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Wanli Li
Researcher at National Institute for Materials Science
Publications - 40
Citations - 762
Wanli Li is an academic researcher from National Institute for Materials Science. The author has contributed to research in topics: Copper & Sintering. The author has an hindex of 14, co-authored 35 publications receiving 488 citations. Previous affiliations of Wanli Li include Osaka University & Tianjin University.
Papers
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Journal ArticleDOI
Printable and Flexible Copper–Silver Alloy Electrodes with High Conductivity and Ultrahigh Oxidation Resistance
Wanli Li,Dawei Hu,Lingying Li,Cai-Fu Li,Jinting Jiu,Chuantong Chen,Toshiyuki Ishina,Tohru Sugahara,Katsuaki Suganuma +8 more
TL;DR: Printable and flexible Cu-Ag alloy electrodes with high conductivity and ultrahigh oxidation resistance have been successfully fabricated by using a newly developed Cu- Ag hybrid ink and a simple fabrication process consisting of low-temperature precuring followed by rapid photonic sintering (LTRS).
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Die Bonding Performance Using Bimodal Cu Particle Paste Under Different Sintering Atmospheres
TL;DR: In this article, a one-step polyol method was employed to synthesize bimodal Cu particles with average diameters around 200nm and 1000nm, respectively, and they were mixed with a reductive solvent of polyethylene glycol (PEG) to form a paste.
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The rise of conductive copper inks: challenges and perspectives
Wanli Li,Qingqing Sun,Lingying Li,Jinting Jiu,Xuying Liu,Masayuki Kanehara,Takeo Minari,Katsuaki Suganuma +7 more
TL;DR: In this paper, a review summarises the advanced developments of Cu inks in terms of formulations, sintering methods, and long-term reliability, and the mainstream strategies for avoiding oxidation and improving the stability of CU inks and Cu patterns are described.
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Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere
Yue Gao,Wanli Li,Chuantong Chen,Hao Zhang,Jinting Jiu,Cai-Fu Li,Shijo Nagao,Katsuaki Suganuma +7 more
TL;DR: In this paper, a die-attach material, called Cu particle paste with self-reduction and self-protection characteristics, was designed by simply adding ascorbic acid (AA) into Cu paste.
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Highly reliable and highly conductive submicron Cu particle patterns fabricated by low temperature heat-welding and subsequent flash light sinter-reinforcement
Wanli Li,Hao Zhang,Yue Gao,Jinting Jiu,Cai-Fu Li,Chuantong Chen,Dawei Hu,Yusuke Goya,Yutao Wang,Hirotaka Koga,Shijo Nagao,Katsuaki Suganuma +11 more
TL;DR: Submicron Cu particle ink was developed to achieve highly reliable and highly conductive Cu patterns on low-cost, transparent, and flexible substrates by an optimized two-step sintering process involving low temperature heat-welding and subsequent flash light sinter-reinforcement as mentioned in this paper.