A heat exchanger includes an extruded base member having a planar central portion and spaced-apart cooling fins extending from one side of the planar central portion. A cross-over member is located on the other side of the planar central portion and includes a plurality of spaced-apart flow channels that communicate with inlet and outlet manifolds formed in the base member or the cross-over member, or partially in both the base member and the cross-over member.

Finned plate heat exchanger

A heat exchanger (17) for an electronic heat pump (11) includes a thermally conductive base plate (18) having first and second surfaces, the first surface being flat and adapted to make intimate surface contact with a surface of the electronic heat pump and the second surface being obverse to the first surface and supporting an array of thermally conductive fins (21). The adjacent fins (21) define there between a plurality of micro channels.

Heat exchanger for an electronic heat pump

A computer system includes an enclosure, a backplane within the enclosure, a replaceable unit releasably connected to the backplane, an air cooling system configured to create an air flow along the replaceable unit and an air flow blocking system. The air flow blocking system includes a first member coupled to the enclosure and a second member coupled to the replaceable unit. The first member and the second member interact to at least partially block air flow along the replaceable unit based upon at least one characteristic of the replaceable unit.

Computer cooling system and method

Methods and apparatuses for cooling a device are disclosed The device may be an electrical or electronic component that includes an integrated circuit or embedded control The apparatus employs a fluid that near or above its critical pressure and at least one heat exchanger At least two configurations are disclosed: one with a pump and another without a pump

Methods and apparatuses for electronics cooling

A heat sink fin assembly of the corrugated type for cooling an LSI package comprises a flat base plate and a heat dissipating member made of a thin metal sheet having convex and concave portions which are comprised of a repeated series of side wall portions, top portions, and bottom portions. The base plate and the heat dissipating member are integrated with each other by bonding.

Heat sink fin assembly for cooling an LSI package

An improved heat sink apparatus that utilizes either natural or forced convection to transfer heat generated by a high temperature medium to a lower temperature medium or converts cold energy from a low temperature fluid or solid medium to a different or higher temperature stage or condition of energy. The apparatus includes a thermally conductive base plate, a plurality of thick corrugated finned assembly components constructed and arranged in abutting relationship and offset from each other so as to cause a circuitous path of fluid flow therethrough. The apparatus also may include the base plate and a plurality of thick, sawtooth shaped, or segmented fins mounted thereon. The length of fluid travel from one finned component to an abutting finned component along the heat transfer surface is controlled in order to prevent development of thermal boundary layer on the inner surface of the finned assembly components.

Yong Nak Lee

Papers

Heat sink apparatus