A novel bi-level DRAM architecture is described which achieves significant reductions in die size while maintaining the noise performance of traditional folded architectures. Die size reduction results primarily by building the memory arrays with 6F2 or smaller memory cells in a type of cross point memory cell layout. The memory arrays utilize stacked digitlines and vertical digitline twisting to achieve folded architecture operation and noise performance.

Digit line architecture for dynamic memory

Various logic elements such as SR flip-flops, JK flip-flops, D-type flip-flops, master-slave flip-flops, parallel and serial shift registers, and the like are converted into non-volatile logic elements capable of retaining a current output logic state even though external power is removed or interrupted through the strategic addition of ferroelectric capacitors and supporting circuitry. In each case, the building blocks of a cross-coupled sense amplifier are identified within the logic element and the basic cell is modified and/or optimized for sensing performance.

Ferroelectric non-volatile logic elements

A three-dimensional solid-state memory is formed from a plurality of bit lines, a plurality of layers, a plurality of tree structures and a plurality of plate lines. Bit lines extend in a first direction in a first plane. Each layer includes an array of memory cells, such as ferroelectric or hysteretic-resistor memory cells. Each tree structure corresponds to a bit line, has a trunk portion and at least one branch portion. The trunk portion of each tree structure extends from a corresponding bit line, and each tree structure corresponds to a plurality of layers. Each branch portion corresponds to at least one layer and extends from the trunk portion of a tree structure. Plate lines correspond to at least one layer and overlap the branch portion of each tree structure in at least one row of tree structures at a plurality of intersection regions.

Ultra low-cost solid-state memory

The present invention is directed to perform fine low-voltage control without largely increasing the circuit layout area in a low-power consumption structure. In the case of shifting a region to a low-speed mode, a system controller outputs a request signal and an enable signal to a power switch controller and a low-power drive circuit, respectively, to turn off a power switch and to perform a control so that the voltage level of a virtual reference potential becomes about 0.2 V to about 0.3V. The region operates on voltages between a power supply voltage and a virtual reference potential, so that it is controlled in the low-speed mode.

Semiconductor Integrated Circuit Device

A gate oxide and method of fabricating a gate oxide that produces a more reliable and thinner equivalent oxide thickness than conventional SiO2 gate oxides are provided. Gate oxides formed from alloys such as cobalt-titanium are thermodynamically stable such that the gate oxides formed will have minimal reactions with a silicon substrate or other structures during any later high temperature processing stages. The process shown is performed at lower temperatures than the prior art, which inhibits unwanted species migration and unwanted reactions with the silicon substrate or other structures. Using a thermal evaporation technique to deposit the layer to be oxidized, the underlying substrate surface smoothness is preserved, thus providing improved and more consistent electrical properties in the resulting gate oxide.

Low-temperature grown high quality ultra-thin CoTiO3 gate dielectrics

A power-on detect circuit includes: a resistor divider having a first node, a second node coupled to ground, and a center tap; a bandgap circuit for providing a reference voltage; a differential amplifier having a first input for receiving the reference voltage, a second input coupled to the center tap of the bandgap reference voltage circuit, and an output for providing a power-on detect signal; and a suppression circuit for coupling the first node of the resistor divider to a source of supply voltage once the reference voltage substantially achieves a stable reference voltage level. The suppression circuit has an input for receiving a trigger voltage generated in the bandgap circuit, and an output coupled to the first node of the resistor divider. The suppression circuit includes: an input section having an input for receiving the trigger voltage, and an output; a switch coupled between the source of supply voltage and the first node of the resistor divider having a control node coupled to the output of the input section; and a capacitor coupled to the control node of the switch. Both the switch and the bandgap circuit are responsive to the power-on detect signal for further reducing power consumption.

Bandgap reference based power-on detect circuit including a suppression circuit

A non-volatile ferroelectric latch includes a sense amplifier having at least one input/output coupled to a bit-line node, a ferroelectric storage capacitor coupled between a plate-line node and the bit-line node, and a load element coupled to the bit-line node. The sense amplifier further includes a second input/output coupled to a second bit-line node and the latch further includes a second ferroelectric storage capacitor coupled between a second plate-line node and the second bit-sine node, and a second load element coupled to the second bit-line node. The load element includes a dynamic, switched ferroelectric capacitor a static, nonswitched ferroelectric capacitor, a linear capacitor, or even a resistive load.

Ferroelectric non-volatile latch circuits

A ferroelectric nonvolatile random access memory array includes multiple ferroelectric memory cells arranged in rows and columns, a word line coupled to a word line input of each of the ferroelectric memory cells in a row, and a bit line coupled to a bit line input of each of the ferroelectric memory cells in a column. The array also includes multiple plate lines, each plate line being arranged into a plurality of plate line segments each coupled to a plate line input of a predetermined number of the ferroelectric memory cells in a row, and multiple NMOS plate line segment drivers coupled to each of the plate line segments for selectively driving the corresponding plate line segment to a full rail voltage. The rows of ferroelectric memory cells and the NMOS plate line segment drivers have substantially the same layout pitch. The plate line segment drivers are each coupled to a center portion of the corresponding plate line segment. Each NMOS plate line segment drivers includes a first NMOS transistor having a first current node coupled to the word line associated with the ferroelectric memory cells coupled to the plate line segment, a gate coupled to a source of supply voltage, and a second current node, and a second NMOS transistor having a first current node coupled to the plate line segment, a second current node coupled to a plate clock line, and a gate coupled to the second current node of the first NMOS transistor.

Ferroelectric nonvolatile random access memory utilizing self-bootstrapping plate line segment drivers

A ferroelectric memory array includes a word line coupled to a row of ferroelectric memory cells and a word line driver circuit for establishing a full power supply voltage on the word line. A bootstrapping circuit is coupled between the word line and a boost line for receiving a boost signal. The bootstrapping circuit includes a ferroelectric capacitor and coupling circuitry for coupling the ferroelectric capacitor between the boost line and the word line in a first operational mode such that the peak voltage on the word line is greater than the power supply voltage, and for isolating the ferroelectric capacitor from the boost line in a second operational mode. In operation, a selected word line is precharged to a full VDD power supply voltage, the ferroelectric capacitor associated with the selected word line is coupled to the boost line, the ferroelectric capacitors associated with non-selected word lines are electrically isolated from the boost line, and the boost line transitions from zero volts to VDD such that the voltage on the selected word line is boosted to a voltage greater than the VDD power supply voltage.

Bootstrapping circuit utilizing a ferroelectric capacitor

A memory cell layout for use in a 1T/1C ferroelectric memory array includes an access transistor having a gate coupled to a word line and a current path coupled between a bit line and an internal cell node, a shunt word line extending across the memory cell that is electrically isolated from the word line and the access transistor within the physical boundary of the memory cell, and a ferroelectric capacitor coupled between the internal cell node and a plate line.

William F. Kraus

Papers

Bandgap reference based power-on detect circuit including a suppression circuit

Ferroelectric non-volatile latch circuits

Ferroelectric nonvolatile random access memory utilizing self-bootstrapping plate line segment drivers

Bootstrapping circuit utilizing a ferroelectric capacitor

Memory cell configuration for a 1T/1C ferroelectric memory