An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

Part I: Background and Fundamentals Introduction, Mohamed Gad-el-Hak, University of Notre Dame Scaling of Micromechanical Devices, William Trimmer, Standard MEMS, Inc., and Robert H. Stroud, Aerospace Corporation Mechanical Properties of MEMS Materials, William N. Sharpe, Jr., Johns Hopkins University Flow Physics, Mohamed Gad-el-Hak, University of Notre Dame Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains, Robert M. Kirby and George Em Karniadakis, Brown University, and Oleg Mikulchenko and Kartikeya Mayaram, Oregon State University Liquid Flows in Microchannels, Kendra V. Sharp and Ronald J. Adrian, University of Illinois at Urbana-Champaign, Juan G. Santiago and Joshua I. Molho, Stanford University Burnett Simulations of Flows in Microdevices, Ramesh K. Agarwal and Keon-Young Yun, Wichita State University Molecular-Based Microfluidic Simulation Models, Ali Beskok, Texas A&M University Lubrication in MEMS, Kenneth S. Breuer, Brown University Physics of Thin Liquid Films, Alexander Oron, Technion, Israel Bubble/Drop Transport in Microchannels, Hsueh-Chia Chang, University of Notre Dame Fundamentals of Control Theory, Bill Goodwine, University of Notre Dame Model-Based Flow Control for Distributed Architectures, Thomas R. Bewley, University of California, San Diego Soft Computing in Control, Mihir Sen and Bill Goodwine, University of Notre Dame Part II: Design and Fabrication Materials for Microelectromechanical Systems Christian A. Zorman and Mehran Mehregany, Case Western Reserve University MEMS Fabrication, Marc J. Madou, Nanogen, Inc. LIGA and Other Replication Techniques, Marc J. Madou, Nanogen, Inc. X-Ray-Based Fabrication, Todd Christenson, Sandia National Laboratories Electrochemical Fabrication (EFAB), Adam L. Cohen, MEMGen Corporation Fabrication and Characterization of Single-Crystal Silicon Carbide MEMS, Robert S. Okojie, NASA Glenn Research Center Deep Reactive Ion Etching for Bulk Micromachining of Silicon Carbide, Glenn M. Beheim, NASA Glenn Research Center Microfabricated Chemical Sensors for Aerospace Applications, Gary W. Hunter, NASA Glenn Research Center, Chung-Chiun Liu, Case Western Reserve University, and Darby B. Makel, Makel Engineering, Inc. Packaging of Harsh-Environment MEMS Devices, Liang-Yu Chen and Jih-Fen Lei, NASA Glenn Research Center Part III: Applications of MEMS Inertial Sensors, Paul L. Bergstrom, Michigan Technological University, and Gary G. Li, OMM, Inc. Micromachined Pressure Sensors, Jae-Sung Park, Chester Wilson, and Yogesh B. Gianchandani, University of Wisconsin-Madison Sensors and Actuators for Turbulent Flows. Lennart Loefdahl, Chalmers University of Technology, and Mohamed Gad-el-Hak, University of Notre Dame Surface-Micromachined Mechanisms, Andrew D. Oliver and David W. Plummer, Sandia National Laboratories Microrobotics Thorbjoern Ebefors and Goeran Stemme, Royal Institute of Technology, Sweden Microscale Vacuum Pumps, E. Phillip Muntz, University of Southern California, and Stephen E. Vargo, SiWave, Inc. Microdroplet Generators. Fan-Gang Tseng, National Tsing Hua University, Taiwan Micro Heat Pipes and Micro Heat Spreaders, G. P. "Bud" Peterson, Rensselaer Polytechnic Institute Microchannel Heat Sinks, Yitshak Zohar, Hong Kong University of Science and Technology Flow Control, Mohamed Gad-el-Hak, University of Notre Dame) Part IV: The Future Reactive Control for Skin-Friction Reduction, Haecheon Choi, Seoul National University Towards MEMS Autonomous Control of Free-Shear Flows, Ahmed Naguib, Michigan State University Fabrication Technologies for Nanoelectromechanical Systems, Gary H. Bernstein, Holly V. Goodson, and Gregory L. Snider, University of Notre Dame Index

