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Tsrong-Yi Wen

Researcher at National Taiwan University of Science and Technology

Publications -  22
Citations -  176

Tsrong-Yi Wen is an academic researcher from National Taiwan University of Science and Technology. The author has contributed to research in topics: Electrostatic precipitator & Airflow. The author has an hindex of 7, co-authored 18 publications receiving 134 citations. Previous affiliations of Tsrong-Yi Wen include Hong Kong Applied Science and Technology Research Institute & University of Washington.

Papers
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Journal ArticleDOI

Novel electrodes of an electrostatic precipitator for air filtration

TL;DR: In this article, a novel electrostatic precipitators (ESP) that utilizes foam-covered collecting electrodes to reduce particle re-entrainment and enhance collection efficiency is presented.
Journal ArticleDOI

Numerical study of electrostatic precipitators with novel particle-trapping mechanism

TL;DR: Guidance-plate-covered electrostatic precipitators (GPC-ESPs) have been experimentally proven to have higher collection efficiencies than their traditional counterparts as discussed by the authors.
Journal ArticleDOI

Reduction of aerosol particulates through the use of an electrostatic precipitator with guidance-plate-covered collecting electrodes

TL;DR: In this article, a particle-trapping mechanism was proposed to enhance the filtration efficiency of an electrostatic precipitator by leaving gaps between the guidance plates and the collecting electrodes.
Journal ArticleDOI

The key energy performance of novel electrostatic precipitators

TL;DR: In this article, the authors evaluated the performance of different types of filters, comparing the key energy performance (KEP) of one fiber-based filter and three electrostatic precipitators (ESPs).
Patent

Semiconductor package system and method of improving heat dissipation of a semiconductor package

TL;DR: In this article, a semiconductor package system (405,505,605,705) which includes a base circuit board (410,510,610), a semiconductors package mounted on the base circuit boards, and a heat dissipation component (200,300,400,500,600) having a first contacting area (208,308,408,508,608) for making a first connection with an upper portion of the semiconductor packages and a second contacting area(209,309,409,509,609,