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Ulrich Eitner

Researcher at Fraunhofer Society

Publications -  65
Citations -  1121

Ulrich Eitner is an academic researcher from Fraunhofer Society. The author has contributed to research in topics: Soldering & Solar cell. The author has an hindex of 15, co-authored 65 publications receiving 887 citations.

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Journal ArticleDOI

Spatial and orientational distribution of cracks in crystalline photovoltaic modules generated by mechanical load tests

TL;DR: In this paper, the authors present a statistical analysis on the crack formation in 27 crystalline silicon PV modules caused by a standard mechanical load test according to IEC 61215 10.16.
Journal ArticleDOI

Unified methodology for determining CTM ratios: Systematic prediction of module power☆

TL;DR: In this article, a unified methodology for predicting module power and efficiency from material and geometry data for several cell, interconnection and module designs is presented, which consists of analyzing photovoltaic inactive module areas, optical effects such as reflection, absorption and electrical losses.
Journal ArticleDOI

Detection of the voltage distribution in photovoltaic modules by electroluminescence imaging

TL;DR: In this article, an approach to determine the operating voltage of individual solar cells in photovoltaic (PV) modules by electroluminescence (EL) imaging was introduced.
Book ChapterDOI

Thermal Stress and Strain of Solar Cells in Photovoltaic Modules

TL;DR: In this article, the authors quantify the thermomechanical stresses by performing a Finite-Element analysis of a 60 cell module during thermal cycling, and they find that the solar cells are under high compressive stress of up to 76 MPa as they are sandwiched between the stiff front glass and the strongly contracting plastic back sheet.
Journal ArticleDOI

Multi-wire interconnection of busbar-free solar cells

TL;DR: In this paper, the authors focus on the interconnection of busbar-free solar cells by infrared soldering and the optimization of the front metallization design in order to achieve reliable solder joints.