The MEMS Handbook

INTRODUCTION MEMS and NEMS A Capsule History of MEMS and NEMS Dimensional Analysis and Scaling Exercises A REFRESHER ON CONTINUUM MECHANICS Introduction The Continuum Hypothesis Heat Conduction Elasticity Linear Thermoelasticity Fluid Dynamics Electromagnetism Numerical Methods for Continuum Mechanics SMALL IS DIFFERENT The Backyard Scaling Systems Exercises THERMALLY DRIVEN SYSTEMS Introduction Thermally Driven Devices From PDE to ODE: Lumped Models Joule Heating of a Cylinder Analysis of Thermal Data Storage Exercises MODELING ELASTIC STRUCTURES Introduction Examples of Elastic Structures in MEMS/NEMS The Mass on a Spring Membranes Beams Plates The Capacitive Pressure Sensor Exercises MODELING COUPLED THERMAL-ELASTIC SYSTEMS Introduction Devices and Phenomena in Thermal-Elastic Systems Modeling Thermopneumatic Systems The Thermoelastic Rod Revisited Modeling Thermoelastic V-Beam Actuators Modeling Thermal Bimorph Actuators Modeling Bimetallic Thermal Actuators Exercises MODELING ELECTROSTATIC-ELASTIC SYSTEMS Introduction Devices Using Electrostatic Actuation The Mass-Spring Model Modeling General Electrostatic-Elastic Systems Electrostatic-Elastic Systems - Membrane Theory Electrostatic-Elastic Systems - Beam and Plate Theory Analysis of Capacitive Control Schemes Exercises MODELING MAGNETICALLY ACTUATED SYSTEMS Introduction Magnetically Driven Devices Mass-Spring Models A Simple Membrane Micropump Model A Small-Aspect Ratio Model Exercises MICROFLUIDICS Introduction Microfluidic Devices More Fluidic Scaling Modeling Squeeze Film Damping Exercises BEYOND CONTINUUM THEORY Introduction Limits of Contiuum Mechanics Devices and Systems Beyond Continuum Theory Exercises REFERENCES APPENDICES Mathematical Results Physical Constants INDEX Each chapter also contains Related Reading and Notes sections.

Modeling MEMS and NEMS

Since the discovery of piezoresistivity in silicon in the mid 1950s, silicon-based pressure sensors have been widely produced Micromachining technology has greatly benefited from the success of the integrated circuit industry, borrowing materials, processes, and toolsets Because of this, microelectromechanical systems (MEMS) are now poised to capture large segments of existing sensor markets and to catalyse the development of new markets Given the emerging importance of MEMS, it is instructive to review the history of micromachined pressure sensors, and to examine new developments in the field Pressure sensors will be the focus of this paper, starting from metal diaphragm sensors with bonded silicon strain gauges, and moving to present developments of surface-micromachined, optical, resonant, and smart pressure sensors Considerations for diaphragm design will be discussed in detail, as well as additional considerations for capacitive and piezoresistive devices Results from surface-micromachined pressure sensors developed by the authors will be presented Finally, advantages of micromachined sensors will be discussed

https://digital.library.unt.edu/ark:/67531/metadc680263/m2/1/high_res_d/459399.pdf

Micromachined pressure sensors: review and recent developments

This Review describes the state-of-the-art of wearable electronics (smart textiles). The unique and promising advantages of smart electronic textiles are highlighted by comparing them with the conventional planar counterparts. The main kinds of smart electronic textiles based on different functionalities, namely the generation, storage, and utilization of electricity, are then discussed with an emphasis on the use of functional materials. The remaining challenges are summarized together with important new directions to provide some useful clues for the future development of smart electronic textiles.

Smart Electronic Textiles.

