Y
Yong Jiun Lee
Researcher at National University of Singapore
Publications - 9
Citations - 231
Yong Jiun Lee is an academic researcher from National University of Singapore. The author has contributed to research in topics: Heat sink & Heat transfer. The author has an hindex of 5, co-authored 9 publications receiving 171 citations.
Papers
More filters
Journal ArticleDOI
Fluid flow and heat transfer investigations on enhanced microchannel heat sink using oblique fins with parametric study
TL;DR: In this article, an enhanced microchannel heat sink with sectional oblique fin is used to modulate the flow in contrast to continuous straight fin, which resulted in better heat transfer and a comparable pressure drop.
Journal ArticleDOI
Hotspot Mitigating With Obliquely Finned Microchannel Heat Sink—An Experimental Study
Abstract: Sectional oblique fins are employed, in contrast to continuous fins, in order to modulate the flow in a microchannel heat sink. The breakage of continuous fin into oblique sections leads to reinitialization of boundary layers and generation of secondary flows that significantly enhance the cooling performance of the heat sink. In addition, an oblique finned microchannel heat sink has the flexibility to tailor local heat transfer performance by varying its oblique fin pitch. Clusters of oblique fins at higher density can be created in order to promote a greater degree of boundary layer redevelopment and secondary flow generation to provide more effective cooling at the high heat-flux region. Thus, the variation of oblique fin pitch can be exploited for hotspot mitigation. Experimental studies of a silicon chip with two hotspot scenarios show that the temperature hike and the temperature difference for the enhanced microchannel heat sink with variable pitch are reduced by as much as 17.1 °C and 15.4 °C, respectively. As a result, temperature distribution across the silicon chip is more uniform. In addition, the associated pressure drop penalty is much smaller than the achieved heat transfer enhancement, rendering it as an effective hotspot mitigating strategy for the single-phase microchannel heat sink.
Journal ArticleDOI
Investigations on the Influence of Flow Migration on Flow and Heat Transfer in Oblique Fin Microchannel Array
Patent
Enhanced heat sink
Poh Seng Lee,Yong Jiun Lee +1 more
TL;DR: A heat sink device for dissipating heat from an electronic component mounted on a circuit is defined in this paper, where an inlet for receiving a fluid, an outlet for venting said fluid, and a heat dissipation zone intermediate the inlet and outlet.
Patent
An enhanced heat sink
Poh Seng Lee,Yong Jiun Lee +1 more
TL;DR: A heat sink device for dissipating heat from an electronic component mounted there to, the device comprising: an inlet for receiving a fluid; an outlet for venting said fluid; a heat dissipation zone intermediate the inlet and outlet; said zone including a plurality of transverse channels and an oblique channel extending between adjacent transverse channel as discussed by the authors.