A substrate processing method which can reduce the number of particles to be left on each substrate is provided. In the substrate processing method, substrates W to be processed are dried, by using a fluid heated by a heating apparatus having one or more heating mechanisms. The substrate processing method comprises a first step of supplying a mixed fluid containing a gas and a processing liquid and heated by the heating apparatus, into a processing chamber in which the substrates to be processed are placed, and a second step of supplying the heated gas into the processing chamber. The output of at least one of the heating mechanisms is kept at a preset constant value for a period of time during which a predetermined time passes after the start of the first step. In the second step, the output of the heating mechanism is determined under a feed back control.

Substrate processing method, substrate processing apparatus, and program storage medium

The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a gas-liquid mixture by mixing a liquid and a pressurized gas, to discharge the gas-liquid mixture to a substrate at high speeds. The mixture process is conducted in an open space out of the nozzle, and change in the supply pressure of the gas does not affect the supply of the liquid. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the gas-liquid mixture, whereby the quality of the process is improved.

Substrate cleaning apparatus

Surface cleaning, chemical treatment and drying of semiconductor substrates is carried out using foam as a medium instead of a condensed phase liquid medium. In cleaning and chemical treatment, by introducing a foam into an overflow vessel the foam is caused to pass over the substrate in moving contact therewith. Drying of the substrate is carried out, using a water solution of carbon dioxide in a pressurizable vessel. By releasing the pressure in the vessel, a layer of foam is established on the surface of the solution. The solution is discharged from the vessel, causing the foam layer to pass over the substrate in moving contact therewith. The carbon dioxide reduces the surface tension of the water, thereby enabling the foam layer to be produced and also assisting in the elimination of water from the surface of the substrate. In both cases, the use of foam reduces materials requirements and also reduces the quantity of particles deposited onto the substrate in the treatment process.

Surface treatment of semiconductor substrates

The present invention relates to liquid projection apparatus in the form of a face-shooter array. Material layers are used as the basis to fabricate the device to overcome constructional difficulties associated with other technologies. The device utilizes excitation of the surface layers (100) incorporating nozzles (8) which are arranged over one surface layer with addressability, forming a liquid projection array, capable of operation at high frequencies with a wide range of liquids.

Liquid projection apparatus

An aseptic product dispensing system (10) generally includes a sanitary connection assembly (11) interposed in fluid communication with a substantially conventional aseptic product source (12) and a substantially conventional product dispenser (13). The sanitary connection assembly (11) is provided with an automated cleaning system (14) whereby a combination of pressurized gas (15), flushing fluid (16) and/or sanitizing solution (17) may be injected into, and thereafter evacuated from, the sanitary connection assembly (11).

Aseptic product dispensing system

Methods for cleaning and/or drying objects that may have been wetted or contaminated in a manufacturing process. The objects are submerged in a rinse liquid in an enclosed chamber, and aerosol particles from a selected liquid are introduced into the chamber above the rinse liquid surface, forming a thin film on this surface. As the rinse liquid is slowly drained, some aerosol particles settle onto the exposed surfaces of the objects, and displace and remove rinse liquid residues from the exposed surfaces, possibly by a "chemical squeegeeing" effect. Surface contaminants are also removed by this process which may be performed at about room temperature. Chamber pressure is maintained at or near the external environment pressure as the rinse liquid is drained from the chamber. Inert gas flow is employed to provide aerosol particles of smaller size and/or with greater dispersion within the chamber. Continuous filtering and shunt filtering are employed to remove most contaminants from the selected liquid. A flow deflector redirects initial flow of the selected liquid to a supplementary filter, to remove most of the contaminant particle "spike" that appears when a system is first (re)activated. An improved surface for aerosol particle production is provided.

Methods for drying and cleaning of objects using aerosols and inert gases

Methods for drying and cleaning objects that may have been wetted or contaminated in a manufacturing process. The objects are submerged in a rinse liquid in an enclosed chamber, and aerosol particles from a selected liquid are introduced into the chamber above the rinse liquid surface, forming a thin film on this surface. As the rinse liquid is slowly drained, some aerosol particles settle onto the exposed surfaces of the objects, and displace and remove rinse liquid residues from the exposed surfaces, possibly by a "chemical squeegeeing" effect. Surface contarminants are also removed by this process, which may be carried out at or near room temperature. Chamber pressure is maintained at or near the external environment pressure as the rinse liquid is drained from the chamber.

Methods for drying and cleaning objects using aerosols

Method and apparatus for cleaning and/or drying objects that may have been wetted or contaminated in a manufacturing process. The objects are submerged in a rinse liquid in an enclosed chamber, and aerosol particles from a selected liquid are introduced into the chamber above the rinse liquid surface, forming a thin film on this surface. As the rinse liquid is slowly drained, some aerosol particles settle onto the exposed surfaces of the objects, and displace and remove rinse liquid residues from the exposed surfaces by a “chemical squeegeeing” effect. Surface contaminants are also removed by this process. Chamber pressure is maintained at or near the external environment pressure as the rinse liquid is drained from the chamber. Inert gas flow is employed to provide aerosol particles of smaller size and/or with greater dispersion within the chamber. Continuous filtering and shunt filtering are employed to remove most contaminants from the selected liquid. A flow deflector redirects initial flow of the selected liquid to a supplementary filter, to remove most of the contaminant particle “spike” that appears when a system is first (re)activated. An improved surface for aerosol particle production is provided.

Apparatus for drying and cleaning objects using controlled aerosols and gases

Method and apparatus for drying and cleaning objects (13A, 13B, 13C) that may have been wetted or contaminated in a manufacturing process. The objects are submerged in a rinse liquid (27) in an enclosed chamber (11), and aerosol particles (39) from a selected liquid (37) are introduced into the chamber above the rinse liquid surface (29), forming a thin film (30) on this surface. As the rinse liquid is slowly drained (41), some aerosol particles settle onto the exposed surfaces (14A, 14B, 14C) of the objects, and displace and remove rinse liquid residues from the exposed surfaces by a 'chemical squeegeeing' effect. Surface contaminants are also removed by this process. Chamber pressure is maintained at or near the external environment pressure as the rinse liquid is drained from the chamber.

Thomas D. Spencer

Papers

Methods for drying and cleaning of objects using aerosols and inert gases

Methods for drying and cleaning objects using aerosols

Apparatus for drying and cleaning objects using controlled aerosols and gases

Method and apparatus for drying and cleaning objects using aerosols