Zeolite compositions having enhanced compressive strength and methods therefor are provided. In particular, methods and compositions for wellbore treating fluids, especially settable spotting fluids having enhanced compressive strength are provided.

Zeolite compositions having enhanced compressive strength

In one embodiment the invention is a polymerizable composition comprising a) an organoborane amine complex; b) one or more of monomers, oligomers or polymers having olefinic unsaturation which is capable of polymerization by free radical polymerization; c) one or more compounds, oligomers or prepolymers having a siloxane backbone and reactive moieties capable of polymerization; and d) a catalyst for the polymerization of the one or more compounds, oligomers or prepolymers having a siloxane backbone and reactive moieties capable of polymerization. This composition may further comprise a compound which causes the organoborane amine complex to disassociate. In a preferred embodiment, the two part composition further comprises a compound which is reactive with both the b) one or more of monomers, oligomers or polymers having olefinic unsaturation which is capable of polymerization by free radical polymerization; and the c) one or more compounds, oligomers or prepolymers having a siloxane backbone and reactive moieties capable of polymerization. This composition can be polymerized by contacting the two parts of the composition. In another embodiment the invention is an organoborane amine complex comprising an alkyl borane having ligands which are alkyl, cycloalkyl or both and an amino siloxane.

Amine organoborane complex initiated polymerizable compositions containing siloxane polymerizable components

The invention is a two part composition useful for initiating cure of one or more polymerizable monomers which cure when exposed to free radicals comprising in one part an organoboraneamine complex and in a second part an isocyanate which is capable of decomplexing the organoborane complex wherein the ratio of amine nitrogen atoms to boron atoms is greater than 4.0:1.0. In another embodiment the invention is a two part polymerizable composition comprising part 1, a) an organoborane amine complex; and part 2, b) one or more of monomers, oligomers or polymers having olefinic unsaturation which is capable of polymerization by free radical polymerization c) an effective amount of a compound which causes the complex to disassociate thereby freeing the borane to initiate polymerization of the one or more monomers, oligomers or polymers having olefinic unsaturation wherein the compound which causes disassociation of the complex is kept separate from the complex until initiation of polymerization is desired; and d) a material which manages the heat of the polymerization reaction such that adhesion to the substrate is maintained, which material can be located in either part 1, part 2 or both parts.

Organoborane amine complex polymerization initiators and polymerizable compositions

A composition for use as a thermal interface material in a heat-generating electronic device is provided. The composition comprises a blend of acrylic polymer, one or more liquid resins, conductive filler particles and optionally one or more solid resins.

Thermal interface material

The invention is polymerizable compositions comprising in one part an organoboron compound capable of forming a free radical generating species and a stabilizing amount of one or more compounds comprising a dihydrocarbyl hydroxyl amine, an alicyclic hydroxyl amine, or a nitrile oxide of a dihydrocarbyl hydroxyl amine or an alicyclic hydroxyl amine, and in the second part one or more compounds capable of free radical polymerization.

Stabilized organoborane polymerization initiators and polymerizable compositions

An adhesive for a flexible printed circuit board and the method of preparing the same where the adhesive displays excellent migration inhibition, moisture adsorption resistance, and superior peeling strength, heat resistance, solvent resistance, chemical resistance, flexibility, and electrical properties. The adhesive is prepared by pre-polymerizing an epoxy resin, a COOH-containing rubber, a filler, and a primary catalyst in a solvent using a tertiary amine as a primary catalyst to form a prepolymer, followed by curing the prepolymer using a curing agent and a curing catalyst. The adhesive is coated on a plastic film, dried and laminated with a copper foil and then cured at an elevated temperature to form a substrate.

Tseng-Young Tseng

Papers

Preolymerizing epoxy resin, functionalized rubber with filler to form adhesive