Provided are a method, system, and program for managing multiple resources in a system at a service level, including at least one host, network, and a storage space comprised of at least one storage system that each host is capable of accessing over the network. A plurality of service level parameters are measured and monitored indicating a state of the resources in the system. A determination is made of values for the service level parameters and whether the service level parameter values satisfy predetermined service level thresholds. Indication is made as to whether the service level parameter values satisfy the predetermined service thresholds. A determination is made of a modification to one or more resource deployments or configurations if the value for the service level parameter for the resource does not satisfy the predetermined service level thresholds.

Method, system, and program for determining a modification of a system resource configuration

An electric probing-test machine comprises a probe card having a plurality of probes contacted with chips of a semiconductor wafer and serving to apply test signal to a tester which judges whether circuits on the chips of the wafer are correct or deficient, a main chuck for holding the wafer at a test temperature, a system for cooling the main chuck, and a controller for controlling the cooling system. The main chuck includes a chuck top contacted directly with the wafer, a jacket arranged to conduct heat exchange relative to the chuck top, and a temperature sensor for detecting the temperature of the chuck top. The cooling system has a pump for supplying a coolant from a reservoir to the jacket. Responsive to temperature information detected by the temperature sensor, the amount of the coolant supplied from the reservoir to the jacket is controlled by the controller to thereby control the temperature of the chuck top.

Electric probing-test machine having a cooling system

A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.

Cooling system for an electronic circuit device

A semiconductor device handler with a temperature controlled test area. Temperature control is provided in part through the use of temperature controlled air forced across the test area. For heating the test area, electrical resistance heaters are uniformly distributed through the test area and are controlled to provide the desired temperature. The handler has a close pitch between adjacent sockets such that it is not possible to distribute refrigeration elements over the test area. Instead, a refrigeration element is placed on one side of the test area. To prevent formation of an undesirable temperature gradient, heat is injected at a specific location in the test area.

Method and apparatus for temperature control of a semiconductor electrical-test contractor assembly

An apparatus for spreading the heat generated by a semiconductor device. In one embodiment, a semiconductor device, such as a CPU, is mounted to a package substrate. A cover is attached to the package substrate creating a space therebetween for accommodating the semiconductor device. The package cover includes an external top surface and an external bottom surface and an inner cavity that comprises a heat pipe. The semiconductor device is thermally coupled to the bottom external surface of the cover.

Heat pipe lid for electronic packages

A gas encapsulated cooling module wherein at least one semiconductor chip to be cooled is supported on a substrate portion of the module the provision of a heat sink stud having a planar surface in thermal contact with a planar surface of the chip to be cooled, said stud being supported by a resilient thermally conductive bellow-like structure, whereby the planar surface of the stud is maintained in intimate thermal contact with the planar surface of the chip.

Gas encapsulated cooling module

The invention relates to apparatus for the testing of high circuit density devices fabricated by large scale integration techniques. More specifically, the invention is directed to a test fixture used in a test system for determining the merit or electrical integrity of small semiconductor chips, diced from a semiconductor wafer having a large number of chips. Each chip being a high circuit density device, e.g., a small monolithic semiconductor structure having a large number of closely spaced circuits thereon and therein.

Test fixture for use in a high speed electronic semiconductor chip test system

In einer Kapselanordnung zum Kuhlen von Halbleiterchips (10) ist auf jedem Chip (10) ein warmeabfuhrender Bolzen (22) positioniert. In a capsule arrangement for cooling of semiconductor chips (10) is positioned on each chip (10) a heat dissipating pin (22). Der Bolzen (22) verlauft innerhalb eines federnden Balges (21). The bolt (22) extends inside of a resilient bellows (21). Das chipfeme Ende des Balges (21) ist in einer Aussparung (20) der Kapselanordnung fixiert. The chipfeme end of the bellows (21) is fixed in a recess (20) of the capsule assembly. Zwischen den Chips (10) und dem Raum ausserhalb des Balges (21), ist ein Kuhlmittel I und innerhalb des Balges (21) ist ein weiteres Kuhlmittel II vorgesehen. Between the chip (10) and the space outside of the bellows (21) is a refrigerant I and within the bellows (21) is provided a further coolant II. Beide Kuhlmittel I und II konnen gleich sein, vorzugsweise flussiges Helium oder ungleich sein, wenn der Raum innerhalb des Balges (21) an ein Kuhlflussigkeitssystem angeschlossen ist, welches von dem Kuhlmittel I ausserhalb des Balges separiert ist. Both coolant I and II may be the same, preferably liquid helium or unequal, when the space within the bellows (21) is connected to a coolant system which is separated from the coolant I outside of the bellows.

William Joseph Scanlon

Papers

Gas encapsulated cooling module

Test fixture for use in a high speed electronic semiconductor chip test system

Capsule for cooling semiconductor chips

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