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Yang-Tse Cheng

Researcher at University of Kentucky

Publications -  282
Citations -  16004

Yang-Tse Cheng is an academic researcher from University of Kentucky. The author has contributed to research in topics: Indentation & Thin film. The author has an hindex of 62, co-authored 270 publications receiving 14131 citations. Previous affiliations of Yang-Tse Cheng include General Motors & University of Windsor.

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Stress-induced growth of bismuth nanowires

TL;DR: In this article, a method of making nanowires of bismuth (Bi) with diameters ranging from 30 to 200 nm and lengths up to several millimeters is described.
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Correlation between cohesive energy and mixing rate in ion mixing of metallic bilayers

TL;DR: In this paper, a model based on the thermal spike concept is proposed to explain the behavior of mixing rates in metallic bilayers, which leads to a general expression describing mixing rates.
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Scaling relationships in indentation of power-law creep solids using self-similar indenters

TL;DR: In this article, the authors used dimensional analysis to derive scaling relationships for self-similar indenters indenting solids that exhibit power-law creep and identified the parameter that represents the indentation strain rate, which was applied to several types of indentation creep experiment with constant displacement rate, constant loading rate or constant ratio of loading rate over load.
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Solvent-free dry powder coating process for low-cost manufacturing of LiNi1/3Mn1/3Co1/3O2 cathodes in lithium-ion batteries

TL;DR: In this article, a solvent-free dry powder coating process was proposed for making LiNi 1/3 Mn 1/1/3 Co/3 O 2 (NMC) positive electrodes in lithium-ion batteries, which can eliminate volatile organic compound emission and reduce thermal curing time from hours to minutes.
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A variable temperature mechanical analysis of ZDDP-derived antiwear films formed on 52100 steel

TL;DR: In this paper, the elastic modulus of the antiwear films at elevated temperatures relevant to the automobile operating conditions (T ≥ 200°C) was measured using focused ion beam (FIB) milling.