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Vivek Telang

Researcher at Broadcom

Publications -  10
Citations -  200

Vivek Telang is an academic researcher from Broadcom. The author has contributed to research in topics: Signal & Communication channel. The author has an hindex of 7, co-authored 10 publications receiving 199 citations.

Papers
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Journal ArticleDOI

Higher-order modulation for client optics

TL;DR: Higher-order modulation is being studied for future 100G, 400G, and faster client optics and greater sensitivity to link impairments require use of DSP algorithms implemented in advanced CMOS nodes to close the link budget.
Patent

Multi-rate backplane transceiver

TL;DR: In this paper, an apparatus is described that includes first transceiver circuitry adapted for transmitting and receiving Ethernet data over a network using a first Ethernet communication protocol at a first data rate.
Patent

Phase control for interleaved analog-to-digital conversion for electronic dispersion compensation

TL;DR: In this article, an interleaved analog-to-digital converter (ADC) block is used to generate a plurality of digitally sampled signals from the electromagnetic signal, and a multiplexer is configured to aggregate the digitally equalized signals into a composite output signal.
Patent

Electronic dispersion compensation utilizing interleaved architecture and channel identification for assisting timing recovery

TL;DR: In this paper, a system for performing electronic dispersion compensation on an information-bearing signal transmitted over a communication channel is presented, which includes a channel identification module configured to receive a first digitized version of the information bearing signal and an equalized version, and may determine an impulse response of the communication channel based thereon.
Patent

Use of multi-level modulation signaling for short reach data communications

TL;DR: In this article, a multi-level modulated data signal is generated to transmit/receive data over the short reach channel medium. But the data signal rate is not reduced, therefore reducing insertion loss, power, complexity of the circuits and required chip real estate.