An electroless gold plating solution comprising a thiosulfato gold(I) complex, a thiosulfate, thiourea, a pH regulator and a stabilizer. The electroless gold plating solution shows a plating rate and a plating solution stability comparable to those of conventional gold plating solutions containing cyanide ions, and requires a smaller amount of reducing agent to be used therein. Further, the electroless gold plating solution is safe because it does not contain cyanide ions.

Electroless gold plating solution

Disclosed is an electroplating solution for the deposition of silver; said solution containing silver in the form of a complex of silver with hydantoin or a substituted hydantoin compound; said solution also containing an excess of the hydantoin or substituted hydantoin compound employed, together with an effective quantity of a nonprecipitating electrolyte salt, and also an effective quantity of 2,2′ dipyridyl for the purpose of obtaining a mirror-bright to brilliant deposit.

Non-cyanide silver plating bath composition

PROBLEM TO BE SOLVED: To provide a plating bath and a method for improving deposition of a metal on a substrate by including heteroatom-containing organic compounds in the plating bath that prevent the degradation of plating bath components. SOLUTION: The metal plating bath prevents degradation of an additive, by adding the heteroatom compounds that prevent or inhibit the consumption of metal plating bath additives, into the plating bath. The additive consumption inhibiting compounds causes a plating bath having a long life, and a uniform, high brightness metal layer with good physical-mechanical properties on a substrate. The method for plating the metal involves passing current through two electrodes immersed in the bath which contains a dissolved plating metal, the bath additive, and/or further the additive consumption inhibiting compounds, to metal-plate the substrate to a desired thickness. COPYRIGHT: (C)2003,JPO

Plating bath and method for depositing metal layer on substrate

Cyanogen-free silver-plating electroplating liquid containing auxiliary complexing agent

PROBLEM TO BE SOLVED: To provide a method of efficiently depositing an electroless gold-plating film of a plating film laminate on which an electroless nickel plating film, an electroless palladium plating film and an electroless gold-plating film are deposited. SOLUTION: A part of or the entire of an electroless gold-plating film of a plating film laminate on which an electroless nickel plating film, an electroless palladium plating film and an electroless gold-plating film are deposited, is formed by the electroless gold plating using an electroless gold plating bath containing a water-soluble gold compound, a complexing agent, a formaldehyde and/or formaldehyde bisulfite additive, and an amine compound expressed by a general formula R 1 -NH-C 2 H 4 -NH-R 2 or R 3 -(CH 2 -NH-C 2 H 4 -NH-CH 2 ) n -R 4 . In this method, two kinds of baths of a flash gold plating bath and a heavy-deposition gold plating bath need not be prepared. The gold-plated film of various kinds of thickness suitable for soldering or wire bonding can be deposited by one kind of gold plating bath. In particular, the electroless gold plating film of the thickness of ≥0.15 μm can be efficiently and effectively deposited in one process by using one kind of plating bath, the process can be simplified favorably in the cost aspect. COPYRIGHT: (C)2009,JPO&INPIT

Electroless gold-plating method and electronic component

PROBLEM TO BE SOLVED: To provide an electroless gold plating solution which can form a good plating film on an electroless nickel plating film and can minimize the corrosion of the nickel plating film. SOLUTION: The electroless gold plating film contains (i) a water-soluble gold compound, (ii) a complexing agent, (iii) at least one component selected from the group consisting of acids including chalcogen elements of an oxidation number 2 to 4 and their salts, (iv) at least one component selected from the group consisting of hydrazine and its derivative, and (v) a compound having an ethylene group including ≥2 imono groups within the molecule and having a substituent in some cases between the nitrogen atoms of the imino group. COPYRIGHT: (C)2004,JPO

PROBLEM TO BE SOLVED: To provide a non-cyanide silver electroplating liquid which does not contain a cyanide compd., has good stability and can form a silver plating film having excellent adhesion property, appearance, etc. SOLUTION: This non-cyanide silver electroplating liquid contains a soluble silver compd. and pyridines as an effective component and further, if necessary, it compounds at least one kind of an additive selected from soluble metal compds., nonion surfactants, polyamine compds., cyclic nitrogen-contg. compds., sulfur compds. and amino acid derivs. A silver plating method is carried out by electrolyzing a material to be plated as a cathode in the non-cyanide silver electroplating liquid.

Non-cyanide silver electroplating liquid

PROBLEM TO BE SOLVED: To provide a composition for pretreatment for electroless palladium plating where, even in the case an electroless palladium plating liquid including impurities such as copper is used, a palladium plating film can be stably precipitated over a nickel film. SOLUTION: Disclosed is an activation composition on a nickel surface for performing electroless palladium plating to the surface of nickel, which is composed of an aqueous solution comprising a palladium compound and hydrazines. Also disclosed is a method for forming a plating film onto a printed circuit board comprising a process where an electroless nickel plating film is formed on the conductor part of a printed circuit board, thereafter, activation treatment for the nickel plating film is performed using the above activation composition, and subsequently, electroless palladium plating is performed. COPYRIGHT: (C)2008,JPO&INPIT

Activation composition for electroless palladium plating

PROBLEM TO BE SOLVED: To provide a new pretreatment liquid useful for forming a palladium or palladium alloy plating film with an excellent deposition property and an excellent covering property in performing electroless palladium plating or electroless palladium alloy plating on various metal material such as an electroless nickel film or cupper material, and an electroless palladium or palladium alloy plating method using the pretreatment liquid.SOLUTION: An activation liquid for pretreatment of electroless palladium plating or electroless palladium alloy plating, which consists of aqueous solution including a reducer as an active ingredient. There is also provided an electroless palladium plating or electroless palladium alloy plating method in which the activation liquid is brought into contact with an object to be treated, then the electroless palladium plating or electroless palladium alloy plating is performed without being washed.

Activation liquid for pretreatment of electroless palladium plating or electroless palladium alloy plating

PROBLEM TO BE SOLVED: To provide an activating liquid which is used when forming a displacement-plated gold film on a plated nickel film, and imparts a displacement-plated gold film having stable soldering joint strength and stable wire bonding strength. SOLUTION: The activating composition for the pretreatment of displacing-precipitation-type gold plating is an aqueous solution comprising: (i) a complexing agent for a nickel ion; (ii) at least one component selected from the group consisting of an acid containing a chalcogen element having an oxidation number of 2 to 4 and a salt thereof; (iii) at least one component selected from the group consisting of hydrazine and a hydrazine derivative; (iv) a compound containing two or more nitrogen-containing groups selected from the group consisting of an amino group and an imino group, and having an ethylene group which may have a substituent, between nitrogen atoms of the nitrogen-containing group; and (v) a compound containing a metallic element having an oxidation-reduction potential between those of nickel and gold. COPYRIGHT: (C)2006,JPO&NCIPI

喜美子工藤

Papers

Electroless gold plating solution

Non-cyanide silver electroplating liquid

Activation composition for electroless palladium plating

Activation liquid for pretreatment of electroless palladium plating or electroless palladium alloy plating

Activating composition for pretreatment of displacing-precipitation-type gold plating

喜美子 工藤

Papers

Electroless gold plating solution

Non-cyanide silver electroplating liquid

Activation composition for electroless palladium plating

Activation liquid for pretreatment of electroless palladium plating or electroless palladium alloy plating

Activating composition for pretreatment of displacing-precipitation-type gold plating

喜美子工藤