Templating strategies for 3D-structured thermally conductive composites: Recent advances and thermal energy applications

Heat dissipation efficiency and electromagnetic interference (EMI) shielding performance are vital to integration, miniaturization, and application of electronic devices. Flexible and designable polymer-based composites are promising candidates but suffer from unavoidable interfacial thermal resistances, anisotropic thermal conductivity, and low shielding of EMI limiting application. Herein, multifunctional epoxy resin (EP)-based composites with an interconnected carbon fibers (CFs) network structure containing a low thermal resistance interfacial were prepared by high-temperature calcination and infiltration. The coherent heat and electron transfer pathways constructed with self-oriented CFs cloth connected by carbon nanotubes (CNTs) converted from leaf-shaped zeolitic imidazolate frameworks (ZIF-L) and stable magnetic property provided by cobalt nanoparticles contained in the CNTs made composites to an integrated in-plane thermal conductivity of up to 7.50 W m-1 K-1, a through-plane thermal conductivity of 1.96 W m-1 K-1, and an EMI shielding effectiveness of 38.4 dB. Furthermore, the mechanical properties of CFs and the junction effect of CNTs endowed the composites with stability of mechanical property, thermal conductivity, and EMI shielding effectiveness after multiple bendings. The finite element simulation further verified the advantage of CFs network linked by CNTs on heat transfer. This work provides the desired design for the construction of a multifunctional polymer-based composite used in advanced electronic equipment.

Design of Interconnected Carbon Fiber Thermal Management Composites with Effective EMI Shielding Activity.

Anti-oxidation polyimide-based hybrid foams assembled with bilayer coatings for efficient electromagnetic interference shielding

Lewis Acidic Molten Salts Etching Route Driven Construction of Double-Layered Mxene-Fe/Carbon Nanotube/Silicone Rubber Composites for High-Performance Microwave Absorption

Lewis acidic molten salts etching route driven construction of double-layered MXene-Fe/carbon nanotube/silicone rubber composites for high-performance microwave absorption

The rapid increase of operation speed, transmission efficiency, and power density of miniaturized devices leads to a rising demand for electromagnetic interference (EMI) shielding and thermal management materials in the semiconductor industry. Therefore, it is essential to improve both the EMI shielding and thermal conductive properties of commonly used polyolefin components (such as polyethylene (PE)) in electronic systems. Currently, melt compounding is the most common method to fabricate polyolefin composites, but the difficulty of filler dispersion and high resistance at the filler/filler or filler/matrix interface limits their properties. Here, a fold fabrication strategy was proposed to prepare PE composites by incorporation of a well-aligned, seamless graphene framework premodified with MXene nanosheets into the matrix. We demonstrate that the physical properties of the composites can be further improved at the same filler loading by nanoscale interface engineering: the formation of hydrogen bonds at the graphene/MXene interface and the development of a seamlessly interconnected graphene framework. The obtained PE composites exhibit an EMI shielding property of ∼61.0 dB and a thermal conductivity of 9.26 W m-1 K-1 at a low filler content (∼3 wt %, including ∼0.4 wt % MXene). Moreover, other thermoplastic composites with the same results can also be produced based on our method. Our study provides an idea toward rational design of the filler interface to prepare high-performance polymer composites for use in microelectronics and microsystems.

Enhanced Electromagnetic Shielding and Thermal Conductive Properties of Polyolefin Composites with a Ti3C2Tx MXene/Graphene Framework Connected by a Hydrogen-Bonded Interface.

The low ionic conductivity of poly(ethylene oxide) (PEO)‐based polymer electrolytes at room temperature and the undesired lithium‐dendrite growth at Li|PEO interface impede their further application. Herein, a PEO polymer is regulated at the molecular level through a copper ion (Cu2+) coordination effect with both PEO and Li salts to achieve a high Li+ conductivity of 0.2 mS cm−1 and a transference number of 0.42 at 30 °C. Moreover, the Cu‐coordinated PEO electrolyte is neither sticky nor hygroscopic because the hydrophilic oxygen groups in PEO are terminated by Cu ions. Furthermore, the in situ formed F/Li‐rich inorganic layer induced by CuF2 additive accelerates Li+ transport kinetics and enables uniform Li+ deposition during Li plating/stripping. As a result, the Cu2+‐coordinated PEO electrolytes deliver a high critical current density of 1.5 mA cm−2 at 30 °C. An all‐solid‐state Li‐LiNi0.83Co0.12Mn0.05O2 (NCM83) battery with such a copper coordinated PEO electrolyte exhibits a long cycle life over 500 cycles with a capacity retention of 71% under 0.6 C at 30 °C. When the mass loading increases to a record high of 7 mg cm−2, the Li‐NCM83 cell delivers a high areal capacity of 1.07 mAh cm−2 under 0.1 C at 30 °C.

