Enhancement of light extraction from light emitting diodes

A monolithic high-resolution (individual pixel size 300times300 mum2) active matrix (AM) programmed 8times8 micro-LED array was fabricated using flip-chip technology. The display was composed of an AM panel and a LED microarray. The AM panel included driving circuits composed of p-type MOS transistors for each pixel. The n-electrodes of the LED pixels in the microarray were connected together, and the p-electrodes were connected to individual outputs of the driving circuits on the AM panel. Using flip-chip technology, the LED microarray was then flipped onto the AM panel to create a microdisplay.

Monolithic LED Microdisplay on Active Matrix Substrate Using Flip-Chip Technology

A nitride-based high-power flip-chip (FC) light-emitting diode (LED) with a double-side patterned sapphire substrate (PSS) was proposed and realized. Under 350-mA current injection, it was found that forward voltages were 3.24, 3.26, and 3.25 V for the conventional FC LED, FC LED prepared on PSS, and FC LED with double-side PSS, respectively. It was found that the 350-mA LED output powers were 79.3, 98.1, and 121.5 mW for the conventional FC LED, FC LED prepared on PSS, and FC LED with double-side PSS, respectively. In other words, we can enhance the electroluminescence intensity by 53% without increasing operation voltage of the fabricated LED

Nitride-Based High-Power Flip-Chip LED With Double-Side Patterned Sapphire Substrate

Staggered quantum well structures are studied to eliminate the influence of polarization-induced electrostatic field upon the optical performance of blue InGaN light-emitting diodes (LEDs). Blue InGaN LEDs with various staggered quantum wells which vary in their indium compositions and quantum well width are theoretically studied and compared by using the APSYS simulation program. According to the simulation results, the best optical characteristic is obtained when the staggered quantum well is designed as In0.20Ga0.80N (1.4 nm)–In0.26Ga0.74N (1.6 nm) for blue LEDs. Superiority of this novelty design is on the strength of its enhanced overlap of electron and hole wave functions, uniform distribution of holes, and suppressed electron leakage in the LED device.

https://ir.nctu.edu.tw:443/bitstream/11536/32192/1/000282646400007.pdf

Improvement in output power of a 460 nm InGaN light-emitting diode using staggered quantum well

https://iopscience.iop.org/article/10.1149/2.0111704jss/pdf

Review—Group III-Nitride-Based Ultraviolet Light-Emitting Diodes: Ways of Increasing External Quantum Efficiency

Nitride-based flip-chip indium-tin-oxide (ITO) light-emitting diodes (LEDs) were successfully fabricated. It was found that the forward voltage and the 20 mA output power of the flip-chip ITO LED were 3.32 V and 14.5 mW, respectively. Although the operation voltage of such a flip-chip ITO LED was slightly larger, it was found that its output power was much larger than those of conventional nonflip-chip LEDs. It was also found that flip-chip ITO LEDs were more reliable.

Nitride-based flip-chip ITO LEDs

Nitride-based flip-chip light-emitting diodes (LEDs) with various transparent ohmic contacts and reflective mirrors were fabricated. At 470 nm, it was found that Ni could provide 92% transmittance while Ag could provide 92.4% reflectively. It was also found that the 20-mA forward voltages measured from LEDs with Ni+Ag, Ni+Al, and Ni+Pt were 3.15, 3.29, and 3.18 V while the output powers were 16, 13.3, and 11.6 mW, respectively. Furthermore, it was found that lifetimes of the fabricated flip-chip LEDs were good

Nitride-based flip-chip LEDs with transparent Ohmic contacts and reflective mirrors

The properties of indium-tin-oxide (ITO)/Ni films as transparent ohmic contacts of nitride-based flip chip (FC) light emitting diodes (LEDs) were studied. It was found that 300degC rapid thermal annealed (RTA) ITO(15 nm)/Ni(1 nm) could provide good electrical and optical properties for FC LED applications. It was also found that 20-mA operation voltage and output power of the 465-nm FC LEDs with ITO/Ni/Ag reflective mirror were 3.16 V and 21 mW, respectively. Furthermore, it was found that output intensity of the proposed LED only decayed by 5% after 1200 h under 30-mA current injection at room temperature.

Y.P. Hsu

Papers

Nitride-based flip-chip ITO LEDs

Nitride-based flip-chip LEDs with transparent Ohmic contacts and reflective mirrors

Highly Reliable High-Brightness GaN-Based Flip Chip LEDs