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William A.T. Clark
Researcher at Ohio State University
Publications - 74
Citations - 2375
William A.T. Clark is an academic researcher from Ohio State University. The author has contributed to research in topics: Dislocation & Grain boundary. The author has an hindex of 23, co-authored 73 publications receiving 2167 citations. Previous affiliations of William A.T. Clark include University of Oxford.
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Activation of slip in lamellae of alpha2-Ti3Al in TiAl alloys
TL;DR: The activation of slip at room temperature in lamellae of α2-Ti3Al in a Ti- 48 at.% Al alloy has been studied using transmission electron microscopy as discussed by the authors.
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Microstructural studies of 35 °C Copper Ni–Ti orthodontic wire and TEM confirmation of low-temperature martensite transformation
TL;DR: Transmission electron microscopy confirmed the low-temperature peak and other phase transformations observed by TMDSC, and revealed that twinning in martensite is the mechanism for the high dislocation density and fine-scale oxide particles in the microstructure.
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Thermodynamic modeling of sensitization of AISI 304 stainless steels containing nitrogen
TL;DR: In this paper, the effect of nitrogen is incorporated into the thermodynamic model by means of the free energy interaction coefficients of nitrogen with chromium and carbon, and a mechanism by which nitrogen additions affect the sensitization kinetics of AISI 304 stainless steels is proposed.
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The effect of nitrogen and carbon on the stress corrosion cracking performance of sensitized AISI 304 stainless steel in chloride and sulfate solutions at 250°C
TL;DR: In this paper, slow strain rate tests were conducted on sensitized AISI 304 stainless steels (SS) with varying nitrogen and carbon contents in order to study their susceptibility to stress corrosion cracking (SCC).
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The use of the transmission electron microscope in analyzing slip propagation across interfaces
TL;DR: In this paper, the role of the transmission electron microscope (TEM) in the process of slip transmission across interfaces in polycrystalline materials is discussed, with particular attention paid to the limitations of the technique.