Enabling All‐Solid‐State Li Metal Batteries Operated at 30 °C by Molecular Regulation of Polymer Electrolyte

ADVERTISEMENT RETURN TO ISSUEPREVAdditions and Correc...Additions and CorrectionsNEXTORIGINAL ARTICLEThis notice is a correctionCorrection to Tailoring Highly Ordered Graphene Framework in Epoxy for High-Performance Polymer-Based Heat Dissipation PlatesJunfeng YingJunfeng YingMore by Junfeng Ying, Xue TanXue TanMore by Xue Tan, Le LvLe LvMore by Le Lv, Xiangze WangXiangze WangMore by Xiangze Wang, Jingyao GaoJingyao GaoMore by Jingyao Gao, Qingwei YanQingwei YanMore by Qingwei Yan, Hongbing MaHongbing MaMore by Hongbing Ma, K. NishimuraK. NishimuraMore by K. Nishimura, He LiHe LiMore by He Li, Jinhong YuJinhong YuMore by Jinhong Yuhttps://orcid.org/0000-0001-9134-7568, Te-Huan LiuTe-Huan LiuMore by Te-Huan Liuhttps://orcid.org/0000-0003-2662-2847, Rong XiangRong XiangMore by Rong Xianghttps://orcid.org/0000-0002-4775-4948, Rong SunRong SunMore by Rong Sunhttps://orcid.org/0000-0001-9719-3563, Nan Jiang*Nan JiangMore by Nan Jiang, Chingping WongChingping WongMore by Chingping Wonghttps://orcid.org/0000-0003-3556-8053, Shigeo MaruyamaShigeo MaruyamaMore by Shigeo Maruyamahttps://orcid.org/0000-0003-3694-3070, Cheng-Te Lin*Cheng-Te LinMore by Cheng-Te Linhttps://orcid.org/0000-0002-7090-9610, and Wen Dai*Wen DaiMore by Wen Daihttps://orcid.org/0000-0003-0601-5150Cite this: ACS Nano 2022, 16, 11, 19607–19608Publication Date (Web):November 7, 2022Publication History Received28 October 2022Published online7 November 2022Published inissue 22 November 2022https://doi.org/10.1021/acsnano.2c10767Copyright © 2022 American Chemical SocietyRIGHTS & PERMISSIONSArticle Views609Altmetric-Citations-LEARN ABOUT THESE METRICSArticle Views are the COUNTER-compliant sum of full text article downloads since November 2008 (both PDF and HTML) across all institutions and individuals. These metrics are regularly updated to reflect usage leading up to the last few days.Citations are the number of other articles citing this article, calculated by Crossref and updated daily. Find more information about Crossref citation counts.The Altmetric Attention Score is a quantitative measure of the attention that a research article has received online. Clicking on the donut icon will load a page at altmetric.com with additional details about the score and the social media presence for the given article. Find more information on the Altmetric Attention Score and how the score is calculated. Share Add toView InAdd Full Text with ReferenceAdd Description ExportRISCitationCitation and abstractCitation and referencesMore Options Share onFacebookTwitterWechatLinked InReddit PDF (4 MB) Get e-AlertsSUBJECTS:Coating materials,Manufacturing,Organic polymers,Tailoring,Two dimensional materials Get e-Alerts 

https://pubs.acs.org/doi/pdf/10.1021/acsnano.2c10767

Correction to Tailoring Highly Ordered Graphene Framework in Epoxy for High-Performance Polymer-Based Heat Dissipation Plates.

The rapid development of highly integrated microelectronic devices causes urgent demands for advanced thermally conductive adhesives (TCAs) to solve the interfacial heat transfer issue. Due to their natural two-dimensional structure and isotropic thermal conductivity, metal nanoflakes are promising fillers blended with polymer to develop high-performance TCAs. However, achieving corresponding TCAs with thermal conductivity over 10 W m-1 K-1 at filler content below 30 vol% remains challenging so far. This longstanding bottleneck is mainly attributed to the fact that most current metal nanoflakes are prepared by "bottom-up" processes (e. g., solution-based chemical synthesis) and inevitably contain lattice defects or impurities, resulting in lower intrinsic thermal conductivities, only 20 - 65% of the theoretical value. Here, a "top-down" strategy by splitting highly purified Ag foil with nanoscale thickness was adopted to prepare two-dimensional Ag nanoflakes with an intrinsic thermal conductivity of 398.2 W m-1 K-1 , reaching 93% of the theoretical value. After directly blending with epoxy, the resultant Ag/epoxy exhibited a thermal conductivity of 15.1 W m-1 K-1 at low filler content of 18.6 vol%. Additionally, in practical microelectronic cooling performance evaluations, the interfacial heat-transfer efficiency of our Ag/epoxy achieved ≈ 1.4 times that of the state-of-the-art commercial TCA. This article is protected by copyright. All rights reserved.

Te-Huan Liu

Papers

Enhanced Electromagnetic Shielding and Thermal Conductive Properties of Polyolefin Composites with a Ti3C2Tx MXene/Graphene Framework Connected by a Hydrogen-Bonded Interface.

Enabling All‐Solid‐State Li Metal Batteries Operated at 30 °C by Molecular Regulation of Polymer Electrolyte

Correction to Tailoring Highly Ordered Graphene Framework in Epoxy for High-Performance Polymer-Based Heat Dissipation Plates.

Near-Theoretical Thermal Conductivity Silver Nanoflakes as Reinforcements in Gap-Filling Adhesives.