A microelectromechanical (MEM) capacitance pressure sensor integrated with electronic circuitry on a common substrate and a method for forming such a device are disclosed. The MEM capacitance pressure sensor includes a capacitance pressure sensor formed at least partially in a cavity etched below the surface of a silicon substrate and adjacent circuitry (CMOS, BiCMOS, or bipolar circuitry) formed on the substrate. By forming the capacitance pressure sensor in the cavity, the substrate can be planarized (e.g. by chemical-mechanical polishing) so that a standard set of integrated circuit processing steps can be used to form the electronic circuitry (e.g. using an aluminum or aluminum-alloy interconnect metallization).

Capacitance pressure sensor

Unlike IC packaging, MEMS dice must interface with the environment for sensing, interconnection, and/or actuation. MEMS packaging is application specific and the package provides the physical interface of the MEMS device to the environment. In the case of a fluid mass flow control sensor, the medium flows into and out of the package. This type of packaging is referred to as media compatible packaging. Harsh environments may create different challenges for the packaging of MEMS. In addition to challenges related to the MEMS chip environment and interfacing with that environment, challenges also exist inside the MEMS package, such as die handling, die attach, interfacial stress, and outgassing. These new challenges in MEMS packaging need immediate research and development efforts. To date, most of what is known about MEMS packaging remain proprietary secrets and published literature is scarce. The challenges of MEMS packaging have been known for some time, but little open research has been done to collect data and work toward meeting these challenges. A disproportionality exists between money spent on MEMS packaging and time spent researching MEMS packaging. Currently, the cost of MEMS packaging typically accounts for 75% or more of the device sale price. MEMS packaging is already far behind the capabilities of MEMS designers, and it is the purpose of this paper to share the challenges of MEMS packaging and create an awareness and an interest in MEMS packaging within the packaging community.

/pdf/challenges-in-the-packaging-of-mems-exsbscv0kn.pdf

Challenges in the packaging of MEMS

The burgeoning new technology of Micro-Electro-Mechanical Systems (MEMS) shows great promise in the weapons arena. We can now conceive of micro-gyros, micro-surety systems, and micro-navigators that are extremely small and inexpensive. Do we want to use this new technology in critical applications such as nuclear weapons? This question drove us to understand the reliability and failure mechanisms of silicon surface-micromachined MEMS. Development of a testing infrastructure was a crucial step to perform reliability experiments on MEMS devices and will be reported here. In addition, reliability test structures have been designed and characterized. Many experiments were performed to investigate failure modes and specifically those in different environments (humidity, temperature, shock, vibration, and storage). A predictive reliability model for wear of rubbing surfaces in microengines was developed. The root causes of failure for operating and non-operating MEMS are discussed. The major failure mechanism for operating MEMS was wear of the polysilicon rubbing surfaces. Reliability design rules for future MEMS devices are established.

/pdf/mems-reliability-infrastructure-test-structures-experiments-4u586sx6i4.pdf

MEMS Reliability: Infrastructure, Test Structures, Experiments, and Failure Modes

Humidity is shown to be a strong factor in the wear of rubbing surfaces in polysilicon micromachines. We demonstrate that very low humidity can lead to very high wear without a significant change in reliability. We show that the volume of wear debris generated is a function of the humidity in an air environment. As the humidity decreases, the wear debris generated increases. For the higher humidity levels, the formation of surface hydroxides may act as a lubricant. The dominant failure mechanism has been identified as wear. The wear debris has been identified as amorphous oxidized silicon. Large slivers (approximately 1 /spl mu/m in length) of debris observed at the low humidity level were also amorphous oxidized silicon. Using transmission electron microscopy (TEM), we observed that the wear debris forms spherical and rod-like shapes. We compared two surface treatment processes: a fluorinated silane chain (FTS) process and supercritical CO/sub 2/ dried (SCCO/sub 2/) process. The microengines using the SCCO/sub 2/ process were found to be less reliable than those released with the FTS process under two humidity levels.

/pdf/the-effect-of-humidity-on-the-reliability-of-a-surface-3v4an1lqvi.pdf

William P. Eaton

Papers

Micromachined pressure sensors: review and recent developments

Capacitance pressure sensor

Challenges in the packaging of MEMS

MEMS Reliability: Infrastructure, Test Structures, Experiments, and Failure Modes

The effect of humidity on the reliability of a surface micromachined microengine