Patent
Methods for drying and cleaning objects using aerosols
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TLDR
In this paper, the objects are submerged in a rinse liquid in an enclosed chamber, and aerosol particles from a selected liquid are introduced into the chamber above the rinse liquid surface, forming a thin film on this surface.Abstract:
Methods for drying and cleaning objects that may have been wetted or contaminated in a manufacturing process. The objects are submerged in a rinse liquid in an enclosed chamber, and aerosol particles from a selected liquid are introduced into the chamber above the rinse liquid surface, forming a thin film on this surface. As the rinse liquid is slowly drained, some aerosol particles settle onto the exposed surfaces of the objects, and displace and remove rinse liquid residues from the exposed surfaces, possibly by a "chemical squeegeeing" effect. Surface contarminants are also removed by this process, which may be carried out at or near room temperature. Chamber pressure is maintained at or near the external environment pressure as the rinse liquid is drained from the chamber.read more
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Wafer drying device and method
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References
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Patent
Process and apparatus for treating wafers with process fluids
TL;DR: In this article, an enclosed full-flow method and apparatus for the cleaning and other wet processing of semiconductor wafers is presented. But this method does not require movement or operator handling of the wafer between processing steps.
Patent
Spin cleaning method
TL;DR: In this article, a semiconductor wafer is held and rotated by a spin chuck, and supplied with a hydrofluoric acid solution from a chemical liquid nozzle to remove natural oxide films on the wafer.
Patent
Method and system for fluid treatment of semiconductor wafers
TL;DR: In this paper, a method for fluid treatment of semiconductor wafers includes a treatment vessel having opposed first and second ports, and means for holding wafer in a flow path there between.
Patent
Apparatus for rinsing and drying surfaces
TL;DR: In this article, an automatic refill mechanism produces saturated drying vapor which may then be flashed to a superheated vapor prior to contacting the surfaces, which preferably are at the same temperature as the vapor.