Mitigating power distribution network (PDN) noise is one of the main efforts for power integrity (PI) design in high-speed or mixed-signal circuits. Possible solutions, which are based on decoupling or isolation concept, for suppressing PDN noise on package or printed circuit board (PCB) levels are reviewed in this paper. Keeping the PDN impedance very low in a wide frequency range, except at dc, by employing a shunt capacitors, which can be in-chip, package, or PCB levels, is the first priority way for PI design. The decoupling techniques including the planes structure, surface-mounted technology decoupling capacitors, and embedded capacitors will be discussed. The isolation approach that keeps part of the PDN at high impedance is another way to reduce the PDN noise propagation. Besides the typical isolation approaches such as the etched slots and filter, the new isolation concept using electromagnetic bandgap structures will also be discussed.

Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation

The fifth generation (5G) of mobile communications are facing big challenges, due to the proliferation of diversified terminals and unprecedented services such as internet of things (IoT), high-definition videos, virtual/augmented reality (VR/AR). To accommodate massive connections and astonish mobile traffic, an efficient 5G transport network is required. Optical transport network has been demonstrated to play an important role for carrying 5G radio signals. This paper focuses on the future challenges, recent studies and potential solutions for the 5G flexible optical transport networks with the performances on large-capacity, low-latency and high-efficiency. In addition, we discuss the technology development trends of the 5G transport networks in terms of the optical device, optical transport system, optical switching, and optical networking. Finally, we conclude the paper with the improvement of network intelligence enabled by these technologies to deterministic content delivery over 5G optical transport networks.

5G flexible optical transport networks with large-capacity, low-latency and high-efficiency

Purpose – The purpose of this paper is to review recent advances in fine and ultra‐fine pitch wire bonding.Design/methodology/approach – Dozens of journal and conference articles published recently are reviewed.Findings – The problems/challenges such as possible wire sweep and decreased bonding strength due to small wire sizes, non‐sticking, metal pad peeling, narrow process windows, wire open and short tail defects are analysed. The solutions to the problems and recent findings/developments in fine and ultra‐fine pitch wire bonding are discussed.Research limitations/implications – Because of the page limitation, only brief discussions are given in this paper. Further reading is needed for more details.Originality/value – This paper attempts to provide an introduction to recent developments and the trends in fine and ultra‐fine pitch wire bonding. With the references provided, readers may explore more deeply by reading the original articles.

Fine and ultra‐fine pitch wire bonding: challenges and solutions

A system for passive optical alignment includes an through optical via formed through a substrate, an optical transmission medium secured to a first side of the substrate such that the optical transmission medium is aligned with the through optical via, and an optoelectronic component secured to a second side of the substrate such that the active region of said optoelectronic component is aligned with the through optical via.

Passive optical alignment

In this paper a time-domain response and Nyquist stability criterion to acquire dependence of degree of crosstalk relative stability based on transmission lines modeling (TLM) is investigated for coupled multilayer graphene nanoribbon (MLGNR) interconnects. This is the first instance that such an analysis has been presented for coupled MLGNR consisting of both capacitive and mutual-inductive couplings. The near-end and far-end outputs of coupled MLGNR individually are compared in two cases, with considering both couplings and without them (single MLGNR). It is observed that the near-end output of the system together with both couplings is more stable and at its far-end output, an induced voltage is created. By increasing capacitive coupling or decreasing inductive coupling, the near-end output becomes more stable. Also, the results of changes of length and width of each ribbon show that by increasing the length and decreasing the width, the coupled MLGNR interconnects become more stable.

Crosstalk Stability Analysis in Multilayer Graphene Nanoribbon Interconnects

The fabrication process of a 12-channel parallel optical transceiver module developed in our group is presented in this paper. The module is composed of a VCSEL array, a PIN PD array, a VCSEL driver chip, a TIA/LA chip and supporting PCB and connector. A SiOB and its vertical assembly are emphasized as the highlights of the structure of this module, which is promising to effectively reduce the package cost and improve the optical coupling efficiency.

Packaging and assembly of 12-channel parallel optical transceiver module

Crosstalk noise has become a major performance inhibitor in high speed digital system. This is especially the case in package designs, connector assemblies and circuit interconnects designs. With the simultaneous miniaturization of electronic systems and decreasing signal rise time, it is important to be able to predict major sources of crosstalk and to stay within the cross-talk budget for high-speed interconnects interfaces. In this paper, first, we focus on analyzing the crosstalk mechanism. Second, based on simulation, we propose methods to minimize crosstalk.

Crosstalk analysis and optimization of high-speed interconnections

We present a cost-efficient parallel optical transceiver module based on a 1×4 VCSEL array, a 1×4 PD array, and a 12-wide multimode fiber ribbon for very-short-reach application. A passive alignment technique using through-silicon-hole (TSH) has been developed to realize high-efficient butt-coupling between optoelectronic arrays and multimode fibers. In this paper, the detail optical coupling structure, misalignment tolerance, micro-assembly process, and measurement results are mainly discussed. Finally, lensed multimode fibers formed by chemical etching are proposed, which exhibit a great potential for further improvement of coupling performance.

Low-cost high-efficiency optical coupling using through-silicon-hole in parallel optical transceiver module

The utility model relates to the field of connecting cables and discloses a high-definition multimedia interface (HDMI) connecting cable. The connecting cable comprises a transmitting end and a receiving end, wherein the transmitting end comprises a laser and a transmitting end controller; the receiving end comprises an optical detection diode, a receiving end controller and an equipment end; the laser is connected with the optical detection diode through four optical fibers; the transmitting end controller is connected with the receiving end controller through a cable; and the receiving end controller and the optical detection diode are connected with the equipment end respectively. By the HDMI connecting cable, hot plug can be realized, and the HDMI connecting cable is the same as a common copper cable HDMI and is convenient to use. Meanwhile, due to the adoption of the four optical fibers and conversion modules at the optical fiber transmitting end and receiving end, the weight of the connecting cable is lighter than that of the common copper cable HDMI, and the problem of low signal quality caused by signal attenuation in the process of transmitting a high-speed signal through the common copper cable is solved simultaneously.

High-definition multimedia interface (HDMI) connecting cable

This paper presents an electrical design of a 6.25Gbps×12-channel parallel optical transceiver with SiP packaging technology. Considering such high speed, a low impedance and low noise power distribution network (PDN) is designed to suppress simultaneous switching noise (SSN) and a novel embedded capacitor filter is used to replace the conventional power supply filter. To minimize the impedance discontinuity of electrical channels, a signal integrity (SI) design flow based on Electromagnetic Analysis Method and Circuit Analysis Method is proposed. Following this design flow, the high speed link performs on a large bandwidth. With the electrical design, the optical transceiver is fabricated and tested.

Wei Gao

Papers

Packaging and assembly of 12-channel parallel optical transceiver module

Crosstalk analysis and optimization of high-speed interconnections

Low-cost high-efficiency optical coupling using through-silicon-hole in parallel optical transceiver module

High-definition multimedia interface (HDMI) connecting cable

An electrical design and fabrication of a 12-channel optical transceiver with SiP packaging technology