively short period of time, a tubular brittle material having an inner surface of high surface precision with a maximum roughness Rmax of 01 µm or smaller and a center line average roughness Ra of 001 µm or smaller, and to provide a tubular brittle material with high precision using said polishing method The polishing method according to the invention is characterized by that the inner surface of the tubular material being pre-cut into a tubular shape using a honing machine is further polished with a sheet material having diamond abrasives attached thereon Also claimed is a tubular brittle material obtained by said polishing method

Polishing method for inner surface of tubular brittle material and tubular brittle material obtained by polishing method

PROBLEM TO BE SOLVED: To provide a polishing method for manufacturing a high profile irregularity tubular brittle material with the maximum roughness Rmax of the inner surface of 0.1 μm or less, the center line average roughness of 0.1 μm or less in a comparatively short time, and a high profile irregularity tubular brittle material obtained by the polishing method. SOLUTION: According to this polishing method for polishing the inner surface of the tubular brittle material with good profile irregularity, the inner surface of brittle material previously ground to be tubular by a honing machine is polished with paper to which diamond abrasive grains adhere. COPYRIGHT: (C)2004,JPO&NCIPI

Takeo Tsumuraya

Papers

Polishing method for inner surface of tubular brittle material and tubular brittle material obtained by polishing method

Inner surface polishing method of tubular brittle material and tubular brittle material obtained by the polishing method

Polishing method for inner surface of tubular brittle material and material obtained by the method