A SIGNIFICANT fraction of the computer memory industry is at present involved in the manufacture of non-volatile memory devices1—that is, devices which retain information when power is interrupted. For such applications (and also for volatile memories), the use of capacitors constructed from ferroelectric thin films has stimulated much interest1. In such structures, information is stored in the polarization state of the ferroelectric material itself, which should in principle lead to lower power requirements, faster access time and potentially lower cost1. But the use of ferroelectrics is not without problems; the memories constructed to date have generally suffered from poor retention of stored information and degradation of performance ('fatigue') with use1–3. Here we describe the preparation and characterization of thin-film capacitors using ferroelectric materials from a large family of layered perovskite oxides, exemplified by SrBi2Ta2O9, SrBi2NbTaO9 and SrBi4Ta4O15. The structural flexibility of these materials allows their properties to be tailored so that many of the problems associated with previous ferroelectric memories are avoided. In particular, our capacitors do not show significant fatigue after 1012 switching cycles, and they exhibit good retention characteristics and low leakage currents even with films less than 100 nm thick.

Fatigue-free ferroelectric capacitors with platinum electrodes

This paper surveys circuit innovations in ferroelectric memories at three circuit levels: memory cell, sensing and architecture. A ferroelectric memory cell consists of at least one ferroelectric capacitor, where binary data are stored, and one or two transistors that either allow access to the capacitor or amplify its contents for a read operation. Once a cell is accessed for a read operation, its data are presented in the form of an analog signal to a sense amplifier, where it is compared against a reference voltage to determine its logic level. The circuit techniques used to generate the reference voltage must be robust to semiconductor processing variations across the chip and the device imperfections of ferroelectric capacitors. We review six methods of generating a reference voltage, two being presented for the first time in this paper. These methods are discussed and evaluated in terms of their accuracy, area overhead and sensing complexity. Ferroelectric memories share architectural features such as addressing schemes and input/output circuitry with other types of random-access memories such as dynamic random-access memories. However, they have distinct features with respect to accessing the stored data, sensing, and overall circuit topology. We review nine different architectures for ferroelectric memories and discuss them in terms of speed, density and power consumption.

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A survey of circuit innovations in ferroelectric random-access memories

Resistive switching memory (RRAM) relies on the voltage-driven formation/disruption of a conductive filament (CF) across a thin insulating layer. Due to the 1-D structure of the CF and discrete nature of defects, the set and reset states of the memory device generally display statistical variability from cycle to cycle. For projecting cell downscaling and designing improved programming operations, the variability as a function of the operation parameters, such as the maximum current in the set process and maximum voltage in the reset process, need to be evaluated and understood. This paper addresses set/reset variability, presenting statistical data for HfOx-based RRAM and introducing a physics-based Monte Carlo model for switching statistics. The model can predict the distribution of the set state as a function of the compliance (maximum) current during set and distribution of the reset state as a function of the stop (maximum) voltage during reset. Numerical modeling results are finally presented to provide additional insight into discrete fluctuation events.

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Statistical Fluctuations in HfO x Resistive-Switching Memory: Part I - Set/Reset Variability

In the advancement of the semiconductor device technology, ZnO could be a prospective alternative than the other metal oxides for its versatility and huge applications in different aspects. In this review, a thorough overview on ZnO for the application of resistive switching memory (RRAM) devices has been conducted. Various efforts that have been made to investigate and modulate the switching characteristics of ZnO-based switching memory devices are discussed. The use of ZnO layer in different structure, the different types of filament formation, and the different types of switching including complementary switching are reported. By considering the huge interest of transparent devices, this review gives the concrete overview of the present status and prospects of transparent RRAM devices based on ZnO. ZnO-based RRAM can be used for flexible memory devices, which is also covered here. Another challenge in ZnO-based RRAM is that the realization of ultra-thin and low power devices. Nevertheless, ZnO not only offers decent memory properties but also has a unique potential to be used as multifunctional nonvolatile memory devices. The impact of electrode materials, metal doping, stack structures, transparency, and flexibility on resistive switching properties and switching parameters of ZnO-based resistive switching memory devices are briefly compared. This review also covers the different nanostructured-based emerging resistive switching memory devices for low power scalable devices. It may give a valuable insight on developing ZnO-based RRAM and also should encourage researchers to overcome the challenges.

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Status and Prospects of ZnO-Based Resistive Switching Memory Devices

A method for programming a flash memory array (10) which insures fast programming to substantially all of the cells in the array, without over-programming, based on providing a pattern of program retry pulses (62, 63, 64, 65, 66) which have respective pulse widths and pulse heights which vary according to a pattern. The pattern includes a combination of both increasing pulse widths and increasing pulse heights. The pattern includes a first phase which completes in a specified amount of time including a predetermined number of retries so that substantially all of the cells in the array are programmed within the first phase. A second phase of the pattern involves a sequence of higher energy pulses addressed to programming the slowest cells in the array. When used in a page program array, in which individual cells which are programmed fast do not receive subsequent retry pulses, a very fast and reliable programming scheme is achieved.

