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Umamaheswara Rao Tida
Researcher at North Dakota State University
Publications - 19
Citations - 205
Umamaheswara Rao Tida is an academic researcher from North Dakota State University. The author has contributed to research in topics: Inductor & Computer science. The author has an hindex of 6, co-authored 14 publications receiving 163 citations. Previous affiliations of Umamaheswara Rao Tida include Missouri University of Science and Technology & University of Notre Dame.
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Journal ArticleDOI
On the Efficacy of Through-Silicon-Via Inductors
TL;DR: This is the very first in-depth study on TSV inductors to make them practical for high-frequency applications and proposes a novel shield mechanism utilizing the microchannel, a technique conventionally used for heat removal, to reduce the substrate loss.
Journal ArticleDOI
Novel Through-Silicon-Via Inductor-Based On-Chip DC-DC Converter Designs in 3D ICs
TL;DR: Experimental results show that by replacing conventional spiral inductors with TSV inductors, with almost the same efficiency and output voltage, up to 4.3× and 3.2× inductor area reduction can be achieved for the single-phase buck converter and the interleaved buck converter with magnetic coupling.
Proceedings ArticleDOI
Through-silicon-via inductor: Is it real or just a fantasy?
TL;DR: A novel shield mechanism utilizing the micro-channel, a technique conventionally used for heat removal, to reduce the substrate loss and increase the quality factor and the inductance of the TSV inductor is proposed.
Journal ArticleDOI
Dynamic Frequency Scaling Aware Opportunistic Through-Silicon-Via Inductor Utilization in Resonant Clocking
TL;DR: A novel scheme to opportunistically use idle through-silicon-vias to form inductors in LC resonant clock of 3-D ICs for maximum power reduction in clock-distribution network (CDN) at a fixed frequency is presented and extended to DFS schemes.
Proceedings ArticleDOI
Opportunistic through-silicon-via inductor utilization in LC resonant clocks: concept and algorithms
TL;DR: A novel scheme to opportunistically use idle TSVs to form inductors in LC resonant clock of 3D ICs for maximum power reduction and to the best of the authors' knowledge, this is the very first work to apply TSV inductors to the resonant CDN.