T
Tsrong-Yi Wen
Researcher at National Taiwan University of Science and Technology
Publications - 22
Citations - 176
Tsrong-Yi Wen is an academic researcher from National Taiwan University of Science and Technology. The author has contributed to research in topics: Electrostatic precipitator & Airflow. The author has an hindex of 7, co-authored 18 publications receiving 134 citations. Previous affiliations of Tsrong-Yi Wen include Hong Kong Applied Science and Technology Research Institute & University of Washington.
Papers
More filters
Journal ArticleDOI
Novel electrodes of an electrostatic precipitator for air filtration
TL;DR: In this article, a novel electrostatic precipitators (ESP) that utilizes foam-covered collecting electrodes to reduce particle re-entrainment and enhance collection efficiency is presented.
Journal ArticleDOI
Numerical study of electrostatic precipitators with novel particle-trapping mechanism
TL;DR: Guidance-plate-covered electrostatic precipitators (GPC-ESPs) have been experimentally proven to have higher collection efficiencies than their traditional counterparts as discussed by the authors.
Journal ArticleDOI
Reduction of aerosol particulates through the use of an electrostatic precipitator with guidance-plate-covered collecting electrodes
TL;DR: In this article, a particle-trapping mechanism was proposed to enhance the filtration efficiency of an electrostatic precipitator by leaving gaps between the guidance plates and the collecting electrodes.
Journal ArticleDOI
The key energy performance of novel electrostatic precipitators
TL;DR: In this article, the authors evaluated the performance of different types of filters, comparing the key energy performance (KEP) of one fiber-based filter and three electrostatic precipitators (ESPs).
Patent
Semiconductor package system and method of improving heat dissipation of a semiconductor package
TL;DR: In this article, a semiconductor package system (405,505,605,705) which includes a base circuit board (410,510,610), a semiconductors package mounted on the base circuit boards, and a heat dissipation component (200,300,400,500,600) having a first contacting area (208,308,408,508,608) for making a first connection with an upper portion of the semiconductor packages and a second contacting area(209,309,409,509,609,