Three-dimensional (3D) integrated circuits (ICs), which contain multiple layers of active devices, have the potential to dramatically enhance chip performance, functionality, and device packing density. They also provide for microchip architecture and may facilitate the integration of heterogeneous materials, devices, and signals. However, before these advantages can be realized, key technology challenges of 3D ICs must be addressed. More specifically, the processes required to build circuits with multiple layers of active devices must be compatible with current state-of-the-art silicon processing technology. These processes must also show manufacturability, i.e., reliability, good yield, maturity, and reasonable cost. To meet these requirements, IBM has introduced a scheme for building 3D ICs based on the layer transfer of functional circuits, and many process and design innovations have been implemented. This paper reviews the process steps and design aspects that were developed at IBM to enable the formation of stacked device layers. Details regarding an optimized layer transfer process are presented, including the descriptions of 1) a glass substrate process to enable through-wafer alignment; 2) oxide fusion bonding and wafer bow compensation methods for improved alignment tolerance during bonding; 3) and a single-damascene patterning and metallization method for the creation of high-aspect-ratio (6:1 108 vias/cm2), and extremely aggressive wafer-to-wafer alignment (submicron) capability.

Three-dimensional integrated circuits

The disclosure relates to computer systems. One example is a portable computer having a housing, a processor and memory mounted within the housing. The portable computer also has a docking cradle integrated into the housing to dock a handheld computing device and to interface the handheld computing device with the processor, the docking cradle having a fixedly movable receiving surface.

Portable computer with integrated PDA I/O docking cradle

Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles. Novel microchannel structures are also described.

Electroosmotic microchannel cooling system

A smoking article includes identification information encoded on the smoking article. The smoking article can be used with an electrically heated smoking system having a detector for detecting the smoking article and distinguishing the smoking article from other articles based on the identification information. A cleaning article includes identification information encoded on the cleaning article. The cleaning article cleans an electrically heated smoking system having a detector for detecting the cleaning article and distinguishing the cleaning article from other articles based on the identification information. An electrically heated smoking system for receiving an article configured for use with the smoking system includes: a cavity for receiving the article having identification information encoded thereon, a heating element, a power supply, electrical hardware, and a detector capable of detecting the presence of the article in the cavity and distinguishing the article from other articles based on the identification information.

Article Including Identification Information for Use in an Electrically Heated Smoking System

Provided are a method, system, and program for managing multiple resources in a system at a service level, including at least one host, network, and a storage space comprised of at least one storage system that each host is capable of accessing over the network. A plurality of service level parameters are measured and monitored indicating a state of the resources in the system. A determination is made of values for the service level parameters and whether the service level parameter values satisfy predetermined service level thresholds. Indication is made as to whether the service level parameter values satisfy the predetermined service thresholds. A determination is made of a modification to one or more resource deployments or configurations if the value for the service level parameter for the resource does not satisfy the predetermined service level thresholds.

Method, system, and program for determining a modification of a system resource configuration

An air-cooled information processing apparatus has a plurality of units and a casing accommodating the units. At least one cooling air supply section and at least one cooling air discharge section are provided in the casing, for supplying cooling air into the apparatus and for discharging the air therefrom. A partition member divides the space inside the casing so as to define at least two cooling air flow channels between the cooling air supply section and the cooling air discharge section. At least one main fan unit is disposed in each of the cooling air flow channels. The cooling air flow channels include at least one first cooling air flow channel in which at least two units from among the plurality of units are disposed in parallel with each other with respect to the direction of flow of cooling air, and at least one second cooling air flow channel in which at least two units from among the plurality of units are arranged in series to each other along the flow of cooling air. This cooling arrangement ensures optimum cooling for different types of units in the apparatus, without being accompanied by rise in the noise level, rate of discharge of air, power consumption and production cost.

Air-cooled information processing apparatus having cooling air fan, sub-fan, and plural separated cooling air flow channels

A cooling system for cooling an electronic device by allowing a cooling fluid to flow in contact with heat generating components such as LSI chips of the electronic device arranged in series along the major flow of the cooling fluid. The cooling system has heat radiation fins attached to the heat-generating components, and a cooling duct defining a cooling fluid flow passage in which assemblies composed of the heat-generating components and the heat radiation fins are disposed. The flow passage has, at the upstream end of the upstream end assembly, a cross-sectional area greater than that of the assembly when taken in a plane perpendicular to the direction of the major flow of the cooling fluid. The cross-sectional area of the flow passage progressively decreases towards the downstream end, whereby the flow passage is divided into a main passage through which a main flow component of the cooling fluid directly flows into the series of assemblies and an auxiliary passage through which an auxiliary component of the cooling fluid flows substantially vertically towards the heat-generating component to impinge upon the heat generating component.

Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system

In a cooling apparatus of an electronic equipment, a plurality each of integrated circuit devices and large-scale integrated circuit devices are mounted onto a plurality of substrates, respectively, and a cooling fan supplies cooling air from outside to each of these integrated circuit devices A duct having a comb-tooth shape suitable for encompassing each substrate and defining flow paths along the substrates introduces the cooling air supplied by the cooling fan to each of the integrated circuit devices The duct includes a plurality of small holes disposed at positions corresponding to the positions of the integrated circuit devices on the substrates and having open areas corresponding to the heating values of the integrated circuit devices The small holes flow the cooling air supplied by the cooling fan as jet streams to the integrated circuit devices This jet stream cooling improves cooling performance and can make uniform the temperature distribution of the integrated circuit devices

Cooling apparatus of electronic equipment

A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.

Liquid impingement cooling module for semiconductor devices

In a small-sized computer of a natural air-cooling type, a high-temperature radiator promotes natural convection so as to increase a quantity of heat radiation and to raise the allowable limit of heat generation of LSI chips, thereby improving the processing speed of the computer. For this purpose, a casing and fins are utilized as heat radiators at relatively low temperatures of about 40° C. which are safe even if they are touched by an operator's hands. On the other hand, the high-temperature radiator set at about 50° to 60° C. is provided inside of the casing, thus preventing the operator's hands from touching it directly. Heat generated by the LSI chips and so forth is transmitted to the high-temperature radiator through heat conduction or the like, and heat exchange is performed between the high-temperature radiator increased in temperature and the air introduced into the casing, in order to promote natural convection inside of the casing.

Toshio Hatada

Papers

Air-cooled information processing apparatus having cooling air fan, sub-fan, and plural separated cooling air flow channels

Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system

Cooling apparatus of electronic equipment

Liquid impingement cooling module for semiconductor devices

Packaging structure of small-sized computer