Automatic programming algorithm for page mode flash memory with variable programming pulse height and pulse width

A method of forming a capacitor includes, a) providing a node to which electrical connection to a capacitor is to be made; b) providing an electrically conductive first layer over the node; c) providing an electrically insulative barrier second layer over the first conductive layer; d) providing a third layer over the electrically insulative barrier layer, the third layer comprising a material which is either electrically conductive and resistant to oxidation, or forms an electrically conductive material upon oxidation; e) providing an insulating inorganic metal oxide dielectric layer over the electrically conductive third layer; f) providing an electrically conductive fourth layer over the insulating inorganic metal oxide dielectric layer; and g) providing an electrically conductive interconnect to extend over the second insulative layer and electrically interconnect the first and third conductive layers A capacitor construction having such a dielectric layer in combination with the barrier layer and electrical interconnect of a first capacitor plate is disclosed

Method for forming a capacitor with electrically interconnected construction

A method of erasing, programming, and verifying a flash electrically erasable programmable read-only memory where all cells are first erased to a high threshold voltage, preferably by simultaneous Fowler-Nordheim tunnelling, and then selected cells are programmed to a low threshold voltage using Fowler-Nordheim tunnelling. Programming is achieved by applying a negative voltage to the selected wordline and applying a positive voltage to the selected bitline. Only those cells which have both the wordline and bitline selected will have sufficient wordline-to-bitline voltage difference to cause programming. A key advantage of this new method is that a verification (read) procedure can be used to monitor for the desirable tight distribution, low threshold voltage V t on programmed cells and re-program only those cells which have a V t higher than the desired V t . The resulting tight distribution of cell current in programmed cells will lead to faster and more reliable read characteristics for these devices.

Method for reverse programming of a flash EEPROM

A method of forming a capacitor includes, a) providing a node to which electrical connection to a capacitor is to be made; b) providing an electrically conductive first layer over the node; c) providing an electrically insulative barrier second layer over the first conductive layer; d) providing a third layer over the electrically insulative barrier layer, the third layer comprising a material which is either electrically conductive and resistant to oxidation, or forms an electrically conductive material upon oxidation; e) providing an insulating inorganic metal oxide dielectric layer over the electrically conductive third layer; f) providing an electrically conductive fourth layer over the insulating inorganic metal oxide dielectric layer; and g) providing an electrically conductive interconnect to extend over the second insulative layer and electrically interconnect the first and third conductive layers. A capacitor construction having such a dielectric layer in combination with the barrier layer and electrical interconnect of a first capacitor plate is disclosed.

Method of forming a capacitor plate and a capacitor incorporating same

Memory cells are disclosed. Magnetic regions within the memory cells include an alternating structure of magnetic sub regions and coupler sub regions. The coupler material of the coupler sub regions antiferromagnetically couples neighboring magnetic sub regions and effects or encourages a vertical magnetic orientation exhibited by the neighboring magnetic sub regions. Neighboring magnetic sub regions, spaced from one another by a coupler sub region, exhibit oppositely directed magnetic orientations. The magnetic and coupler sub regions may each be of a thickness tailored to form the magnetic region in a compact structure. Interference between magnetic dipole fields emitted from the magnetic region on switching of a free region in the memory cell may be reduced or eliminated. Also disclosed are semiconductor device structures, spin torque transfer magnetic random access memory (STT MRAM) systems, and methods of fabrication.

Memory cells, semiconductor device structures, memory systems, and methods of fabrication

Described herein is a reference voltage circuit which includes, in combination, a bit line and first and second word line reference transistors connected to the bit line and operative to be turned on with a reference pulse simultaneously with the turning on of the word lines in the main memory circuit. First and second ferroelectric capacitors are connected to each of the first and second word line reference transistors, respectively, and to a source of plate line switching voltage, and a first precharging transistor is connected between the first ferroelectric capacitor and ground potential. A second precharging transistor is connected between the second ferroelectric capacitor and a further source of switching voltage, so that the first and second ferroelectric capacitors are polarized in a ONE and ZERO state in the manner identical to the logic states of the ferroelectric capacitors in the main ferroelectric memory circuit. Thus, when the first and second word line reference transistors turn on, the bit line reference voltage is raised above ground potential by the sum of the voltages of the first and second ferroelectric capacitors. This in turn causes the bit line reference voltage, BL, to track the voltage variations of the ferroelectric capacitors in the main memory circuit, thus providing improved margins for the BL and BL complementary signals which are sensed by a plurality of sense amplifiers for the main memory circuit.

Wayne I. Kinney

Papers

Method for forming a capacitor with electrically interconnected construction

Method for reverse programming of a flash EEPROM

Method of forming a capacitor plate and a capacitor incorporating same

Memory cells, semiconductor device structures, memory systems, and methods of fabrication

Folded bit line ferroelectric memory device