A novel approach of mechanical chemical grinding

Spark plasma sintering of TiC–SiCw ceramics

Precision is one of the most important aspects of manufacturing. High precision creates high quality, high performance, exchangeability, reliability, and added value for industrial products. Over the past decades, remarkable advances have been achieved in the area of high-precision manufacturing technologies, where the form accuracy is approaching the nanometer level and surface roughness the atomic level. These extremely high precision manufacturing technologies enable the development of high-performance optical elements, semiconductor substrates, biomedical parts, and so on, thereby enhancing the ability of human beings to explore the macro- and microscopic mysteries and potentialities of the natural world. In this paper, state-of-the-art high-precision material removal manufacturing technologies, especially ultraprecision cutting, grinding, deterministic form correction polishing, and supersmooth polishing, are reviewed and compared with insights into their principles, methodologies, and applications. The key issues in extreme precision manufacturing that should be considered for future R&D are discussed.

https://iopscience.iop.org/article/10.1088/2631-7990/ab1ff1/pdf

Manufacturing technologies toward extreme precision

Industries demand stringent requirements towards economical machining without hindering the surface quality while cutting high carbon high chromium (HcHcr) steel. Electrical discharge machining (EDM) of HcHcr steel aims at reducing machining cost (i.e., maximize material removal rate (MRR) and minimize tool wear rate (TWR)) with good surface quality (i.e., minimize surface roughness (SR)). A comparative study was carried out on EDM of HcHcr D2 steel (DIN EN ISO 4957) by applying Taguchi L18 experimental design considering different electrode materials (copper, graphite, and brass), dielectric fluids (distilled water and kerosene), peak current, and pulse-on-time. The process performances were analyzed with respect to material removal rate, surface roughness, and tool wear rate. Pareto analysis of variance was employed to estimate the significance of the process variables and their optimal levels for achieving lower SR and TWR and higher MRR. Hybrid Taguchi-CRITIC-Utility and Taguchi-PCA-Utility methods were implemented to determine the optimal EDM parameters. Higher MRR of 0.0632 g/min and lower SR of 1.68 µm and TWR of 0.012 g/min was attained by graphite electrode in presence of distilled water as dielectric fluid compared to the brass and copper. Additionally, a metallographic analysis was carried out to study the surface integrity on the machined surfaces. Micrographic analysis of the optimal conditions showed lower surface roughness and fewer imperfections (lesser impression, waviness surface, and micro-cracks) compared to worst conditions.

Experimental analysis and optimization of EDM parameters on HcHcr steel in context with different electrodes and dielectric fluids using hybrid Taguchi-based PCA-Utility and CRITIC-Utility approaches

Reaction-bonded silicon carbide (RB-SiC) ceramic, one of the best candidates for large optical mirrors, is difficult to machine because of its high hardness and brittleness. A hybrid process called electrical discharge diamond grinding (EDDG) exhibits potential for improving the machinability of RB-SiC by combining electrical discharge machining (EDM) and diamond grinding. However, this hybrid process leads to damages that differ from those in conventional processes owing to the simultaneous actions of EDM and diamond grinding. In the present study, surface and subsurface damages induced by the interactions between EDM and diamond grinding during the EDDG of RB-SiC were examined. The effect of the discharge energy was considered. The surface and subsurface topographies and microstructures were characterized via scanning electron microscopy, Raman spectroscopy, and transmission electron microscopy. The EDM and grinding zones exhibited distinctive surface topographies and different dominant material removal mechanisms. An increase in the discharge energy facilitated ductile removal of the material and decomposition of SiC. Thus, a thinner subsurface damage layer was obtained compared with that in the less-thermally affected zone. The decomposed C and material migration tended to increase with the discharge energy. Owing to the interactions between EDM and diamond grinding, the subsurface was a mixture of amorphous/crystalline C, polycrystalline/nanocrystalline SiC, and a crystalline SiC matrix.

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Surface and subsurface damage of reaction-bonded silicon carbide induced by electrical discharge diamond grinding

Atomic-scale characterization of subsurface damage and structural changes of single-crystal silicon carbide subjected to electrical discharge machining

https://www.yan.mech.keio.ac.jp/wp-site/wp-content/uploads/10Sintered-diamond-as-a-hybrid-EDM-and-grinding-tool-for-the-micromachining-of-single-crystal-SiC.pdf

Tsong Han Tan

Papers

Atomic-scale characterization of subsurface damage and structural changes of single-crystal silicon carbide subjected to electrical discharge machining

Sintered diamond as a hybrid EDM and grinding tool for the micromachining of single-crystal SiC