An electromagnetic induction power transfer apparatus (100) comprises:an inductive power transmitter (102), comprising:a power supply with an active state and an inactive state, configured to switch between the active state and the inactive state at a selectable duty cycle; and a power-transmitting inductor (102-12) coupled to the power supply; and an inductive power receiver (104), comprising:a power-receiving inductor (104-12), positioned inductively proximate the power-transmitting inductor; a programmable load (104-12); and an impedance controller (104-6) coupled to the power receiving inductor and configured to increase or decrease an electrical impedance of the inductive power receiver in response to a change in a power requirement of the programmable load.

Impedance matching for inductive power transfer systems

Advances in antenna technologies for cellular hand-held devices have been synchronous with the evolution of mobile phones over nearly 40 years. Having gone through four major wireless evolutions [1], [2], starting with the analog-based first generation to the current fourth-generation (4G) mobile broadband, technologies from manufacturers and their wireless network capacities today are advancing at unprecedented rates to meet our unrelenting service demands. These ever-growing demands, driven by exponential growth in wireless data usage around the globe [3], have gone hand in hand with major technological milestones achieved by the antenna design community. For instance, realizing the theory regarding the physical limitation of antennas [4]-[6] was paramount to the elimination of external antennas for mobile phones in the 1990s. This achievement triggered a variety of revolutionary mobile phone designs and the creation of new wireless services, establishing the current cycle of cellular advances and advances in mobile antenna technologies.

Solving the 5G Mobile Antenna Puzzle: Assessing Future Directions for the 5G Mobile Antenna Paradigm Shift

Phased-array modules at frequencies >20 GHz are expected to play an important role for 5G applications. Antenna-in-package (AiP) is a reliable and cost-effective method to realize these phased arrays. This paper introduces a practical Ka-band AiP structure and discusses the antenna element design and implementation tradeoffs. The AiP design is based on multilayer organic buildup substrates that are suitable for phased-array module integration needs and supports both horizontal and vertical polarizations. Measurement results from the fabricated antenna prototypes show 0.8 GHz return loss bandwidth and 3.8-dBi peak gain at 30.5 GHz. Simulation results agree with the measured ones.

Antenna-in-Package Design Considerations for Ka-Band 5G Communication Applications

Antenna-in-package (AiP) technology, in which there is an antenna (or antennas) with a transceiver die (or dies) in a standard surface-mounted device, represents an important antenna and packaging technology achievement in recent years. AiP technology has been widely adopted by chipmakers for 60-GHz radios and gesture radars. It has also found applications in 77-GHz automotive radars, 94-GHz phased arrays, 122-GHz imaging sensors, and 300-GHz wireless links. It is believed that AiP technology will also provide elegant antenna and packaging solutions to the fifth generation and beyond operating in the lower millimeter-wave (mmWave) bands. Thus, one can conclude that AiP technology has emerged as the mainstream antenna and packaging technology for various mmWave applications. This article will provide an overview of the development of AiP technology. It will consider antennas, packages, and interconnects for AiP technology. It will show that the antenna choice is usually based on those popular antennas that can be easily designed for the application, that the package choice is governed for automatic assembly, and that the materials and processes choices involve tradeoffs among constraints, such as electrical performance, thermal–mechanical reliability, compactness, manufacturability, and cost. This article also shows a probe-based setup to measure mmWave AiP impedance and radiation characteristics. It goes on to give AiP examples implemented, respectively, in a low-temperature co-fired ceramic, an embedded wafer level ball grid array process, and a high-density interconnect processes. Finally, this article will summarize and present some recommendations on research topics to further the state of the art of AiP technology.

An Overview of the Development of Antenna-in-Package Technology for Highly Integrated Wireless Devices

In the last couple of decades, solid-state device technologies, particularly electronic semiconductor devices, have been greatly advanced and investigated for possible adoption in various terahertz (THz) applications, such as imaging, security, and wireless communications. In tandem with these investigations, researchers have been exploring ways to package those THz electronic devices and integrated circuits for practical use. Packages are fundamentally expected to provide a physical housing for devices and integrated circuits (ICs) and reliable signal interconnections from the inside to the outside or vice versa . However, as frequency increases, we face several challenges associated with signal loss, dimensions, and fabrication. This paper provides a broad overview of recent progress in interconnections and packaging technologies dealing with these issues for THz electronics. In particular, emerging concepts based on commercial ceramic technologies, micromachining, and 3-D printing technologies for compact and lightweight packaging in practical applications are highlighted, along with metallic split blocks with rectangular waveguides, which are still considered the most valid and reliable approach.

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Packages for Terahertz Electronics

An integrated multilayer antenna-in-package (AiP) targeted for stationary 60-GHz communication is presented. The key differences in design conditions for mass-market-level and prototype-level AiP are discussed and reflected during the design process. Hence, a low-cost and high-reliability package solution is realized. The proposed AiP consists of a 4 × 6 array of 24 stacked circular patch antennas and corresponding antenna feed lines designed for phased array. The finalized LTCC AiP prototype features 20 × 15 × 1.02 mm3 in dimension. Solder bump flip-chip technology is used to attach the AiP to the RFIC for system-level assembly. The assembled package is evaluated using a custom-designed near-field measurement setup. EM simulations and measurements confirm the presented AiP features more than 9 GHz bandwidth, 45° beam-steering ranges in both E- and H-planes, and more than 14.5 dBi gain at boresight.

24-Element Antenna-in-Package for Stationary 60-GHz Communication Scenarios

A wireless charging system and method are provided, that are capable of simultaneously charging multiple mobile devices, providing high power transfer efficiency for multiple mobile devices located at any position and orientation, and minimizing electromagnetic radiation from a transmitting (TX) coil and a receiving (RX) coil. The method and structure reduce electromagnetic interference (EMI) radiation by shunting in-phase currents flowing in a wireless power transmitting unit (TX unit) and a wireless power receiving unit (RX unit) of a wireless charging system.

Wireless charger and wireless power receiver

A system and a device for wirelessly transferring power without a cable are provided. A wireless electromagnetic receiver includes a first device configured to be magnetized based on an electromagnetic field. The wireless electromagnetic receiver further includes a second device configured to transform the magnetization of the first device into a power, the second device being not in contact with the first device.

Wireless electromagnetic receiver and wireless power transfer system

An apparatus configured to transceive wireless power, includes a magnetostrictive resonator configured to be excited by a magnetic field, and a soft magnetic material disposed in a vicinity of the magnetostrictive resonator. The apparatus further includes a transducing coil disposed in a vicinity of the magnetostrictive resonator or the soft magnetic material, and configured to convert mechanical energy generated by the excitation of the magnetostrictive resonator to electric energy.

Apparatus and method for transceiving wireless power

A small-sized ultra-wideband (UWB) antenna includes a radiating unit configured to have a contour of a first shape, a ground unit configured to have a contour of a shape substantially equal to the first shape, and disposed parallel to the radiating unit, at least one shorting pin connected orthogonal to the ground unit and the radiating unit to connect a first area of the ground unit and a first area of the radiating unit, and a feeding unit connected orthogonal to the ground unit and the radiating unit to connect a second area of the ground unit and a second area of the radiating unit.

Vladimir Arkhipenkov

Papers

24-Element Antenna-in-Package for Stationary 60-GHz Communication Scenarios

Wireless charger and wireless power receiver

Wireless electromagnetic receiver and wireless power transfer system

Apparatus and method for transceiving wireless power

Ultra-wideband (uwb) antenna